MANUFACTURING CAPABILITY

FR-4 multilayer — 1 oz outer copper

Official sources reviewed2026-09-20 · Independently listed
PROCESS WINDOW

FR-4 multilayer — 1 oz outer copper

One-ounce outer-copper condition. Half-ounce inner-layer minima are not used as an outer-layer promise. Even controlled-impedance layer choices only.

CONFIRM BEFORE QUOTING

Can the selected stack-up meet the impedance target with one-ounce outer copper, and what finished aperture follows plating?

Read the technical conditions →
01 / COMPANY

Manufacturing context

This capability sheet belongs to NextPCB. The conditions below apply to the named product or process; other product families require a separate review.

Official company source reviewed
Manufacturing focus
Prototype to volume · Multilayer FR-4 · Assembly services
Published footprint
China; confirm production site and contracting entity
Listing and account
Independently researched · factory account not claimed
02 / TECHNICAL PROFILE

FR-4 multilayer — 1 oz outer copper

Manufacturer reported

One-ounce outer-copper condition. Half-ounce inner-layer minima are not used as an outer-layer promise. Even controlled-impedance layer choices only.

Layer count
4–20 layers
Line / space
0.0762 / 0.0762 mm
Finished hole
Not confirmed
Impedance
±10%
Conditions and published construction
Outer line / space3 / 3 mil at 1 oz
Controlled-impedance layers4, 6, 8 … 20
Impedance tolerance±10%
Drill limit0.15 mm at thickness ≤1.2 mm; not a finished-hole claim
Technical sourcenextpcb.com · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-20. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Who Is NextPCB? PCB Manufacturing Expertsnextpcb.com
    Official website
  2. PCB Capabilities - NextPCBnextpcb.com
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Can the selected stack-up meet the impedance target with one-ounce outer copper, and what finished aperture follows plating?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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