MANUFACTURING CAPABILITY

Multilayer PCB — volume-production process

Official sources reviewed2026-09-21 · Independently listed
PROCESS WINDOW

Multilayer PCB — volume-production process

Volume-production column only. The sample 2–28-layer and general 2–30-layer statements are not combined with this envelope.

CONFIRM BEFORE QUOTING

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Read the technical conditions →
01 / COMPANY

Manufacturing context

Huihe Circuit lists multilayer PCB — volume-production process in its official manufacturing documentation. Volume layer range: 1–20 layers. Volume board thickness: 0.20–4.00 mm. Maximum volume dimensions: 500 × 600 mm. Outline accuracy: ±0.13 mm, volume column. Volume-production column only. The sample 2–28-layer and general 2–30-layer statements are not combined with this envelope. Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Official company source reviewed
Manufacturing focus
Multilayer PCBs · High-frequency and mixed dielectrics · Prototype and volume production
Published footprint
Jiangxi
Listing and account
Independently researched · factory account not claimed
Official catalogue image from Huihe Circuit. The pictured board does not establish a combined process limit.
Official catalogue image from Huihe Circuit. The pictured board does not establish a combined process limit. Official manufacturer image
02 / TECHNICAL PROFILE

Multilayer PCB — volume-production process

Manufacturer reported

Volume-production column only. The sample 2–28-layer and general 2–30-layer statements are not combined with this envelope.

Layer count
1–20 layers
Line / space
0.1 / 0.1 mm
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
Volume layer range1–20 layers
Volume board thickness0.20–4.00 mm
Maximum volume dimensions500 × 600 mm
Outline accuracy±0.13 mm, volume column
Technical sourcehhcircuit.com · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Huihe Circuit — product and technical documentationhttps://www.hhcircuit.com/abouthuihepcb/processcapacitySource checked 2026-09-21
    Official website
  2. Huihe Circuit — company informationhttps://www.hhcircuit.com/abouthuihepcbSource checked 2026-09-21
    Official website
  3. Huihe Circuit — company informationhttps://www.hhcircuit.com/Source checked 2026-09-21
    Official website
  4. Huihe Circuit — company informationhttps://www.hhcircuit.com/products/multilayerpcbSource checked 2026-09-21
    Official website
  5. Huihe Circuit — company informationhttps://www.hhcircuit.com/archives/8379Source checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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