MANUFACTURER DOSSIER
四会富仕电子科技股份有限公司 · Guangdong
Sihui Fuji Electronics Technology Co., Ltd. (四会富仕电子科技股份有限公司) is the legal name in the issuer’s original 2025 annual report, stock code 300852. Its official contact location is Electronics Industrial Base No. 2, Xiamao Town, Sihui, Zhaoqing, Guangdong. Founded in 2009, the company’s current catalogue includes high-layer-count multilayers, HDI, thick-copper and metal-base boards, rigid-flex, flex and PCBA.
Three current multilayer examples provide a more useful starting point than a headline maximum: a thick test-platform board, a back-drilled communications backplane and a depth-routed stepped construction. Their original photographs and product-specific specifications are retained separately. General year-labelled process limits below are not added to those examples.
The 2025 report records the Thai subsidiary’s factory entering production in the second half of 2024 and continuing to ramp during 2025. It does not assign each catalogue photograph to that factory. Specify the supplying entity, fabrication site, assembly site if relevant, qualification route and change approval before an order moves between locations.
The report’s research table says the above-50-layer process project had reached batch production. That is dated company disclosure, not proof that every maximum in the current website table is available together. Ask for the proposed construction’s lot experience, qualification records and accepted drawing.
The source names S1190 in its core-specification section. Confirm the exact approved laminate designation and supplier documentation for the quotation. The 16:1 ratio is a published product statement, but the detail does not define its drill-versus-finished-hole denominator. A calculated hole size is therefore not substituted for a stated finished-hole specification.
Provide the stack, netlist, test-channel requirements and connector/mounting drawing. Request the accepted drilling and plating route, hole-wall copper criteria, registration records and construction-specific coupon plan. The product description’s references to test equipment do not establish a test bandwidth, voltage rating or measured impedance result.
The original detail calls 150 ±50 μm a back-drill depth/depth tolerance while discussing removal of via stubs. It does not explicitly define a residual-stub length or the reference plane. Keep the wording separate from the acceptance definition: send a hole map identifying entry side, target layer, keep-out and required residual stub, then ask the factory to return its measurement basis.
This example’s 6.75 mm finished thickness is above the 6.5 mm maximum printed in both year columns on the same page. Ask whether the quoted construction follows a special route, and obtain the actual accepted range. The example and table are not silently reconciled.
The source combines TU-933 and HVLP4 in its material label. Request the exact resin-system and copper-foil specifications, stack thicknesses, roughness and weave orientation needed for the signal-integrity model. No numeric Dk/Df, insertion-loss or measured channel result is supplied.
Provide the machined datum, remaining dielectric thickness, step height/depth, flatness, corner radius and forbidden copper regions. Confirm which exposed conductors must remain, how the depth is measured and which first-article section or dimensional record proves the interface. The original detail gives no numerical slot-depth or flatness tolerance.
The site describes whole-board immersion gold and a separate second treatment of the stepped area. Specify the finish stack and thickness, soldering/contact duty, inspection zones and allowable process exposure. This wording does not establish hard-gold wear performance or an insertion-cycle rating.
The current product pages repeat a technical table with 2025 and 2026 columns. They are not labelled mass-production and prototype columns. Ask which entries are currently qualified, their copper/material conditions and their simultaneous applicability to your stack.
| Definition | 2025 | 2026 |
|---|---|---|
| Maximum thickness | 6.5 mm | 6.5 mm |
| Maximum layer count | 90 | 100 |
| Mechanical machining hole | 0.15 mm | 0.10 mm |
| Thickness / hole ratio | 25:1 | 30:1 |
| Inner and outer trace / space | 0.035 / 0.035 mm | 0.025 / 0.025 mm |
| Laser-hole diameter | 0.075 mm | 0.05 mm |
| Laser-hole depth range | 0.05–0.12 mm | 0.03–0.15 mm |
| Impedance control | ±5% | ±5% |
| Process size | 1240 × 720 mm | 1240 × 720 mm |
| Product size | 1210 × 690 mm | 1210 × 690 mm |
The table’s mechanical-hole wording does not specify a finished plated-hole acceptance. Laser-hole diameter and depth belong to a separate HDI construction. Process size is not delivered-board size. The table’s 17/20 oz maximum copper entries are not assigned to the forty-layer board’s finer routes or the backplane; get copper-conditioned design rules before combining those values.
The Four Advantages page names Panasonic, Shengyi and Nanya CCL and Taiyo ink, and describes advance reporting for changes in people, equipment, material and method. Ask for the order’s laminate/foil/ink specifications, lot documentation and agreed substitution/change approval. This manufacturer policy is not a materials invoice or a verified chain of custody.
The same page labels EDX analysis, visual inspection, flying-probe testing, laser drilling, outer-layer LDI and VCP. These are manufacturer disclosures, without a current model/count/site inventory verified here. Ask which line and test program handle the selected construction, and request the agreed netlist test, sections, finish measurements and back-drill/step inspection records.
The company page publishes UL File E336308 and multiple management-system claims. Obtain the current legal-owner/site and certificate scope for the proposed materials and purchase specification before using a certification requirement. This page adds no independent certification badge. The website publishes fujiweb@fujipcb.cn as a contact; its appearance is not a delivery test. Agree first-article approval, lot release, packaging and shipment against the actual order.
Individually read on 8 October 2026. Three original product images and annual-report pages 7, 16 and 23 were visually checked. Product-specific construction, general year-labelled capability and dated corporate disclosures retain separate scopes. Certifications remain manufacturer statements pending the order-specific owner/site and scope check.
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