View factory profile →Zhuhai, Guangdong, China
Zhuhai Founder Technology High Density Electronic Co., Ltd. is the legal entity named for IFOUND PCB’s F3 HDI campus at Qianwu Founder Science Park. This profile examines two separate original group catalogue constructions: a 12-layer 4+4+4 optical-module HDI board with TU883-SP, 0.13 mm bonding-pad pitch and ENEPIG+G/F, and an 18-layer M4S Smart NIC with back-drill, HDI, skip-via and POFV processes. Their original photographs and parameters stay with their corresponding examples. The review explains finish-zone and bonding acceptance, drill-bit versus finished-hole definitions, back-drill residual-stub requirements, and sample-to-volume plant allocation. The parent issuer’s 2025 report, a January 2026 Ministry of Commerce tender record and the national standards platform cross-check the entity and dated development activity; they do not assign these two catalogue boards to F3.
MANUFACTURING FOCUS- Zhuhai F3 HDI campus
- Optical-module bonding-pad and finish review
- Server Smart NIC via and back-drill review
9 original sources → 
View factory profile →Huizhou, Guangdong, China
Guangdong Kingshine Electronic Technology Co., Ltd. (300903) is headquartered in Huizhou and operates separate specialist business divisions. Three individually reviewed original catalogue constructions make the sourcing choices concrete: a six-layer R-5515/S1000-2M radar board with separately defined through and blind holes; a six-layer EM-890K optical-module board with through-hole POFV and electroplated hard gold plus immersion gold; and a ten-layer industrial RF construction with an opening in the rigid-flex region. Their parameter tables are images on the official product detail pages. This review keeps the original dimensions, materials and asymmetric line/space values with each example, explains the missing drawing definitions, and matches the requested process and test evidence to the actual interface. The issuer’s 2025 report describes distinct division roles and separates completed development projects from research-stage targets. Group equipment and catalogue examples do not establish a combined process envelope for every plant.
MANUFACTURING FOCUS- Mixed-material radar constructions
- Optical contact finishes and through-hole POFV
- Industrial RF with rigid-flex region opening
9 original sources → View factory profile →Changzhou, Jiangsu, China
Changzhou Aohong Electronics Co., Ltd. manufactures double-sided, multilayer and HDI PCBs at its Changzhou operation. Its individual HDI catalogue cards support three different procurement reviews: an eight-layer power board with plated gold fingers, a six-layer thick-copper automotive construction and a ten-layer OSP board with 0.05 mm line width. Contact finishes, layer-specific copper, BGA escape routing and assembly conditions belong to separate released constructions. The official site identifies the Changzhou fabrication address and a separate Haihong single-sided business; the original 2025 report provides dated project and production-model disclosures.
MANUFACTURING FOCUS- Power HDI with separately specified gold-finger contacts
- Automotive thick-copper and sequential build-up review
- Fine-line ten-layer OSP with BGA and impedance designs
5 original sources → View factory profile →Guangzhou, Guangdong, China
Delton Technology (Guangzhou) Inc. manufactures high-speed and high-frequency PCBs. Four original catalogue examples support distinct engineering reviews: PCIe 5.0 server channels, hybrid-lamination switches, hard-drive backplane connectors and large-format AI UBB boards. Hole and back-drill definitions, layer-specific material grades and insertion-loss measurement conditions require an accepted construction. Current Guangzhou sales contacts, site-separated qualification references and newer dated issuer disclosures have been individually re-read; group capability is not assigned indiscriminately to each fabrication site.
MANUFACTURING FOCUS- Server and switch signal-integrity fabrication
- Storage press-fit and back-drilled interconnects
- Large-format AI UBB multilayers
8 original sources → View factory profile →Changsha, Hunan, China
MFS Technology (Hunan) is the Changsha entity in the MFS group’s factory records. Its profile compares original flying-lead, dimple-contact and heater flexible-circuit examples, their distinct finish/interface requirements, bonding handoff and dated government/issuer context. Catalogue constructions remain group examples until the manufacturing site is assigned.
MANUFACTURING FOCUS- Ultra-thin and HDI flexible printed circuits
- Flying-lead, dimple and heater FPC examples
- Project-specific flex construction and assembly
5 original sources → View factory profile →Jiaxing, Zhejiang, China
Chanyee is the catalogue brand of Chengyi Electronics (Jiaxing), 诚亿电子（嘉兴）有限公司, at No. 972 Gangshan Road. The official range distinguishes 2–8-layer embedded copper, 2–4-layer protruding copper, 6–16-layer planar-transformer and 6–8-layer radar families, alongside HDI and 14–22-layer GPU boards. This profile links each route to thermal, insulation, RF or interconnect release decisions and the actual dated certificate copies.
MANUFACTURING FOCUS- High-density rigid PCB manufacturing
- Embedded-copper thermal-management boards
- HDI and millimeter-wave radar boards
11 original sources → View factory profile →Qingyuan, Guangdong, China
Camelot Electronics Technology Co., Ltd. manufactures custom PCBs for automotive electronics and other applications. Its BMS and motor-control catalogue boards support a drawing-led review of insulation, copper, finishes and lot records. The 2025 process table separates sample and series-production limits. Its 2026 half-year report identifies the legal entity, three production bases and an outsourcing model; this profile connects those disclosures to site nomination, process allocation and order traceability.
MANUFACTURING FOCUS- Automotive printed circuit boards
- Battery-management and motor-controller PCB applications
- Multilayer fabrication and special processes
6 original sources → View factory profile →Jiangsu
Research Suzhou Weijie’s PCBA assembly scope: seven original controller, automotive, graphics and lighting examples; SMT/DIP, coating, inspection, BOM release and production-test responsibilities.
MANUFACTURING FOCUS- SMT and DIP assembly
- Automotive and control modules
- Conformal coating and board separation
- ICT, optical and X-ray inspection
37 original sources → View factory profile →Jiangsu
Summit Electronics Technology (KunShan) Co., Ltd. is a Kunshan electronics manufacturing supplier whose website publishes aluminium LED boards, a two-layer FR-4 example, SMT and selective coating equipment, and PCB Layout/CAM services. Its 2025 issuer report describes design optimization, component sourcing, SMT, DIP, assembly testing and finished-product delivery. This independently written profile helps a buyer separate bare-board supply, assembled-board delivery, coating and design responsibility, with original catalogue pictures and order-specific documentation requirements.
MANUFACTURING FOCUS- LED board/PCBA
- Two-layer FR-4
- SMT/DIP
- Selective coating
- PCB Layout/CAM
7 original sources → View factory profile →Fujian
Review Fujian Yongsheng’s six-layer, high-frequency, fine-routing and multilayer catalogue samples; compare layer-conditioned thickness rules, drill and inspection photographs, Fuding site history and dated qualification scope.
MANUFACTURING FOCUS- Six-layer stack release
- High-frequency material selection
- 0.10 mm routing
- Multilayer panel and inspection
56 original sources → 
