Three services with different release questions.
These are service-family entries, not off-the-shelf board models. Original artwork from each official product page illustrates the family; the pictured boards do not establish a layer stack, material grade or qualification result.
Copper weight changes the routing floor.
Published construction rules
- Layer offering
- 1, 2 and even layer counts through 32
- 1 oz line / space
- 1/2-layer: 0.10 / 0.10 mm; multilayer: 0.09 / 0.09 mm
- 2 oz line / space
- 1/2-layer: 0.16 / 0.16 mm; multilayer: 0.16 / 0.20 mm
- Controlled impedance
- 4–32 even layers; nominal ±10% in the general capability table
What to lock in the quote
State copper by layer before checking trace/space. A routing rule for 1 oz two-layer work does not qualify a 2 oz multilayer design. For impedance-controlled boards, include the target, reference layers, dielectric thicknesses and coupon/report requirements.
The dedicated FR-4 page adds ±5 Ω for targets ≤50 Ω, while the HDI FAQ applies that absolute tolerance below 50 Ω. Ask engineering which rule governs a 50 Ω design rather than silently resolving the boundary. Thickness summaries also differ between the general table and product-page marketing; request the released stack instead of adopting the widest range.
A flexible board needs a mechanical brief.
Published flex offering
- Layers / dielectric choices
- 1–4 layers; 25 μm and 50 μm options
- 12 μm copper
- 3/3 mil regular; 2/2 mil absolute limit
- 18 μm / 35 μm copper
- 3.5/3.5 mil / 4/4 mil
- Panel dimensions
- 234 × 490 mm regular; 250 × 600 mm absolute with edge rails
- Finish / reinforcement
- ENIG; PI, FR-4 and stainless-steel stiffener choices
What changes the engineering response
Send the installed bend geometry, static or repeated movement, connector interfaces and stiffener/adhesive drawing. Identify the dielectric and copper construction; the 2/2 mil absolute limit belongs to 12 μm copper, not all flexible boards.
The regular via hole/pad pair is 0.15/0.35 mm, versus 0.10/0.30 mm extreme. The manufacturer does not label that pair as a finished plated-hole tolerance. Specify finished-hole requirements separately and confirm the flex stack and reinforcement thickness together.
Name the laminate, then define the RF acceptance.
Published RF service
- Layers / copper
- 2 layers / 1 oz
- Line / space
- 0.10 / 0.10 mm
- Minimum drill
- 0.20 mm, labelled drill
- Board thickness choices
- 0.65, 0.90 and 1.65 mm
- Maximum dimensions / finish
- 590 × 438 mm / ENIG
- Named material choices
- RO4350B; ZYF255DA, ZYF265D, ZYF300CA-C and ZYF300CA-P
What a material name does not settle
Choose the exact laminate grade, copper and dielectric thickness for the intended frequency and stack. State the impedance, coupon and any RF-loss acceptance method. The service table does not provide a universal insertion-loss test result for your design.
Its 0.20 mm minimum is a drill value, so it is not populated as a finished-hole filter. Material choices are catalogue offerings, not evidence that a particular incoming batch has been purchased or independently traced.
The 0.075 mm laser minimum has a condition.
The official HDI FAQ, updated 7 September 2026, supports first-, second- and third-order HDI. It gives laser blind vias from 0.075 to 0.15 mm, with 0.10 mm as the default, and a blind-via thickness-to-diameter ratio ≤1:1. Its own example rejects a 0.075 mm via through a 0.10 mm dielectric: the required minimum there is 0.10 mm.
Laser blind vias are copper-filled and planarized; mechanically drilled buried vias are resin plugged and capped. State the construction and inspection for each type.
The general table gives buried vias 0.15–0.55 mm, with 0.10 mm extreme only for penetrated dielectric ≤1.0 mm. Routing is 3/3 mil regular and 2.7/2.7 mil extreme; the FAQ recommends 3.5/3.5 mil where space permits.
The FAQ gives ±0.076 mm for PTH component holes and ±0.05 mm for NPTH component holes, and explicitly says via diameters are not controlled. Do not transfer component-hole tolerances onto filled microvias.
For mechanical buried and through vias the FAQ specifies an aspect ratio ≤16:1; it pairs a 2.4 mm maximum HDI thickness with a 0.15 mm minimum through via. Submit the whole build-up for review, including material, copper and inspection, rather than combining unrelated minima.
Keep fabrication release and assembly release distinct.
The quality page describes engineering review of Gerber files before production, with order-centre and email questions when features need clarification. It names automated LDI, solder-mask, etching, electroplating and electrical-testing equipment, plus AOI, flying-probe and final checks. Those descriptions are manufacturer statements; they do not define the test coverage or reports included in every order.
- Fabrication packageGerbers, NC drill, outline, stack-up, copper by layer, material, finish, finished-hole drawing, impedance targets and quantity.
- Assembly packageControlled BOM, approved substitutions, placement coordinates, assembly drawing, polarity notes and functional-test instructions. Agree component sourcing and traceability before release.
- Delivery evidenceAgree the fabrication and assembly reports, acceptance criteria, engineering-question approvals, packaging and shipping responsibility. Define the response to a material or process change.
The “How We Work” page says orders are matched across its factory network according to suitability and available capacity. A fast-production headline is not a promised delivered date for a complex HDI, flex or assembled order: clarify engineering approval, manufacturing, parts availability and shipping separately.
JLCPCB is an ordering brand within a manufacturing group.
The July 2026 prospectus identifies Shenzhen JLC Technology Group Co., Ltd. (深圳嘉立创科技集团股份有限公司), established in November 2006, with a Shenzhen registered office. Printed page 120 explicitly names jlcpcb.com among its self-service PCB order channels. Pages 119 and 332 identify group production bases in Huizhou, Zhuhai, Shaoguan, Jiangsu Huaian and Jiangxi Jian.
That group footprint does not identify the assigned site for a specific drawing. Ask for the contracting entity, production site and approved transfer/change rules when your programme requires origin or site control. The official international contact page also lists Hong Kong, Germany, Japan and Malaysia offices; a customer-support office is not automatically the fabrication plant.
Official contact telephone: +86 755 2391 9769. Keep the board requirements attached to the PCBVerified shortlist when starting the sourcing conversation.
Compare HDI fabrication routes → · Compare flexible PCB manufacturers →
Sources behind this profile
Reviewed individually on 8 October 2026. Family artwork illustrates the offered service, not a tested construction. Technical statements retain their process and copper conditions. The issuer filing cross-checks the group and order channel; no independent factory or certificate audit is implied.
- MANUFACTURER / RIGID PROCESSGeneral rigid PCB capability table and HDI conditions ↗
- MANUFACTURER / FR-4Copper-conditioned routing and original service artwork ↗
- MANUFACTURER / FLEXCopper, panel, stiffener and via/pad conditions ↗
- MANUFACTURER / RFTwo-layer RF offering and named laminate choices ↗
- MANUFACTURER / HDIFAQ updated 7 September 2026: dielectric and via definitions ↗
- MANUFACTURER / FILES & TESTINGEngineering review, equipment and inspection descriptions ↗
- MANUFACTURER / ORDER ALLOCATIONFactory-network assignment ↗
- MANUFACTURER / CONTACTSInternational offices and support telephone ↗
- ISSUER / GROUP & CHANNELJuly 2026 prospectus: printed pages 52, 119–120 and 332 (PDF) ↗