PCB manufacturer directory
Compare published manufacturing capabilities| Manufacturer & region | Capability envelopeLayers | Line / space | Hole | Impedance | RFQ | |
|---|---|---|---|
 FastprintShenzhen, Guangdong, ChinaView factory profile HDI PCBHDI & high-speed PCB fabricationProfile: HDI & high-speed PCB fabrication | ———— Manufacturer-published limits The reviewed product page names product families but does not publish searchable numerical production limits. | ||
 Victory Giant TechnologyHuizhou, Guangdong, ChinaView factory profile HDI PCB28-layer HDI — 8+12+8 build-upProfile: 28-layer HDI — 8+12+8 build-up | 28 layers——— Manufacturer-published limits Specific HDI mass-production construction. R&D validation and the separate multilayer PCB family are not combined with this profile. | ||
 Sunshine Global CircuitsShenzhen, Guangdong, ChinaView factory profile HDI PCBAI data-center PCB — advanced processProfile: AI data-center PCB — advanced process | Up to 62 layers3 / 3.5 mil—±5% impedance Manufacturer-published limits AI Data Center advanced column only. Outer-layer spacing is 3.5 mil even though line width is 3.0 mil. Lower layer bound is not published. Impedance ±5% applies to 1 oz inner copper. | ||
 Suntak TechnologyShenzhen, Guangdong, ChinaView factory profile Rigid PCB26-layer AI server UBB motherboardProfile: 26-layer AI server UBB motherboard | 26 layers3.5 / 3.5 mil0.125 mm hole— Manufacturer-published limits Published product example, not a continuous layer range. The source labels the aperture as minimum PTH size. No impedance tolerance is stated. | ||
 Shennan CircuitsShenzhen, Guangdong, ChinaView factory profile Rigid PCBMultilayer PCB — mass-production envelopeProfile: Multilayer PCB — mass-production envelope | 2–68 layers2.5 / 2.5 mil—— Manufacturer-published limits Mass-production column. Outer-layer line/space governs the listed routing limit. Mechanical drill diameter is not treated as finished-hole size. |
How should I read the evidence?
UL ownership, equipment and material traceability are reviewed separately. Open each record for its source, scope and review date. Reviewed documents do not guarantee a particular board design or production outcome.
Do matching limits guarantee my board is manufacturable?
No. Layer, trace, drill and impedance values must match within one capability profile, but the combination still requires a factory DFM review. A dash means the value was not published and does not satisfy a numeric filter.