MANUFACTURER DOSSIER
深圳市深联电路有限公司 · Guangdong
Sun & Lynn Circuits is the brand used by 深圳市深联电路有限公司. The official company history dates the business to 2002 and the current company name to 2006. Its catalogue spans rigid multilayers, HDI, flexible circuits and rigid-flex. Three original examples below illustrate quite different purchasing decisions: copper and plated holes on an 18-layer power board, mixed finishes on an eight-layer HDI control module, and the rigid-to-flex transition of a wearable circuit.
The current company page names Shenzhen, Ganzhou, Zhuhai and Thailand manufacturing bases. A group process table is useful for discussing a proposed route, but the quotation still needs a named fabrication site and an approved construction. Start with the closest example, then use the separate standard/advanced columns to frame the engineering review.
The source describes low-resistance testing, VCP plating and a sequence in which half-holes are routed before the final outline. It does not give a resistance acceptance threshold or define the hole entry as drilled or finished. Send the current paths, terminal geometry, hole callouts and allowable resistance with the fabrication pack. Require copper and electrical-test acceptance on the same released revision.
There are two transcription issues to resolve before using this as a dimensional reference. The table prints “30.98 × 25.2 mm”; it also renders the surface-copper entry as “40Z”, while the feature paragraph explicitly says 4 oz inside and outside. We retain the explicit copper statement and leave the dimensions for drawing confirmation. Neither the photograph nor a presumed decimal error supplies a corrected size. The single 0.3 mm routing entry also needs a paired line/space definition.
This catalogue entry is titled a communications module; its stated use is an entertainment central-control module. It publishes eight layers, first-order HDI, 1.2 mm thickness and FR-4. The feature paragraph explicitly pairs 0.075 mm line with 0.075 mm space. The minimum-hole entry is 0.10 mm and the minimum BGA pad is 0.20 mm. A pad diameter is not a BGA pitch, and the hole entry does not identify a finished-hole requirement.
“Immersion gold + OSP” is the published finish combination. Mark which surfaces receive each finish, then agree the masking, assembly sequence and acceptance with the assembler. The source describes copper-filled blind vias and half-hole routing, but does not publish a complete via cross-section or the fill/cap acceptance for this order. Request the build-up, pad and capture-pad geometry, microsection criteria and electrical-test netlist.
The source gives a 130 × 108.17 mm format. Confirm whether this is the shipped unit or production panel before quoting yield, panel rails and assembly handling. The original photograph shows an array; counting visible units does not establish the agreed panelisation or any individual board dimension.
The source describes an asymmetric construction, mechanically opened rigid sections to protect the flex, and laser cutting of the flexible outline with ±0.05 mm accuracy. That accuracy belongs to the flex contour; it is not a line-width tolerance. NFPP is left as the source acronym because the page does not expand it.
Provide the proposed bend zone, static or repeated movement, radius, cycle requirement, connector loads and enclosure clearance. Request a section showing the rigid-to-flex transition, dielectric and coverlay, copper layers and any stiffener. Agree where the rigid window ends and which surfaces must remain free of adhesive or mask. A four-layer label alone does not tell the buyer how many conductors continue through the flex.
The 0.075 mm routing and 0.2 mm hole entries need their precise definitions on the returned DFM. Do not borrow the separate FPC process table as a guarantee for the complete rigid-flex stack. Confirm assembly panel support, depanelisation and the accepted inspection of the transition before ordering the first article.
The official headings are “standard process” and “advanced process”. They are not labelled prototype versus mass production. Each row is a separate reported limit; the table does not authorise a construction combining all extremes.
Confirm the paired routing rule at the chosen finished copper. This is the FPC table, not the wearable rigid-flex stack above.
The published advanced ±6% impedance entry is explicitly restricted to differential impedance. State the target, tolerance, reference planes, laminate and coupon on the same stack; do not apply it silently to a single-ended net. Likewise, a mechanical drill dimension is not the accepted finished PTH diameter.
Read the combined-limit review →The contact page separates the group headquarters at No. 83 Zhanjing Road, Fuhai, Bao’an, Shenzhen (6A, floors 16–17) from the Shenzhen factory at Heyi Xinda Industrial Park, Jinxiu South Road, Shajing. It lists Ganzhou at No. 28 Yejin Avenue, Shuixi Nonferrous Metallurgy Base, Zhanggong, and Zhuhai at No. 888 Ronghe East Road, Fushan Industrial Park, Doumen.
The company page assigns high-density multilayers, metal-base, mixed RF and thick-copper work to Shenzhen; HDI, through-hole, FPC and rigid-flex to Ganzhou; and through-hole and HDI to Zhuhai. Thailand is named as a fourth base without a reviewed address or detailed route here. Shanghai, Japan and US branch entries are business contacts, not interchangeable fabrication addresses.
A dated external record independently names the Ganzhou legal entity: the Ganzhou Ecology and Environment Bureau’s first-half 2024 monitoring report, published 23 September 2024, lists 赣州市深联电路有限公司 in Zhanggong in its water-environment entity annex. This is an identity/location cross-reference at that date. It does not certify a PCB construction, establish a current permit scope or approve a Shenzhen or Thailand production transfer.
For your order, ask for the proposed plant, imaging and drilling route, copper-fill method, outsourced operations and approval required for a site/process change. Connect the material grade, copper and finish schedule to incoming-lot records; request the agreed microsections, electrical tests and impedance results at shipment. Equipment photographs and catalogue figures are useful starting points for this discussion, while order-specific records determine the release.
The reviewed official contact page lists emarketing@slpcb.com. Prepare the relevant construction and engineering files through the PCBVerified shortlist.
Prepare the fabrication brief →Individually researched on 8 October 2026. Each original board photo was matched to its exact product-detail page and viewed in full; current logo and labelled equipment photographs were checked. Standard and advanced headings, copper-dependent FPC entries, site assignments and the original government entity record were read separately. Product text discrepancies are preserved for drawing review. Manufacturer statements, dated official identity records and editorial procurement questions have different scopes.
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