MANUFACTURING CAPABILITY

Multilayer PCB — mass-production envelope

Official sources reviewed2026-09-20 · Independently listed
PROCESS WINDOW

Multilayer PCB — mass-production envelope

Mass-production column. Outer-layer line/space governs the listed routing limit. Mechanical drill diameter is not treated as finished-hole size.

CONFIRM BEFORE QUOTING

Which manufacturing site and stack-up are proposed, and what are the finished-hole and insertion-loss acceptance criteria?

Read the technical conditions →
01 / COMPANY

Manufacturing context

This capability sheet belongs to Shennan Circuits. The conditions below apply to the named product or process; other product families require a separate review.

Official company source reviewed
Manufacturing focus
High-layer backplanes · RF & microwave · IC substrates & assembly
Published footprint
Shenzhen · Wuxi · Nantong
Listing and account
Independently researched · factory account not claimed
02 / TECHNICAL PROFILE

Multilayer PCB — mass-production envelope

Manufacturer reported

Mass-production column. Outer-layer line/space governs the listed routing limit. Mechanical drill diameter is not treated as finished-hole size.

Layer count
2–68 layers
Line / space
0.0635 / 0.0635 mm
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
Outer-layer line / space2.5 / 2.5 mil
Mechanical drill, tool diameter≥0.15 mm
Maximum thickness10 mm
Sample-only layer ceiling120 layers; excluded from mass-production filter
Technical sourcescc.com.cn · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-20. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. SCCscc.com.cn
    Official website
  2. SCCscc.com.cn
    Official website
  3. SCCscc.com.cn
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which manufacturing site and stack-up are proposed, and what are the finished-hole and insertion-loss acceptance criteria?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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