MANUFACTURER DOSSIER

Sunshine Global Circuits

Official sources reviewed2026-09-20 · Independently listed
MANUFACTURING FOCUS

Sunshine Global Circuits at a glance

  • High-speed interconnects
  • Thermal management
  • Rigid-flex & HDI
TECHNICAL QUALIFICATION

Which copper weight and layer structure support the ±5% impedance target, and which tests will be included in the lot report?

01 / COMPANY

What this manufacturer makes

Sunshine publishes separate process tables for AI data centers, communication, thermal management and industrial control. Its equipment register names laser drilling, direct imaging and electrical test equipment. Those are manufacturer statements; ownership and present operating condition have not been independently checked.

Official company source reviewed
Manufacturing focus
High-speed interconnects · Thermal management · Rigid-flex & HDI
Published footprint
Group-level capability; confirm the assigned production site
Listing and account
Independently researched · factory account not claimed
Equipment illustration from the manufacturer’s register
Equipment illustration from the manufacturer’s register. Manufacturer image · Representative image, not a delivered order.
02 / TECHNICAL PROFILE

AI data-center PCB — advanced process

Manufacturer reported

AI Data Center advanced column only. Outer-layer spacing is 3.5 mil even though line width is 3.0 mil. Lower layer bound is not published.

Layer count
Up to 62 layers
Line / space
0.0762 / 0.0889 mm
Finished hole
Not confirmed
Impedance
±5%
Conditions and published construction
Maximum layer count62, advanced column
Outer line / space3.0 / 3.5 mil
HDI constructionUp to 7+N+7
Maximum thickness8 mm
Drill limit7 mil, drill definition; finished aperture unconfirmed
Technical sourceen.sunshinepcb.com · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

Open capability sheet →
03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified
  • Hitachi LC-2G212E/2C laser drill

    Named on the manufacturer’s equipment list. Asset ownership, site allocation and operating condition have not been independently audited.

    Manufacturer statement recorded
  • Orbotech Paragon SM20 LDI

    Named on the manufacturer’s equipment list. Asset ownership, site allocation and operating condition have not been independently audited.

    Manufacturer statement recorded
  • Flying probe test

    Named on the manufacturer’s equipment list. Asset ownership, site allocation and operating condition have not been independently audited.

    Manufacturer statement recorded

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-20. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Sunshine Global Circuits Co.,Ltd SGC Sunshineen.sunshinepcb.com
    Official website
  2. Process Capability-Sunshine Global Circuitsen.sunshinepcb.com
    Official website
  3. Equipment List-Sunshine Global Circuitsen.sunshinepcb.com
    Official website
  4. Contact Address-Sunshine Global Circuits-World Technology Leading PCB Manufactureren.sunshinepcb.com
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which copper weight and layer structure support the ±5% impedance target, and which tests will be included in the lot report?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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