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Compare published manufacturing capabilities
Combined capability requires factory confirmation
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Manufacturer & regionCapability envelopeLayers | Line / space | Hole | ImpedanceRFQ
Hongtai ElectronicsGuangdong, ChinaView factory profile Rigid PCBPCB — published production capabilityProfile: PCB — published production capability
—3.5 / 3.5 mil0.15 mm hole—

Manufacturer-published limits

Production column only. The 6.3 mm thickness, 0.075 mm routing and 0.10 mm finished-hole limit column is excluded.

Mingxingda ElectronicsHunan, ChinaView factory profile Rigid PCBRigid PCB manufacturing — 1 to 12 layersProfile: Rigid PCB manufacturing — 1 to 12 layers
1–12 layers3.94 / 3.94 mil——

Manufacturer-published limits

Panel limits vary by construction. The source describes a drilled 0.20 mm hole, not an unambiguous finished-hole guarantee.

Baoda Precision CircuitAnhui, ChinaView factory profile RF & microwave PCB6-layer RO3003 / FR-4 hybrid RF PCBProfile: 6-layer RO3003 / FR-4 hybrid RF PCB
6 layers———

Manufacturer-published limits

Specific six-layer catalogue example. The 77 GHz application description does not constitute an independently measured RF performance guarantee.

Liandajin ElectronicsGuangdong, ChinaView factory profile Rigid PCBMultilayer PCB process capabilityProfile: Multilayer PCB process capability
1–20 layers2.95 / 2.95 mil—±10% impedance

Manufacturer-published limits

General process table. The 0.15 mm hole entry is not clearly identified as a finished hole, so it is excluded from that filter.

Zhongluo ElectronicsGuangdong, ChinaView factory profile Rigid PCBConventional PCB manufacturing — 1 to 16 layersProfile: Conventional PCB manufacturing — 1 to 16 layers
1–16 layers3.94 / 3.94 mil——

Manufacturer-published limits

General manufacturing table. Drilled holes are not finished plated holes; laminate grade and finished copper must be agreed for the stack-up.

Eisun ElectronicsGuangdong, ChinaView factory profile Rigid PCBMultilayer PCB — 2–32-layer process rangeProfile: Multilayer PCB — 2–32-layer process range
2–32 layers2.99 / 2.99 mil——

Manufacturer-published limits

Published process sheet. Metric values are retained as stated; panel dimensions are production-panel values rather than guaranteed single-board dimensions. Confirm the complete stack-up before ordering.

Honglian CircuitsGuangdong, ChinaView factory profile Rigid PCBSix-layer optical-module PCB — catalogue exampleProfile: Six-layer optical-module PCB — catalogue example
6 layers3.94 / 2.76 mil——

Manufacturer-published limits

Specific optical-module product example from the official catalogue. Its line/space figures are not advertised as factory-wide limits. The 0.5 mm drilling figure is not a finished-hole guarantee.

Huihe CircuitJiangxi, ChinaView factory profile Rigid PCBMultilayer PCB — volume-production processProfile: Multilayer PCB — volume-production process
1–20 layers3.94 / 3.94 mil——

Manufacturer-published limits

Volume-production column only. The sample 2–28-layer and general 2–30-layer statements are not combined with this envelope.

Renchuangyi ElectronicsGuangdong, ChinaView factory profile Rigid PCBRigid PCB — 2–32-layer process rangeProfile: Rigid PCB — 2–32-layer process range
2–32 layers———

Manufacturer-published limits

Rigid-PCB table only. Inconsistent line-width conversions and a malformed panel-size unit are not silently corrected or entered into numeric filters.

Fuqiang PCBFujian, ChinaView factory profile Rigid PCBMultilayer PCB — first process columnProfile: Multilayer PCB — first process column
Up to 20 layers3 / 3 mil——

Manufacturer-published limits

First process column only. The separate 30-layer, 2.5 mil and 4.5 mm figures are excluded. Mechanical-drill diameter is not treated as a finished-hole limit.

How should I read the evidence?

UL ownership, equipment and material traceability are reviewed separately. Open each record for its source, scope and review date. Reviewed documents do not guarantee a particular board design or production outcome.

Do matching limits guarantee my board is manufacturable?

No. Layer, trace, drill and impedance values must match within one capability profile, but the combination still requires a factory DFM review. A dash means the value was not published and does not satisfy a numeric filter.