MANUFACTURING CAPABILITY

Multilayer PCB — 2–32-layer process range

Official sources reviewed2026-09-21 · Independently listed
PROCESS WINDOW

Multilayer PCB — 2–32-layer process range

Published process sheet. Metric values are retained as stated; panel dimensions are production-panel values rather than guaranteed single-board dimensions. Confirm the complete stack-up before ordering.

CONFIRM BEFORE QUOTING

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Read the technical conditions →
01 / COMPANY

Manufacturing context

Eisun Electronics lists multilayer PCB — 2–32-layer process range in its official manufacturing documentation. Layer range: 2–32 layers. Board thickness: 0.3–5.0 mm. Standard production panel: 457.2 × 609 mm. Maximum production panel: 600 × 1200 mm. Published process sheet. Metric values are retained as stated; panel dimensions are production-panel values rather than guaranteed single-board dimensions. Confirm the complete stack-up before ordering. Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Official company source reviewed
Manufacturing focus
High-layer-count PCBs · Industrial and communications boards · Energy and automotive circuits
Published footprint
Guangdong
Listing and account
Independently researched · factory account not claimed
Official catalogue image from Eisun Electronics. The pictured board does not establish a combined process limit.
Official catalogue image from Eisun Electronics. The pictured board does not establish a combined process limit. Official manufacturer image
02 / TECHNICAL PROFILE

Multilayer PCB — 2–32-layer process range

Manufacturer reported

Published process sheet. Metric values are retained as stated; panel dimensions are production-panel values rather than guaranteed single-board dimensions. Confirm the complete stack-up before ordering.

Layer count
2–32 layers
Line / space
0.076 / 0.076 mm
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
Layer range2–32 layers
Board thickness0.3–5.0 mm
Standard production panel457.2 × 609 mm
Maximum production panel600 × 1200 mm
Technical sourceszeiso.com.cn · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Eisun Electronics — product and technical documentationhttp://www.szeiso.com.cn/col.jsp?id=130Source checked 2026-09-21
    Official website
  2. Eisun Electronics — company informationhttp://www.szeiso.com.cn/Source checked 2026-09-21
    Official website
  3. Eisun Electronics — company informationhttp://www.szeiso.com.cn/pd.jsp?fromColId=2&id=19#_pp=2_364Source checked 2026-09-21
    Official website
  4. Eisun Electronics — company informationhttp://www.szeiso.com.cn/pd.jsp?fromColId=2&id=18#_pp=2_364Source checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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