What this manufacturer makes
Zecheng Electronics, presented under the Intflex website, develops and manufactures flexible circuits, rigid-flex boards, HDI boards and customized electronic modules. Its production information separates bare-board fabrication from assembly capabilities. The flexible-circuit section describes panel-to-panel and roll-to-roll processing for different order mixes, metal and resin via filling, and up to eight flexible layers. This profile uses only those FPC disclosures. The separate 20-layer HDI and module-assembly specifications are not applied to the flexible-board filter.
Official company source reviewed- Manufacturing focus
- Flexible circuit fabrication · Rigid-flex and HDI · Customized electronic modules
- Published footprint
- Guangdong
Flexible PCB — up to 8 layers
Manufacturer reportedIntflex / Zecheng Electronics lists flexible PCB — up to 8 layers in its official manufacturing documentation. FPC layer ceiling: 8 layers. Processing modes: Panel-to-panel and roll-to-roll. Finished copper range: 1/3–8 oz, manufacturer disclosure. Via processes: Metal filling and resin filling. Flexible-circuit section only. The 35 µm hole is not presented as a finished mechanical-hole limit; copper and routing extremes require stack-up review. Which flex stack-up, stiffener arrangement and bend conditions are covered by the proposed manufacturing process?
Flexible-circuit section only. The 35 µm hole is not presented as a finished mechanical-hole limit; copper and routing extremes require stack-up review.
- Layer count
- 1–8 layers
- Line / space
- 0.035 / 0.035 mm
- Finished hole
- —
- Impedance
- —
| FPC layer ceiling | 8 layers |
|---|---|
| Processing modes | Panel-to-panel and roll-to-roll |
| Finished copper range | 1/3–8 oz, manufacturer disclosure |
| Via processes | Metal filling and resin filling |
| Technical source | intflex.cn · Manufacturer specification |
Published limits may refer to different constructions. Confirm the complete stack-up with the factory. A dash means no value was published.
Sources & review record.
Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- Intflex / Zecheng Electronics — product and technical documentationhttps://intflex.cn/ability.aspx?type=20Source checked 2026-09-21Official website
- Intflex / Zecheng Electronics — company informationhttps://intflex.cn/about.aspxSource checked 2026-09-21Official website
- Intflex / Zecheng Electronics — company informationhttps://intflex.cn/about.aspx?type=9Source checked 2026-09-21Official website
- Intflex / Zecheng Electronics — company informationhttps://intflex.cn/Source checked 2026-09-21Official website
Make the first technical conversation useful.
Which flex stack-up, stiffener arrangement and bend conditions are covered by the proposed manufacturing process?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
Confirm the recipient
Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.