PCB manufacturer directory
Compare published manufacturing capabilities| Manufacturer & region | Capability envelopeLayers | Line / space | Hole | Impedance | RFQ | |
|---|---|---|---|
 AllfavorJiangsu, ChinaView factory profile Rigid PCBHigh-frequency PCB — Rogers-based catalogue constructionsProfile: High-frequency PCB — Rogers-based catalogue constructions | ———— Manufacturer-published limits Individual catalogue examples. Six layers and 6.0 mm thickness refer to separate examples and must not be interpreted as a single demonstrated construction. | ||
 Chengzhiyi CircuitsGuangdong, ChinaView factory profile Metal-core PCBMetal-based PCB — published process rangeProfile: Metal-based PCB — published process range | —3.94 / 3.94 mil—— Manufacturer-published limits Metal-based process table only. Hole diameter is not identified as a finished plated-hole value. Copper weight, dimensions and dielectric performance are separate limits, not a combined guarantee. | ||
 Longteng ElectronicsHubei, ChinaView factory profile Rigid PCBMultilayer PCB — production process rangeProfile: Multilayer PCB — production process range | Up to 26 layers3 / 3 mil—±8% impedance Manufacturer-published limits Production column of the sample/production comparison. The separate 1–20-layer general table is not combined with this column. Mechanical drill sizes are not treated as finished-hole specifications. | ||
 Sun & Lynn CircuitsGuangdong, ChinaView factory profile Rigid PCBRigid PCB — standard process rangeProfile: Rigid PCB — standard process range | Up to 40 layers2.95 / 2.95 mil—±8% impedance Manufacturer-published limits Standard rigid-PCB column only. Advanced 48-layer, 12 oz and differential ±6% entries are excluded. A 0.20 mm mechanical drill is not entered as a finished-hole limit. | ||
 GainbaseGuangdong, ChinaView factory profile Rigid PCBSingle-sided to 24-layer PCB manufacturingProfile: Single-sided to 24-layer PCB manufacturing | 1–24 layers1.97 / 1.97 mil0.15 mm hole— Manufacturer-published limits Conventional board range. The finished mechanical-hole value is used for filtering; laser holes and HDI require separate construction review. Thickness range shown applies to double-sided boards. | ||
Kinwong ElectronicShenzhen, Guangdong, ChinaView factory profile HDI PCBHDI PCB — mSAP processProfile: HDI PCB — mSAP process | —1.18 / 1.18 mil—— Manufacturer-published limits mSAP-specific line/space. The general explanation of HDI microvias is not entered as a finished-hole specification. | ||
Guangde New TriunionGuangde, Anhui, ChinaView factory profile Rigid PCBSingle-sided and silver-through-hole PCBProfile: Single-sided and silver-through-hole PCB | 1 layers——— Manufacturer-published limits Single-sided family only. Multilayer limits and silver-through-hole reliability are not inferred from the company introduction. | ||
 Tongling Onbole CircuitsTongling, Anhui, ChinaView factory profile Rigid PCBRigid PCB — 1 oz outer / ½ oz inner copperProfile: Rigid PCB — 1 oz outer / ½ oz inner copper | 1–20 layers3 / 3 mil—— Manufacturer-published limits Visually transcribed from the official process-sheet image. Routing values use the 1 oz outer / ½ oz inner copper row. Hole wording is ambiguous, so finished-hole size remains unconfirmed. Impedance is specified differently above and below 100 Ω. | ||
 Welgao ElectronicsJi’an, Jiangxi, ChinaView factory profile Rigid PCBHeavy-copper and power PCBProfile: Heavy-copper and power PCB | ———— Manufacturer-published limits Portfolio disclosure. The online process table needs column-by-column confirmation before numerical values can be used safely. | ||
 Aoshikang TechnologyHunan / Guangdong, ChinaView factory profile Rigid PCBMultilayer PCB — technical-support envelopeProfile: Multilayer PCB — technical-support envelope | Up to 24 layers——±8% impedance Manufacturer-published limits Technical-support table says 24L while another heading says 24+. Only the explicit table limit is used; no lower layer bound is assumed. |
How should I read the evidence?
UL ownership, equipment and material traceability are reviewed separately. Open each record for its source, scope and review date. Reviewed documents do not guarantee a particular board design or production outcome.
Do matching limits guarantee my board is manufacturable?
No. Layer, trace, drill and impedance values must match within one capability profile, but the combination still requires a factory DFM review. A dash means the value was not published and does not satisfy a numeric filter.