MANUFACTURER INDEX

Find the right manufacturing focus.

Compare what each company makes, where it operates and which sources support its profile.

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127 manufacturersManufacturing focus and original company sources
Ellington Electronics logo

Ellington Electronics →

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Zhongshan, Guangdong

Ellington manufactures circuit boards for automotive electronics, power systems, industrial control, medical equipment, computing and communications. Its Zhongshan Plant 1 portfolio includes double-sided, high-multilayer and metal-based boards. Zhongshan Plant 2 lists double-sided, standard high-layer and HDI boards.

MANUFACTURING FOCUS
  • Automotive & power
  • High-layer PCB
  • Industrial & medical
6 original sources →
Bomin Electronics logo

Bomin Electronics →

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Meizhou, Guangdong

Bomin’s automotive catalogue provides distinct 12-layer embedded-ceramic, six-layer LiDAR rigid-flex and six-layer metal-core PCB examples. Its division process sheet separates site/process columns and batch from prototype production. The company identifies Meizhou, Shenzhen and Jiangsu manufacturing bases and a Qianhai international marketing contact; quotations should identify the nominated line, construction and agreed acceptance plan.

MANUFACTURING FOCUS
  • HDI & high-multilayer
  • Heavy copper & metal core
  • Rigid-flex & ceramic substrates
8 original sources →
Fastprint logo

Fastprint →

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Shenzhen, Guangdong

Fastprint’s Chinese PCB catalogue includes optical-module, 5G TRX, microwave stepped-cavity and server boards with corresponding original examples. Its site separately describes Guangzhou prototype/small-batch and Yixing small/medium-batch manufacturing, while overseas PCB sales, packaging substrates and semiconductor test boards have distinct contacts. Construction parameters and the proposed production entity need a drawing-specific response.

MANUFACTURING FOCUS
  • HDI & high-speed PCB
  • Flexible circuits
  • Semiconductor test boards
8 original sources →
Victory Giant Technology logo

Victory Giant Technology →

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Huizhou, Guangdong

Victory Giant manufactures high-density interconnect and high-multilayer PCBs for computing, automotive electronics, communications and medical applications. Its published production portfolio includes a 28-layer HDI construction with an 8+12+8 build-up. Higher HDI constructions under research validation are identified separately from mass production.

MANUFACTURING FOCUS
  • AI accelerator boards
  • High-layer computing
  • Automotive electronics
7 original sources →
Sunshine Global Circuits logo

Sunshine Global Circuits →

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Shenzhen, Guangdong

Sunshine Global Circuits publishes application-specific Standard and Advanced PCB process columns. Named AI catalogue constructions include a 26-layer acceleration card, a 20-layer backdrilled computing-server board and a 16-layer, 8.4 mm heavy-copper planar-transformer board. Their parameters remain separate from generic process limits and from the manufacturing-site assignment.

MANUFACTURING FOCUS
  • High-speed interconnects
  • Thermal management
  • Rigid-flex & HDI
8 original sources →
Suntak Technology logo

Suntak Technology →

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Shenzhen, Guangdong

Suntak’s high-layer catalogue includes a 26-layer AI UBB motherboard, a 32-layer switching board and a 16-layer server construction, each with its own material, outline, thickness and routing data. Its official site identifies Zhuhai F2 as a high-layer manufacturing operation and distinguishes other group plants; the proposed site and acceptance plan need to be confirmed for each order.

MANUFACTURING FOCUS
  • High-layer server boards
  • HDI
  • Industrial control
6 original sources →
Shennan Circuits logo

Shennan Circuits →

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Shenzhen, Guangdong

Shennan Circuits manufactures PCBs, packaging substrates and electronic assemblies. Its PCB page separates 2–68-layer mass-production capability from a 120-layer sample ceiling and presents named backplane, copper-combined amplifier and ODU RF constructions. Manufacturing facilities in Shenzhen, Wuxi and Nantong are identified separately; the order-specific production site and acceptance conditions need to be agreed.

MANUFACTURING FOCUS
  • High-layer backplanes
  • RF & microwave
  • IC substrates & assembly
7 original sources →
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