View factory profile →Hunan / Guangdong
Aoshikang organizes its offering around automotive electronics, servers and storage, telecommunications and digital energy. Its technical-support page describes backdrilling, controlled impedance and mixed-material processes. A separate market page includes research and application statements, which are kept outside the numerical filter.
MANUFACTURING FOCUS- Server & storage PCB
- Automotive electronics
- RF & digital energy
2 original sources → View factory profile →Meizhou, Guangdong
Bomin describes an integrated PCB, components and solutions business. Its listed board families range from HDI and high-multilayer circuits to heavy-copper, metal-core, flexible and ceramic products. The company identifies production bases in Shenzhen, Meizhou and Jiangsu.
MANUFACTURING FOCUS- HDI & high-multilayer
- Heavy copper & metal core
- Rigid-flex & ceramic substrates
3 original sources → CEE Technology
View factory profile →Huizhou, Guangdong
CEE describes a PCB portfolio covering rigid multilayer, high-layer-count, HDI, flexible circuits and rigid-flex. Its published quality workflow includes APQP, PPAP, FMEA and statistical process control. These documents describe the company system; they do not establish approval of a buyer’s particular part.
View factory profile →Zhongshan, Guangdong
Ellington supplies PCB applications spanning automotive, power, industrial control, medical, computing and communications. Its factory page distinguishes Zhongshan Plant 1 from Plant 2: the former includes metal-based boards, while the latter lists standard high-layer and HDI production.
View factory profile →Shenzhen, Guangdong
Fastprint groups its offering into PCB, IC substrates, flexible circuits and semiconductor test boards. The PCB section covers HDI, high-frequency and high-speed products. Its company page describes manufacturing campuses in Guangzhou, Yixing and the UK, with Shenzhen as headquarters.
MANUFACTURING FOCUS- HDI & high-speed PCB
- Flexible circuits
- Semiconductor test boards
3 original sources → Guangde New Triunion
View factory profile →Guangde, Anhui
New Triunion’s official website identifies a Guangde PCB production base established in 2011. Its product portfolio includes single-sided, double-sided, multilayer and silver-through-hole boards. The contact page separates the Guangde manufacturing entity from the Hangzhou company, so the directory attaches this profile to Guangde.
MANUFACTURING FOCUS- Single- & double-sided PCB
- Multilayer PCB
- Silver-through-hole PCB
2 original sources → View factory profile →Shenzhen, Guangdong
Hitech describes branch factories for prototypes, small- and medium-volume fabrication, flexible circuits and assembly. Its rigid-board table separately identifies mechanical and laser finished-hole limits. Other tables cover flexible, metal-core and ceramic substrates; those figures are not merged into the rigid profile.
View factory profile →Shenzhen, Guangdong
JLCPCB combines online bare-board manufacturing, component sourcing and assembly. Its rigid-board capability page defines limits by layer count, copper weight and material. The profile below isolates impedance-controlled FR-4 multilayers, keeping material-specific and heavy-copper exceptions in the source sheet.
MANUFACTURING FOCUS- Prototype & small batches
- FR-4 multilayer PCB
- Component sourcing & assembly
2 original sources → Kinwong Electronic
View factory profile →Shenzhen, Guangdong
Kinwong publishes rigid, flexible, metal-base, HDI and specialty PCB offerings. Its company profile identifies manufacturing bases across Guangdong and Jiangxi as well as Thailand. The HDI page distinguishes mSAP from tenting process limits, so the directory keeps those methods explicit.
MANUFACTURING FOCUS- HDI & substrate-like PCB
- Automotive electronics
- Flex & metal-base PCB
4 original sources → View factory profile →China
NextPCB publishes separate standard and advanced manufacturing services alongside assembly. Its standard process table specifies different routing rules for half-ounce inner copper, one-ounce outer copper and heavier copper. This profile retains the one-ounce outer-layer conditions and the listed controlled-impedance layer choices.
