MANUFACTURING CAPABILITY

Multilayer PCB — production process range

Official sources reviewed2026-09-21 · Independently listed
PROCESS WINDOW

Multilayer PCB — production process range

Production column of the sample/production comparison. The separate 1–20-layer general table is not combined with this column. Mechanical drill sizes are not treated as finished-hole specifications.

CONFIRM BEFORE QUOTING

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Read the technical conditions →
01 / COMPANY

Manufacturing context

Longteng Electronics lists multilayer PCB — production process range in its official manufacturing documentation. Production layer ceiling: 26 layers. Production board thickness: 0.4–6.0 mm. Maximum processing size: 570 × 760 mm. Production HDI construction: 2+N+2; confirm proposed stack-up. Production column of the sample/production comparison. The separate 1–20-layer general table is not combined with this column. Mechanical drill sizes are not treated as finished-hole specifications. Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Official company source reviewed
Manufacturing focus
Prototype through volume production · Communications and industrial PCBs · Automotive circuit boards
Published footprint
Hubei
Listing and account
Independently researched · factory account not claimed
Official catalogue image from Longteng Electronics. The pictured board does not establish a combined process limit.
Official catalogue image from Longteng Electronics. The pictured board does not establish a combined process limit. Official manufacturer image
02 / TECHNICAL PROFILE

Multilayer PCB — production process range

Manufacturer reported

Production column of the sample/production comparison. The separate 1–20-layer general table is not combined with this column. Mechanical drill sizes are not treated as finished-hole specifications.

Layer count
Up to 26 layers
Line / space
0.0762 / 0.0762 mm
Finished hole
Not confirmed
Impedance
±8%
Conditions and published construction
Production layer ceiling26 layers
Production board thickness0.4–6.0 mm
Maximum processing size570 × 760 mm
Production HDI construction2+N+2; confirm proposed stack-up
Technical sourceltepcb.com · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Longteng Electronics — product and technical documentationhttp://www.ltepcb.com/capability.htmlSource checked 2026-09-21
    Official website
  2. Longteng Electronics — company informationhttp://www.ltepcb.com/about_us.htmlSource checked 2026-09-21
    Official website
  3. Longteng Electronics — company informationhttp://www.ltepcb.com/Source checked 2026-09-21
    Official website
  4. Longteng Electronics — company informationhttp://www.ltepcb.com/products/935627834372481024.htmlSource checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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