One group, distinct fabrication proposals.
Guangdong Ellington Electronics Technology Co., Ltd. (广东依顿电子科技股份有限公司, Shanghai-listed 603328) identifies its registered and office location in Sanjiao, Zhongshan in the 2026 half-year report. Its official global-business contact is at No. 88 Gaoping Industrial Zone. The reporting entity, sales contact and the plant proposed for an order have different roles.
The group’s published applications cover automotive, computing/communications, energy/power, industrial/medical and multimedia/display. That breadth is useful when routing a project, but it does not make a product drawing transferable between manufacturing locations without engineering and qualification approval.
What the manufacturer publishes for each location
Zhongshan Plant 1
Double-sided, high-multilayer and metal-based boards are the site’s named families.
- Published plant area
- 200,000 m²
- Published output capacity
- 400,000 m²/month
For a thermal or metal-based board: identify the substrate, copper, insulation and thermal interface, then ask which Plant 1 route and inspection plan are proposed.
Zhongshan Plant 2
Double-sided, standard high-layer and HDI boards are listed. The site describes both high-volume and small/medium-volume high-layer orders.
- Published plant area
- 60,000 m²
- Published output capacity
- 200,000 m²/month
For HDI: supply the via-stack and layer construction. Confirm the released build-up and the line that will qualify and reproduce it at the intended quantity.
Thailand
High-layer through-hole and HDI boards are the factory page’s named products.
- Published plant area
- 113,000 m²
- Published output capacity
- 100,000 m²/month
For a Thailand-origin programme: confirm the contracting entity, approved product route, qualification status and current available capacity before planning a transfer.
These figures reproduce the factory page’s area and capacity labels, not measured utilisation or a delivery promise. The 2026 half-year report states that Thailand began trial production in Q1 and was ramping up during the reporting period; the capacity figure above should not be read as realised output at that date. Its current release and loading need an order-specific response.
Separate a technology project from your approved process window.
Ellington’s technical page describes 2025 progress in 50 μm/50 μm lines, 12-layer any-layer technology, 20:1 aspect ratio and several thermal constructions. It does not provide a common laminate, copper, thickness, hole definition or plant assignment for these claims.
Ask which copper condition, layer and inspection rule apply. A fine-line statement by itself does not release a particular HDI stack.
Send the via connectivity and stack drawing. Request the qualified build-up, microvia reliability evidence and acceptance plan for the proposed line.
Ask for the exact thickness/aperture pair and whether the aperture is drilled or finished. The ratio alone supplies neither minimum finished hole nor guaranteed thickness.
The page names raised-pad copper–aluminium composite, sandwich copper-core and embedded ceramic substrates. Specify heat flow, insulation, mechanical sections and interfaces before choosing a route.
The site also names mixed lamination, embedded copper, POFV, back drilling and selective surface treatment in its process descriptions. A quotation should identify the combination that applies to your drawing, rather than borrowing the strongest entry from several different processes.
Write the acceptance rule beside the manufacturing step.
Resin plugging and planarity
Include the via-fill requirement, copper cap, allowable surface condition and required cross-section or inspection evidence. Have engineering identify the applicable process and the report supplied with production.
Electrical and reliability inspection
The factory gallery separately lists automatic electrical testing, thermal shock, HAST, and scanning electron microscopy with energy spectroscopy. Select the tests required by your programme, including coupon, sample size, test condition and report retention; a gallery entry does not mean every test is included in a standard quote.
A site-specific handoff for Ellington
The official marketing page publishes Sales@ellingtonpcb.com and +86 760 2281 3516 as global-business contacts. Its investor-relations and complaint contacts serve other purposes; use the sourcing shortlist to keep the fabrication brief attached to the manufacturer.
Compare HDI manufacturing routes → · Explore metal-based PCB profiles →
Sources behind this profile
Sources checked on 8 October 2026. Site and technology figures retain their published scope and date. No independent product qualification, certificate or combined-limit guarantee is inferred.
- MANUFACTURER / THREE PLANTSNamed sites, area/capacity labels, original factory and equipment images ↗
- MANUFACTURER / TECHNICAL PROJECTS2025 progress and separate process descriptions ↗
- MANUFACTURER / PORTFOLIOApplication families ↗
- MANUFACTURER / BUSINESS CONTACTGlobal sales contact and Zhongshan address ↗
- ISSUER REPORT / IDENTITY & RAMP-UP2026 half-year report, company information on printed page 5 and Thailand trial/ramp-up on page 10 (PDF) ↗