MANUFACTURER DOSSIER

Chengzhiyi Circuits

Official sources reviewed2026-09-21 · Independently listed
MANUFACTURING FOCUS

Chengzhiyi Circuits at a glance

  • Metal-based PCBs
  • Thermal-management boards
  • Rigid-flex and multilayer circuits
TECHNICAL QUALIFICATION

Which metal base, dielectric grade, thermal conductivity and isolation requirements apply to this drawing?

01 / COMPANY

What this manufacturer makes

Chengzhiyi develops and manufactures conventional and metal-based printed circuit boards. Its company introduction identifies a Shenzhen technical headquarters and production operations in Dongguan and Ji’an. The product portfolio includes aluminum- and copper-based boards, high-frequency boards, multilayer circuits and rigid-flex constructions. The metal-board process sheet is particularly useful for thermal-management projects because it separates substrate thickness, copper weight, machining methods and electrical testing. Those values require confirmation against the specific dielectric system and thermal path in the proposed design.

Official company source reviewed
Manufacturing focus
Metal-based PCBs · Thermal-management boards · Rigid-flex and multilayer circuits
Published footprint
Guangdong
Listing and account
Independently researched · factory account not claimed
Official catalogue image from Chengzhiyi Circuits. The pictured board does not establish a combined process limit.
Official catalogue image from Chengzhiyi Circuits. The pictured board does not establish a combined process limit. Manufacturer image · Representative image, not a delivered order.
02 / TECHNICAL PROFILE

Metal-based PCB — published process range

Manufacturer reported

Metal-based process table only. Hole diameter is not identified as a finished plated-hole value. Copper weight, dimensions and dielectric performance are separate limits, not a combined guarantee.

Layer count
Layer range not disclosed
Line / space
0.1 / 0.1 mm
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
Substrate thickness0.2–5.0 mm
Copper foil1–12 oz
Maximum dimensions1500 × 500 mm
FinishesLead-free solder, immersion gold and OSP
Technical sourceczypcb.net · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

Open capability sheet →
03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Chengzhiyi Circuits — product and technical documentationhttp://www.czypcb.net/technical-support.htmlSource checked 2026-09-21
    Official website
  2. Chengzhiyi Circuits — company informationhttp://www.czypcb.net/Source checked 2026-09-21
    Official website
  3. Chengzhiyi Circuits — company informationhttp://www.czypcb.net/technical-support.html#joBqrKrjmrkjiikrqlrSource checked 2026-09-21
    Official website
  4. Chengzhiyi Circuits — company informationhttp://www.czypcb.net/pl3517534.htmlSource checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which metal base, dielectric grade, thermal conductivity and isolation requirements apply to this drawing?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

Share with your sourcing team

Send the page to a colleague or save it in your project conversation.

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