Manufacturing context
This capability sheet belongs to Sunshine Global Circuits. The conditions below apply to the named product or process; other product families require a separate review.
Official company source reviewed- Manufacturing focus
- High-speed interconnects · Thermal management · Rigid-flex & HDI
- Published footprint
- Group-level capability; confirm the assigned production site
- Listing and account
- Independently researched · factory account not claimed
AI data-center PCB — advanced process
Manufacturer reportedAI Data Center advanced column only. Outer-layer spacing is 3.5 mil even though line width is 3.0 mil. Lower layer bound is not published.
- Layer count
- Up to 62 layers
- Line / space
- 0.0762 / 0.0889 mm
- Finished hole
- Not confirmed
- Impedance
- ±5%
| Maximum layer count | 62, advanced column |
|---|---|
| Outer line / space | 3.0 / 3.5 mil |
| HDI construction | Up to 7+N+7 |
| Maximum thickness | 8 mm |
| Drill limit | 7 mil, drill definition; finished aperture unconfirmed |
| Technical source | en.sunshinepcb.com · Manufacturer specification |
These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.
Know what has been checked.
The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.
UL ownership
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Legal holder, manufacturing address and current UL recognition.
Equipment & in-house processing
Not independently verified- Hitachi LC-2G212E/2C laser drill
Named on the manufacturer’s equipment list. Asset ownership, site allocation and operating condition have not been independently audited.
Manufacturer statement recorded - Orbotech Paragon SM20 LDI
Named on the manufacturer’s equipment list. Asset ownership, site allocation and operating condition have not been independently audited.
Manufacturer statement recorded - Flying probe test
Named on the manufacturer’s equipment list. Asset ownership, site allocation and operating condition have not been independently audited.
Manufacturer statement recorded
Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.
Material traceability
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Laminate grade, supplier documentation and traceable production-batch records.
Sources & review record.
Reviewed 2026-09-20. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- Sunshine Global Circuits Co.,Ltd SGC Sunshineen.sunshinepcb.comOfficial website
- Process Capability-Sunshine Global Circuitsen.sunshinepcb.comOfficial website
- Equipment List-Sunshine Global Circuitsen.sunshinepcb.comOfficial website
- Contact Address-Sunshine Global Circuits-World Technology Leading PCB Manufactureren.sunshinepcb.comOfficial website
Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.
Make the first technical conversation useful.
Which copper weight and layer structure support the ±5% impedance target, and which tests will be included in the lot report?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
Confirm the recipient
Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.