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Capability directory/Manufacturers

MANUFACTURER DOSSIER

Bomin Electronics

博敏电子股份有限公司 · Meizhou, Guangdong

Official sources reviewed2026-10-08
BOMIN / THERMAL, FLEX & HDI

The construction decides the engineering conversation.

Bomin’s automotive catalogue puts three distinct boards beside one another: a 12-layer embedded-ceramic HDI board, a six-layer asymmetric rigid-flex board and a six-layer metal-core board. They share an application market, but their thermal interfaces, mechanical sections and inspection needs are different.

THERMALEmbedded ceramicsSpecify the ceramic integration and acceptance.
MECHANICALAsymmetric rigid-flexSpecify flex zones, bends and selective finish.
FABRICATIONMetal core & cavitiesSpecify depth datums and copper interfaces.
OFFICIAL AUTOMOTIVE CATALOGUE / THREE NAMED EXAMPLES

Start with the board structure.

These images and construction labels come from the manufacturer’s individual product pop-ups. The pop-ups identify layers, applications and processes; they do not attach a complete laminate, copper, finished-hole or impedance table to each example.

Bomin’s official 12-layer one-stage embedded ceramic board example
Original image paired with the 12-layer embedded ceramic entry.
AUTOMOTIVE LIDAR / 12 LAYERS

One-stage HDI with embedded ceramic

Manufacturer’s construction label
12-layer, one-stage embedded ceramic board
Named processes
ENEPIG, embedded ceramics, sputtering and HDI

Put the ceramic integration, electrical isolation, thermal interface and inspection sections in the drawing package. Request the proposed materials and qualification reports for that section; the catalogue’s process list does not specify a thermal conductivity or insulation rating.

Bomin’s official six-layer LiDAR rigid-flex board example
Original six-layer rigid-flex entry, with the flex connection visible.
AUTOMOTIVE LIDAR / 6 LAYERS

Asymmetric rigid-flex with selective finish

Stack description
Asymmetric stackup, “L23 Flex” in the manufacturer’s wording
Finish description
Step-plated hard-gold fingers plus ENIG

Request the layer drawing that explains the L2/L3 flex arrangement, rigid-to-flex transition and mechanical clearances. State static installation or repeated movement, assembly temperatures and bend requirements. Gold-finger thickness, finish boundaries and inspection belong in the quotation.

Bomin’s official six-layer metal-core automotive PCB example
Original image paired with the six-layer metal-core entry.
AUTOMOTIVE ELECTRONICS / 6 LAYERS

Metal core with embedded copper and depth control

Material description
High-frequency material; grade not named
Named fabrication steps
Blind-via opening, depth-controlled milling, embedded copper blocks, resin-filled vias and back drilling

This is a multilayer thermal construction. Supply a section drawing for the core, copper blocks, dielectric and cavities, with a depth datum and electrical/thermal acceptance. Define back-drill residual stub separately from the drill-depth tolerance.

PROCESS SHEET / KEEP BATCH AND PROTOTYPE SEPARATE

The existing MZ-HDI profile represents the batch column.

The official PCB Division sheet has separate site/process and production-stage columns. The MZ-HDI excerpts below explain the existing capability profile; they are not specifications assigned to the three photographed boards above.

MZ-HDI / BATCH

Repeat-production envelope

Maximum layers / finished thickness
16 / 2.4 mm
Inner and outer line / space
45 / 45 μm
Laser-drilled blind via
0.060 mm
Impedance tolerance
±8%

Ask the nominated line to release the full stack at the planned quantity. The laser-drilled value is not a finished plated through-hole diameter.

MZ-HDI / SMALL BATCH & PROTOTYPE

Separate development envelope

Maximum layers / finished thickness
28 / 3.0 mm
Inner and outer line / space
40 / 40 μm
Laser-drilled blind via
0.050 mm
Impedance tolerance
±5%

A successful prototype needs a production-transfer review. Have engineering identify any stack, feature or test changes before assigning a repeat-production order.

The sheet also separates SZ-SML, MZ-MLB, MZ-HLC, MZ rigid-flex/FPC and Jiangsu processes. The company introduction’s newer manufacturing-park claims are not silently substituted into the MZ-HDI batch column. A quote should identify the current applicable revision and process route.

COMPANY & SITES / IDENTIFY THE PROPOSED LINE

Manufacturing bases and sales contacts have different roles.

The 2026 half-year report identifies BOMIN ELECTRONICS CO., LTD. (博敏电子股份有限公司), Shanghai stock code 603936, and its office at the Chuangxin manufacturing park, No. 3 Bomin Road, Meizhou. The group dates its origins to 1994; the company introduction dates the Meizhou listed-company predecessor to 2005.

MeizhouThe company introduction distinguishes the established plant from the Chuangxin manufacturing park. For HDI and high-layer work, ask which site, line and released process sheet support the proposed stack.
ShenzhenThe introduction describes specialty PCB, metal-base, high-frequency, thick/long-board and urgent prototype work. Its ceramic substrate activities should be specified separately from an embedded-ceramic PCB construction.
JiangsuThe company describes high-layer and HDI production and a second-phase project commissioned in August 2022. Use the Jiangsu process columns when that site is proposed, rather than the Meizhou values.

The official international sales contact is international@bominelec.com, with the marketing centre at Qianhai, Shenzhen and telephone +86 755 2788 5600. That office is a commercial handoff, not the production address of every order.

RFQ / AGREE THE PROCESS OWNERSHIP

Get a named route and an inspection plan.

The 2026 half-year report describes allocating orders across factories according to capacity and product positioning, with selected bottleneck processes sometimes outsourced. For a controlled programme, ask which fabrication steps remain on the approved site, which require external processing, and how change approval and traceability are maintained.

  1. Choose the constructionAttach the complete stack, section drawing and material grade. For ceramic and metal-core work, include thermal interfaces and isolation; for rigid-flex, include the mechanical use.
  2. Choose the production stageIdentify prototype, qualification or repeat production, quantities and ramp schedule. Request the named plant/process revision and a clear transfer plan.
  3. Choose the acceptance evidenceDefine cross-sections, via integrity, electrical tests, finish measurements, traceability and material/change approval. Agree any external processing before release.

Compare rigid-flex fabrication → · Compare HDI routes →

SOURCE TRAIL

Sources behind this profile

Sources individually reviewed on 8 October 2026. Product detail IDs 10004247, 10004246 and 10004245 identify the illustrated constructions. Published process values retain their site and production-stage scope; no independent audit or combined-limit guarantee is implied.

  1. MANUFACTURER / PRODUCT DETAILSThree automotive product pop-ups and original photographs ↗
  2. MANUFACTURER / PROCESS SHEETPCB Division: site/process columns, batch and prototype values ↗
  3. MANUFACTURER / COMPANY & BASESSeparate manufacturing entities and dated project descriptions ↗
  4. MANUFACTURER / INTERNATIONAL SALESQianhai marketing office and international contact ↗
  5. ISSUER / IDENTITY & PROCESS OWNERSHIP2026 half-year report, printed pages 5 and 11 (PDF) ↗
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