Manufacturing context
This capability sheet belongs to Kinwong Electronic. The conditions below apply to the named product or process; other product families require a separate review.
Official company source reviewed- Manufacturing focus
- HDI & substrate-like PCB · Automotive electronics · Flex & metal-base PCB
- Published footprint
- Shenzhen · Longchuan · Jishui · Xinfeng · Zhuhai · Thailand
- Listing and account
- Independently researched · factory account not claimed
HDI PCB — mSAP process
Manufacturer reportedmSAP-specific line/space. The general explanation of HDI microvias is not entered as a finished-hole specification.
- Layer count
- Layer range not disclosed
- Line / space
- 0.03 / 0.03 mm
- Finished hole
- Not confirmed
- Impedance
- Not disclosed for this profile
| mSAP line / space | 30 / 30 μm |
|---|---|
| Tenting line / space | 40 / 40 μm, separate process |
| Published structures | Anylayer HDI |
| Solder mask alignment | ±1 mil |
| Technical source | kinwong.com · Manufacturer specification |
These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.
Know what has been checked.
The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.
UL ownership
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Legal holder, manufacturing address and current UL recognition.
Equipment & in-house processing
Not independently verified- LDI direct laser imaging
Reported for the RF PCB process. Not an independent equipment audit.
Manufacturer statement recorded
Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.
Material traceability
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Laminate grade, supplier documentation and traceable production-batch records.
Sources & review record.
Reviewed 2026-09-20. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- Company profile and manufacturing baseskinwong.comOfficial website
- HDI process capabilitieskinwong.comOfficial website
- Official sales contactkinwong.comOfficial website
- RF PCB process and direct imagingkinwong.comOfficial website
Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.
Make the first technical conversation useful.
Is mSAP available at the proposed manufacturing site for this layer stack and copper thickness, and what release qualification applies?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
Confirm the recipient
Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.