Manufacturing context
Jitai Electronics lists flexible circuit — published FPC process range in its official manufacturing documentation. Maximum working size: 250 × 500 mm. Single-layer thickness: 0.036–0.15 mm. Double-layer thickness: 0.05–0.17 mm. Eight-layer thickness: 0.4–0.8 mm. Flexible-board column only. Thickness ranges are layer-specific; rigid-flex figures are separate. Which flex stack-up, stiffener arrangement and bend conditions are covered by the proposed manufacturing process?
Official company source reviewed- Manufacturing focus
- Flexible circuits · Rigid-flex boards · FPCA services
- Published footprint
- Guangdong
- Listing and account
- Independently researched · factory account not claimed
Flexible circuit — published FPC process range
Manufacturer reportedFlexible-board column only. Thickness ranges are layer-specific; rigid-flex figures are separate.
- Layer count
- 1–8 layers
- Line / space
- Not disclosed for this profile
- Finished hole
- Not confirmed
- Impedance
- Not disclosed for this profile
| Maximum working size | 250 × 500 mm |
|---|---|
| Single-layer thickness | 0.036–0.15 mm |
| Double-layer thickness | 0.05–0.17 mm |
| Eight-layer thickness | 0.4–0.8 mm |
| Aspect ratio | 5:1, source table |
| Technical source | jitaifpcb.com · Manufacturer specification |
These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.
Know what has been checked.
The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.
UL ownership
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Legal holder, manufacturing address and current UL recognition.
Equipment & in-house processing
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.
Material traceability
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Laminate grade, supplier documentation and traceable production-batch records.
Sources & review record.
Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- Jitai Electronics — product and technical documentationhttp://www.jitaifpcb.com/service.htmlSource checked 2026-09-21Official website
- Jitai Electronics — company informationhttp://www.jitaifpcb.com/about.htmlSource checked 2026-09-21Official website
- Jitai Electronics — company informationhttp://www.jitaifpcb.com/company-profile.htmlSource checked 2026-09-21Official website
- Jitai Electronics — company informationhttp://www.jitaifpcb.com/Source checked 2026-09-21Official website
Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.
Make the first technical conversation useful.
Which flex stack-up, stiffener arrangement and bend conditions are covered by the proposed manufacturing process?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
Confirm the recipient
Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.