Manufacturing context
Chengzhiyi Circuits lists metal-based PCB — published process range in its official manufacturing documentation. Substrate thickness: 0.2–5.0 mm. Copper foil: 1–12 oz. Maximum dimensions: 1500 × 500 mm. Finishes: Lead-free solder, immersion gold and OSP. Metal-based process table only. Hole diameter is not identified as a finished plated-hole value. Copper weight, dimensions and dielectric performance are separate limits, not a combined guarantee. Which metal base, dielectric grade, thermal conductivity and isolation requirements apply to this drawing?
Official company source reviewed- Manufacturing focus
- Metal-based PCBs · Thermal-management boards · Rigid-flex and multilayer circuits
- Published footprint
- Guangdong
- Listing and account
- Independently researched · factory account not claimed
Metal-based PCB — published process range
Manufacturer reportedMetal-based process table only. Hole diameter is not identified as a finished plated-hole value. Copper weight, dimensions and dielectric performance are separate limits, not a combined guarantee.
- Layer count
- Layer range not disclosed
- Line / space
- 0.1 / 0.1 mm
- Finished hole
- Not confirmed
- Impedance
- Not disclosed for this profile
| Substrate thickness | 0.2–5.0 mm |
|---|---|
| Copper foil | 1–12 oz |
| Maximum dimensions | 1500 × 500 mm |
| Finishes | Lead-free solder, immersion gold and OSP |
| Technical source | czypcb.net · Manufacturer specification |
These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.
Know what has been checked.
The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.
UL ownership
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Legal holder, manufacturing address and current UL recognition.
Equipment & in-house processing
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.
Material traceability
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Laminate grade, supplier documentation and traceable production-batch records.
Sources & review record.
Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- Chengzhiyi Circuits — product and technical documentationhttp://www.czypcb.net/technical-support.htmlSource checked 2026-09-21Official website
- Chengzhiyi Circuits — company informationhttp://www.czypcb.net/Source checked 2026-09-21Official website
- Chengzhiyi Circuits — company informationhttp://www.czypcb.net/technical-support.html#joBqrKrjmrkjiikrqlrSource checked 2026-09-21Official website
- Chengzhiyi Circuits — company informationhttp://www.czypcb.net/pl3517534.htmlSource checked 2026-09-21Official website
Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.
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Which metal base, dielectric grade, thermal conductivity and isolation requirements apply to this drawing?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
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