MANUFACTURER DOSSIER

Fastprint

Official sources reviewed2026-10-29
COMPANY FACTS

Company facts at a glance

Chinese legal name
深圳市兴森快捷电路科技股份有限公司
English name
Shenzhen Fastprint Circuit Tech Co., Ltd.
Short names
兴森科技 · Fastprint
Listing
Shenzhen Stock Exchange, 002436, listed 18 June 2010
Founded
18 March 1999; predecessor Guangzhou Fastprint founded in 1993
Registered address
Floors 8–9, Tower A, Building 2, Zone 1, Shenzhen Bay Eco-Technology Park (an office, not a plant)
PCB plants
Guangzhou Fastprint Circuit Technology Co., Ltd., No. 33 Guangpu Middle Road, Guangzhou Science City; 宜兴硅谷电子科技有限公司, Yixing, Jiangsu; 北京兴斐电子有限公司, Beijing (formerly Ibiden’s Beijing plant); a smaller Zhuhai unit; a new Guangzhou Knowledge City site under construction in 2026
IC substrates
Run separately by Guangzhou Fastprint Semiconductor (FCBGA) and Guangzhou and Zhuhai Xingke (CSP); not part of the PCB plants above
Former overseas units
UK quick-turn maker Exception PCB was sold in 2025; the sale of US test-board maker Harbor Electronics was approved in 2023
Capacity
No PCB area capacity is published; the 2025 annual report gives production and sales in RMB for PCB and semiconductor combined
Management systems
Group-level ISO 9001, IATF 16949, GJB 9001C and IECQ QC 080000, with ISO 14001 and ISO 45001 at the plants (2025 ESG report); no certificate numbers or dates
UL files
E204460 (printed wiring boards, ZPMV2) and E306630 (flexible, ZPXK2), held by Guangzhou Fast-Print Circuit Technology Co Ltd

Checked on 29 October 2026 against the 2025 annual report, 2025 ESG report and 2026 filings on CNInfo, the official websites and UL iQ for Printed Wiring Boards. The English website (dated 2019) still lists UK and US bases.

FASTPRINT / ELECTRONIC INTERCONNECTION

Send the request to the right business.

Fastprint's public portfolio separates PCB, IC substrate, flexible circuits and semiconductor test boards. Its PCB page then distinguishes HDI, high-frequency and high-speed products. A conventional fabrication request and a semiconductor-test-board project need different specifications and technical recipients.

PCBHDI · high-frequency · high-speedStart with the board stack-up and fabrication requirements.
ICPackaging substratesSeparate packaging construction and qualification from PCB fabrication.
ATESemiconductor test boardsDefine the test-platform interface and performance requirements.
COMPANY / RECORDS AND TIME

A group portfolio needs a project-specific manufacturing plan.

The Chinese company history distinguishes its Guangzhou predecessor established in 1993 from the Shenzhen company established in 1999. Its site describes Guangzhou Science City for prototype/small-batch high-layer, HDI and rigid-flex work, and Yixing for small/medium-batch high-layer, communications backplane and HDI work. Its contact directory lists separate Shenzhen and Guangzhou entries and dedicated business contacts for overseas sales, IC substrates, semiconductor test boards and one-stop services.

Those site descriptions include historic commissioning and acquisition dates; they are not a current line-by-line capacity report. The UK quick-turn unit, Exception PCB, was sold in 2025, and the sale of the US semiconductor-test-board business, Harbor Electronics, was approved in 2023; neither belongs to the current PCB footprint. The 2025 annual report filed on CNINFO describes a broader product set including multilayer PCB, rigid-flex, HDI, substrate-like PCB, ATE boards and CSP/FCBGA packaging substrates. Use that filing as dated corporate context, then have the supplier name the entity and plant proposed for your order.

PCB CATALOGUE / FOUR DIFFERENT FABRICATION BRIEFS

Compare the construction your project actually needs.

The Chinese PCB catalogue now names optical-module, 5G TRX, microwave stepped-cavity, medical, data-conversion and server products. Its English catalogue uses broader HDI, high-frequency and high-speed families. The examples below come from each named Chinese detail page, rather than assigning the English family labels to an unidentified board.

The reviewed details provide board images but no numerical construction table. Dimensions, layers, laminate grades, copper, routing and aperture specifications therefore belong in a current engineering response. The images help identify a project family; they are not a measured capability matrix.

Optical-module PCB pictured in Fastprint’s Chinese product catalogue
Original optical-module catalogue board. No bandwidth or customer qualification is inferred from the image.
OPTICAL INTERCONNECT

Optical-module PCB

The source places this board in its optical-module product family. For a module project, settle the mechanical outline and connector interface together with the electrical channel requirements before comparing PCB quotations.

Send with the RFQ
Board outline and tolerance, connector drawing, stack-up, target impedance, channel-loss budget and test-coupon requirement.
Request from engineering
A proposed laminate and process route, plus the inspection records covering your electrical and mechanical acceptance.
5G TRX PCB pictured in Fastprint’s Chinese product catalogue
Manufacturer’s named 5G TRX product image; material and RF acceptance are not specified on that page.
RF & THERMAL REQUIREMENTS

5G TRX board

This is a separately named PCB offering, not evidence that every high-frequency board uses the same laminate or thermal construction. Put the frequency range and power-related thermal requirements in the brief so engineering can evaluate the complete stack.

Send with the RFQ
Operating band, laminate preference, stack-up, copper, thermal interfaces and required RF measurements.
Request from engineering
The construction-specific material proposal, permitted substitutes and agreed electrical and thermal inspection scope.
Microwave stepped-cavity board pictured in Fastprint’s Chinese product catalogue
Official microwave stepped-cavity product image. Its cavity depth, finish and tolerances need a drawing-specific response.
MECHANICAL DETAIL / RF BOARD

Microwave stepped-cavity board

The cavity makes the mechanical drawing part of the fabrication specification. A generic minimum-hole figure would not answer whether the proposed recess, wall or reference surface meets your assembly needs.

Send with the RFQ
Cavity section, depth and datum, wall and floor tolerances, surface-finish requirement and component clearance.
Request from engineering
The cavity manufacturing sequence, dimensional inspection method and any restrictions from the chosen laminate and finish.
Server PCB pictured in Fastprint’s Chinese product catalogue
Manufacturer’s server-board example. The catalogue does not provide a layer count or backdrill map for this board.
SERVER INTERCONNECT

Server PCB

Start with the intended stack-up and signal-path acceptance. The pictured layout does not establish a platform generation, processor compatibility or approved customer relationship.

Send with the RFQ
Layer sequence, laminate and copper, via and backdrill map, impedance nets and required loss-test method.
Request from engineering
A site-specific fabrication proposal and a complete inspection plan for the submitted design and order quantity.
PROJECT OWNERSHIP / CONTACT STRUCTURE

Who will qualify, manufacture and test the build?

Fastprint’s Chinese contact page separates Shenzhen headquarters at Shenzhen Bay Science & Technology Eco-Park from Guangzhou’s 33 Guangpu Middle Road address. Overseas business is split into the Americas (ossales@chinafastprint.com), Asia/Oceania (ossales2@chinafastprint.com) and Europe/Africa (ossales3@chinafastprint.com), alongside specialist-business contacts. For a PCB enquiry, choose the relevant board family and ask sales to identify the engineering owner and production campus. For packaging substrates or semiconductor test boards, make that specialist scope clear at the beginning so the request is not handled as a generic PCB quote.

BARE-BOARD REQUEST

Fabrication responsibility

Identify the released process, material purchase route, manufacturing entity and inspection reports for the intended PCB construction.

ONE-STOP REQUEST

Assembly and test responsibility

If requesting fabrication plus SMT or testing, define which steps are included and who owns the acceptance criteria and engineering changes.

This is an editorial routing recommendation based on the portfolio and contacts. It does not infer that every product is manufactured at every campus, or that all listed services are included in a quoted order.

RFQ / SELECT A BUSINESS AND A BUILD

Make the first handoff unambiguous.

  1. Name the requested product familyPCB fabrication, packaging substrate, flexible construction or semiconductor test board. For PCB, identify HDI, RF or high-speed requirements without merging their limits.
  2. Ask for the current site-specific matrixSupply stack-up, laminate, copper, dimensions, vias, impedance and quantity. Ask which production campus can support the complete design.
  3. Separate deliverables by stageIdentify bare-board inspection, assembly inputs, test fixtures, functional-test responsibility and change approval. Ask the quotation to allocate each deliverable.

Compare HDI factory profiles →

SOURCE TRAIL

Sources behind this profile

Official Chinese and English pages and the 2025 filing reviewed on 8 October 2026. The report is a dated issuer disclosure. The older English-site footprint is not used as a guarantee of current capacity, and no numerical PCB limits are inferred from portfolio labels.

  1. MANUFACTURER / INTRODUCTIONEnglish company introduction and industry portfolio ↗
  2. MANUFACTURER / PCBChinese catalogue: six named PCB product families ↗
  3. MANUFACTURER / OPTICAL MODULEOriginal optical-module board illustrations ↗
  4. MANUFACTURER / 5G TRXOriginal TRX board image ↗
  5. MANUFACTURER / MICROWAVEOriginal stepped-cavity board image ↗
  6. MANUFACTURER / SERVEROriginal server board image ↗
  7. MANUFACTURER / COMPANY HISTORY1993 predecessor, 1999 Shenzhen company and distinct campus roles ↗
  8. MANUFACTURER / CONTACTSRegional sales and specialist-business contacts ↗
  9. REGULATORY FILING / PORTFOLIO2025 annual report, principal business on printed page 11 (PDF) ↗
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