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PCB CAPABILITY DIRECTORY

Manufacturing capabilities

Start with the technical requirements. Check the evidence before you shortlist.

20 matching productsCompare shortlist →

Kinwong Electronic

HDI PCB

HDI PCB — mSAP process

Kinwong Electronic

Layers: Layer range not disclosed
Trace width: 0.0300 mm
Material: Unconfirmed

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Guangde New Triunion

Rigid PCB

Single-sided and silver-through-hole PCB

Guangde New Triunion

Layers: 1 layers
Trace width: Unconfirmed
Material: Unconfirmed

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Tongling Onbole Circuits

Rigid PCB

Rigid PCB — 1 oz outer / ½ oz inner copper

Tongling Onbole Circuits

Layers: 1–20 layers
Trace width: 0.0762 mm
Material: Unconfirmed

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Welgao Electronics

Rigid PCB

Heavy-copper and power PCB

Welgao Electronics

Layers: Layer range not disclosed
Trace width: Unconfirmed
Material: Unconfirmed

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Aoshikang Technology

Rigid PCB

Multilayer PCB — technical-support envelope

Aoshikang Technology

Layers: Up to 24 layers
Trace width: Unconfirmed
Material: Unconfirmed

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Shanghai Fast-PCB

Rigid-flex PCB

Rigid-flex PCB fabrication

Shanghai Fast-PCB

Layers: 2–24 layers
Trace width: Unconfirmed
Material: Unconfirmed

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Rigid PCB

Rigid PCB — mechanical finished-hole profile

Hitech Circuits

Layers: 1–38 layers
Trace width: 0.0750 mm
Material: Unconfirmed

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Rigid PCB — published process range

Rigid PCB

Rigid PCB — published process range

Layers: 1–16 layers
Trace width: 0.0762 mm
Material: Unconfirmed

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FR-4 multilayer — 1 oz outer copper

Rigid PCB

FR-4 multilayer — 1 oz outer copper

Layers: 4–20 layers
Trace width: 0.0762 mm
Material: FR-4

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Standard PCB fabrication

Rigid PCB

Standard PCB fabrication

Layers: 1–14 layers
Trace width: 0.1000 mm
Material: FR-4

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