Manufacturing context
Intflex / Zecheng Electronics lists flexible PCB — up to 8 layers in its official manufacturing documentation. FPC layer ceiling: 8 layers. Processing modes: Panel-to-panel and roll-to-roll. Finished copper range: 1/3–8 oz, manufacturer disclosure. Via processes: Metal filling and resin filling. Flexible-circuit section only. The 35 µm hole is not presented as a finished mechanical-hole limit; copper and routing extremes require stack-up review. Which flex stack-up, stiffener arrangement and bend conditions are covered by the proposed manufacturing process?
Official company source reviewed- Manufacturing focus
- Flexible circuit fabrication · Rigid-flex and HDI · Customized electronic modules
- Published footprint
- Guangdong
- Listing and account
- Independently researched · factory account not claimed
Flexible PCB — up to 8 layers
Manufacturer reportedFlexible-circuit section only. The 35 µm hole is not presented as a finished mechanical-hole limit; copper and routing extremes require stack-up review.
- Layer count
- 1–8 layers
- Line / space
- 0.035 / 0.035 mm
- Finished hole
- Not confirmed
- Impedance
- Not disclosed for this profile
| FPC layer ceiling | 8 layers |
|---|---|
| Processing modes | Panel-to-panel and roll-to-roll |
| Finished copper range | 1/3–8 oz, manufacturer disclosure |
| Via processes | Metal filling and resin filling |
| Technical source | intflex.cn · Manufacturer specification |
These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.
Know what has been checked.
The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.
UL ownership
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Legal holder, manufacturing address and current UL recognition.
Equipment & in-house processing
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.
Material traceability
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Laminate grade, supplier documentation and traceable production-batch records.
Sources & review record.
Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- Intflex / Zecheng Electronics — product and technical documentationhttps://intflex.cn/ability.aspx?type=20Source checked 2026-09-21Official website
- Intflex / Zecheng Electronics — company informationhttps://intflex.cn/about.aspxSource checked 2026-09-21Official website
- Intflex / Zecheng Electronics — company informationhttps://intflex.cn/about.aspx?type=9Source checked 2026-09-21Official website
- Intflex / Zecheng Electronics — company informationhttps://intflex.cn/Source checked 2026-09-21Official website
Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.
Make the first technical conversation useful.
Which flex stack-up, stiffener arrangement and bend conditions are covered by the proposed manufacturing process?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
Confirm the recipient
Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.