MANUFACTURER DOSSIER
深圳市德盛邦电路技术有限公司 · Guangdong
深圳市德盛邦电路技术有限公司 uses SHENZHEN DESYBRON PCB TECHNOLOGY CO., LTD on its official website. The Shenzhen company describes RF and microwave boards, mixed-material multilayers, high-density work and special constructions. Its catalogue is particularly useful where the board is also a mechanical or thermal component: local thick-gold contacts, backdrilled connections, stepped test fixtures, copper-base lighting and thick-copper optical modules.
The examples below preserve their own parameter tables. A material name is a catalogue statement, not evidence of material purchased for your order. Likewise, a “medical” or “aerospace” application label is not programme qualification. Specify the operating conditions and delivered inspection records for the actual design.
A ten-layer count hides important differences. The IT968TC example separates general gold from local thick-gold contacts. The RO4350B example uses ENEPIG. The mixed-lamination example names TU-872SLK and Rogers 4350b together. Keep those differences in the fabrication drawing and quotation rather than comparing the examples by layer count alone.
Separate local contact plating from the general gold finish. Release the contact-zone drawing, nickel underplate, bevel and thickness acceptance.
Request the complete dielectric stack and lamination construction: the named laminate does not establish whether all ten layers use the same material. Define ENEPIG thickness and RF coupon acceptance.
Give operating frequency, stack geometry, controlled impedance, via transition and coupon requirements. The catalogue does not supply measured RF loss or a per-product impedance tolerance.
Identify the RF and FR-4 layers, bonding materials and lamination cycles. Request registration and thickness controls for the mixed stack rather than applying one material property to every layer.
Specify the backdrill side, diameter, target layer and maximum residual stub. Supply the exact laminate grade, impedance stack and drill-to-copper clearance; a backdrill label alone is not a high-speed validation.
Provide the step drawing, depth datum, probe interface and actual flatness acceptance. The page’s “flatness ≥2” has no units or test definition and is not adopted as a specification.
Release the castellated contact and opening drawings, depth limits and edge-copper acceptance. Confirm the laminate grade and the exact operation meant by 揭盖 before quoting tooling.
The IoT module page identifies backdrilling but gives no residual-stub limit. Name the entry side and stop layer, drill diameter, remaining stub and inspection evidence. Agree how backdrill clearance is checked against the actual stack.
The eighteen-layer test board needs step depth, datum and probe-interface dimensions. Its “flatness ≥2” entry has no units or method, so it is excluded from the specifications. Supply a measurable flatness requirement and fixture support condition.
The six-layer home-control example names half holes and 揭盖. Confirm the specific opening operation and exposed layer, then dimension the contact edge. Ask how plating wrap, burr and depanelisation condition will be inspected.
The optical and industrial-laser examples specify TG170 with pure copper. The lighting example instead identifies a copper-base substrate. Those descriptions do not supply the same dielectric stack or isolation path; quote them with a section drawing, not just an ounce value.
Release the contact geometry and plating unit, copper measurement basis and thermal interface. Confirm how the 0.3 mm copper value and 8 oz label relate; do not replace them with an assumed conversion.
Dimension the cut-outs and exposed contacts, define current and temperature rise, and agree plating units. The source’s finger tolerance ±0.03 does not name a unit or datum.
Request the dielectric stack, isolation voltage and through-plane thermal resistance. “High thermal conductivity” is not a numerical material rating; specify mounting, flatness and the delivered outline.
The official technical page explicitly splits sample processing from volume production. The following are separate process-table entries, not a guarantee that every maximum can be combined on the same stack.
Both columns state a maximum manufacturing size of 610 × 1200 mm. This is not the delivered outline of any photographed board. Unlike the technical table’s explicit finished hole, several product pages say only “minimum hole”; those values remain descriptive and are not assigned as finished-hole filter values.
The three rigid-flex detail pages provide photographs but only a full stop in the product-content field. No layer count, bend radius or stack is assigned from these images. The BT substrate category has no board detail in the reviewed listing.
The automotive-labelled Arlon 880 example lists 1 oz copper and also “thick copper 4 oz” as a special process without specifying its layer or zone. Those figures are not merged. The industrial blind-via page’s “BGA size 0.15 mm” does not define pitch, land or drill size, so it is not converted into a BGA capability.
The contact page gives Building E5, Yanchuan Northern Industrial Park, Yanchuan Community, Yanluo, Songgang, Bao’an, Shenzhen. The company introduction dates the business to August 2016 and describes a Shenzhen production base; this is manufacturer history, not an independently checked incorporation date. The official sales addresses are sales@dsbpcb.com and mkt@dsbpcb.com, with service contact kf@dsbpcb.com. Reading these addresses does not establish mailbox control; no email was sent.
The technical page names these production stages but the photographs do not establish machine models, utilisation or which site performs every step. Ask for the process allocation, subcontracted operations, electrical test, coupon/microsection coverage and records included with delivery. No current ISO/IATF copy or UL holder record was identified in the reviewed pages, so no qualification badge is assigned.
The technical page quotes 4 days for two layers, 6 for four, 7 for six, 8 for eight and 8–10 for ten or more. It also advertises a fastest 24-hour expedited service. These are published scheduling statements, not availability for a complex mixed or stepped construction.
Small batches are listed at 5–10 days and medium batches at 8–24 days, with staged delivery possible. Confirm quantity, working-day basis, engineering release, laminate availability and inspection time in the quotation.
Attach the stack and material grades, local-plating map, step/backdrill/thermal drawings, impedance targets and test requirements. Name the contracting and producing entity, site and change-control responsibility. Ask for price and lead time against this package.
Individually read 9 October 2026: company/contact pages, the technical table, 23 product details and their corresponding original images. Product examples and general process ranges are kept separate. An exact corresponding original government or issuer record has not been obtained; no independent site or certificate approval is claimed.
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