Guangdong headquarters
The issuer describes a focus on high-end optical-module and high-speed connector PCB development, with higher layers/build-up and AI-related work. Confirm the stack and bonding or connector interface with this division.
MANUFACTURER DOSSIER
Guangdong Kingshine Electronic Technology Co., Ltd.
广东科翔电子科技股份有限公司 · Huizhou, Guangdong, China
Official sources reviewed2026-10-29
COMPANY FACTS
Company facts at a glance
- Chinese legal name
- 广东科翔电子科技股份有限公司
- English name
- Guangdong Kingshine Electronic Technology Co., Ltd. (KingShine)
- Short names
- 科翔股份 · Kingshine
- Listing
- Shenzhen Stock Exchange ChiNext, 300903, listed 5 November 2020
- Founded
- 2001
- Registered address
- No. 9 Longshan 8th Road, Daya Bay West District, Huizhou, Guangdong
- Production subsidiaries
- Huizhou Tean (智恩电子) and Daya Bay Kingshine in Huizhou; Jiangxi Kingshine in Jiujiang; Ganzhou Kingshine in Xinfeng; Shangrao companies (70% held); Guangzhou Taojidian for ceramic substrates (86.1% held through Tean)
- 2025 output and sales
- 4.24 million m² produced and 4.27 million m² sold (2025 annual report). A 2.4 million m² a year Ganzhou project began production in late November 2025. The website’s “10 million m²+” capacity figure does not appear in the filings.
- Process capability
- No published process-limit table; the website shows product-specific specification images only.
- Management systems
- The 2025 annual report lists ISO 9001, IATF 16949, GJB 9001C, AS9100D and ISO 13485 among systems in use and states ISO 45001 certification; no certificate numbers or dates are published.
- UL files
- E358874, rigid printed wiring boards (ZPMV2); E535315, flexible constructions (ZPXK2)
Checked on 29 October 2026 against the 2025 annual report on CNInfo, Shenzhen Stock Exchange listing data, the official website and UL iQ for Printed Wiring Boards. Ask which subsidiary will build your board; capabilities differ by plant.
KINGSHINE / MANUFACTURING ALLOCATION
Send the design to the right specialist factory.
Guangdong Kingshine Electronic Technology Co., Ltd. (广东科翔电子科技股份有限公司, stock code 300903) has its headquarters at 9 Longshan Eighth Road, Daya Bay West District, Huizhou. Its official company page dates its founding to 2001 and lists separate business divisions. The 2025 issuer report confirms the legal name and headquarters address, then describes a differentiated factory strategy for 2026. The practical purchasing question is which division accepts your construction and owns its release evidence.
Tean & Jiangxi
The report positions Tean for mid/high-end communication and server PCBs; Jiangxi for high-order HDI, AI-server and automotive ADAS volume work. The quotation should name one producing entity and process route.
Other specialist routes
Ganzhou’s focus is power and energy boards; Shangrao is described around automotive power-protection and rigid-flex, while Guangzhou Taojidian focuses on ceramic substrates. These roles are not a single Huizhou process envelope.
The group company page says seven divisions, while newer Chinese homepage development entries include mSAP/AI preparations. Counts and future projects do not establish current availability for a buyer. The original headquarters-division photograph below identifies a location; no equipment or layer capability is inferred from the exterior.
ORIGINAL EXAMPLE 01 / MILLIMETER-WAVE RADAR
A mixed-material stack with two different hole definitions.
- Layers / thickness
- 6 layers · 1.6 mm
- Size
- 62.38 × 52.90 mm
- Materials
- R-5515 + S1000-2M
- Aspect ratios
- 7:1 through hole · 1:1 blind hole
- Minimum holes
- 0.225 mm through · 0.1 mm blind
- Line / space
- 75 / 75 μm
- Construction notes
- Two laminations · mixed press · laser blind holes · plated-flat filling · high/low copper
- Surface treatment
- Immersion gold
The source uses separate through-hole and blind-hole rows within one example. It does not explicitly define the minimum-hole values as drilled or finished dimensions. Put both definitions in your hole table and obtain the fabricator’s accepted values. Likewise, “high/low copper” is a construction note without numeric copper weights; it needs a layer-by-layer copper specification.
Assign the two materials to the actual stack layers and define the RF reference planes, dielectric thickness and required frequency/test band. For a mixed press, request the accepted lamination sequence and the relevant registration and section criteria. The gallery label “millimeter wave” does not supply a measured loss curve, operating band or antenna-performance result.
ORIGINAL EXAMPLE 02 / OPTICAL MODULE
Release the connector finish with the board geometry.
- Layers / thickness
- 6 layers · 1.65 mm
- Size / material
- 29.1 × 130.4 mm · EM-890K
- Aspect ratio / minimum hole
- 8:1 · 0.2 mm
- Line / space
- 267 / 96 μm
- Named process
- Through-hole POFV
- Surface treatment
- Electroplated hard gold + immersion gold
The line width and spacing are intentionally different: the original table states 267/96 μm, not 96/96. It calls out through-hole POFV without publishing a hole-fill or cap-thickness criterion. Specify the actual via locations, fill/planarity requirements and the finished-hole definition rather than using the catalogue hole value as a complete fabrication note.
Separate the hard-gold contact areas from immersion-gold assembly areas in the drawing. Agree deposit thickness, contact geometry and the insertion-life qualification required by your connector. The table does not state a transmission rate, impedance target or wear-test result; those belong in the project specification.
ORIGINAL EXAMPLE 03 / INDUSTRIAL RF
A rigid-flex window changes the drawing package.
- Layers / thickness
- 10 layers · 1.6 mm
- Size
- 115 × 80 mm
- Material field
- “基材，CVL” · Base material, CVL
- Aspect ratio / minimum hole
- 5.33:1 · 0.35 mm
- Line / space
- 180 / 150 μm
- Construction / finish
- Rigid-flex region opening · immersion gold
The original table names an opening in the rigid-flex region. Its material field does not supply a laminate grade or expand “CVL”; keep that shorthand in the review and request the full rigid/flex material list. No flexible-layer count, bend radius or dynamic bend life is established by this photograph.
Send a region drawing with the opening boundary, flex-to-rigid transition, layer termination and installed geometry. Identify RF routes and reference-plane continuity through the transition, and specify the intended movement and environmental exposure. Have the fabricator propose the region-specific stack, material and inspection plan before quoting this as a repeatable build.
EQUIPMENT TO ACCEPTANCE
Choose the test record your design actually needs.
The current manufacturer product center explicitly labels a Mitsubishi laser drill, an LDI machine, vacuum resin plugging, hole filling and a vacuum etching line. Its test-equipment entries include an impedance tester, network analyzer, blind-hole inspection machine, fluorescence-spectrum analyzer and ion-contamination tester. These are group gallery disclosures; model, quantity, calibration and division assignment are not supplied.
Radar / RF materials
Request material-lot identity, accepted dielectric/copper stack, impedance coupons and a project-specific RF measurement scope. A pictured network analyzer does not define fixtures, test frequency, de-embedding or the loss limits included in the quote.
Optical / filled holes
Request contact-finish measurements and the agreed hole-fill/cap sections. Link those results to the POFV locations and drawing revision. An equipment list cannot replace board-level acceptance.
Manufacturing allocation
Name the legal entity and division in the response, with sample-to-volume transfer requirements, approved material substitutions and lot/process change control. Request the actual lot report from that route.
Use the issuer’s R&D rows with their status.
The 2025 report’s project table describes blind-hole stack alignment and back-drill alignment projects as completed, with ≤15 μm and ≤25 μm respectively. Those are project disclosures, not the minimum hole size or residual-stub limit of the three boards shown above. The same report labels high-frequency microwave research and certain precision-routing work as research-stage activity. Do not turn those targets into a generic production guarantee.
The report separately presents a 400G/800G development row with 100 Ω ±5% differential impedance and a frequency-specific insertion-loss figure. It does not bind that row to this photographed six-layer optical board. Obtain the current coupon and test plan for your own construction. Material grades and loss requirements should remain in the same revision-controlled response.
Make the first inquiry useful.
Attach the selected construction, layer/region stack, copper and material definitions, finished-hole table and quantities. Add radar frequency/loss requirements, optical contact finishes, or rigid-flex movement geometry as appropriate. Ask for accepted exceptions, the named production division, required qualification work and the release reports together.
The official contact page lists marketing@kxkjpcb.com for headquarters and several divisions, with a separate Ganzhou contact. The issuer’s investor mailbox serves securities matters. A published address is retained as source information, not proof of delivery or a reason to send a test marketing message.
Prepare the fabrication brief → · Compare RF constructions →SOURCE TRAIL
Sources behind this profile
Individually researched on 8 October 2026. The three specification tables are images on their corresponding official detail pages and were read visually. Product examples, group equipment, dated R&D and future division strategy retain their distinct scopes.
- MANUFACTURER / COMPANYLegal name, group divisions and manufacturing locations ↗
- MANUFACTURER / RADAROriginal board photograph and image-based six-layer specification ↗
- MANUFACTURER / OPTICALOriginal board and EM-890K / hard-gold-plus-immersion-gold table ↗
- MANUFACTURER / INDUSTRIAL RFTen-layer board with rigid-flex region opening and original material shorthand ↗
- MANUFACTURER / PROCESS & TEST EQUIPMENTNamed gallery entries, without model quantities or division assignment ↗
- MANUFACTURER / HEADQUARTERS DIVISIONCorresponding original factory photograph ↗
- MANUFACTURER / CONTACTSSeparate legal entities, site addresses and purchasing contacts ↗
- ISSUER / 2025 ANNUAL REPORTp7 identity; p14–16 division strategy; p22–24 project status and definitions ↗