MANUFACTURING CAPABILITY

High-frequency printed circuit board service

Official sources reviewed2026-09-21 · Independently listed
PROCESS WINDOW

High-frequency printed circuit board service

Product-family disclosure. No RF loss, impedance tolerance or laminate grade is implied by the high-frequency category.

CONFIRM BEFORE QUOTING

Which laminate grade, copper profile, stack-up and RF measurement criteria are included in the quotation?

Read the technical conditions →
01 / COMPANY

Manufacturing context

Botai Electronics lists high-frequency printed circuit board service in its official manufacturing documentation. Application family: High-frequency and microwave circuits. Constructions listed: Single-sided, double-sided and multilayer. Material specification: Laminate grade and dielectric stack-up to be agreed. Product-family disclosure. No RF loss, impedance tolerance or laminate grade is implied by the high-frequency category. Which laminate grade, copper profile, stack-up and RF measurement criteria are included in the quotation?

Official company source reviewed
Manufacturing focus
Double-sided and multilayer PCBs · High-frequency circuits · Microwave applications
Published footprint
Jiangsu
Listing and account
Independently researched · factory account not claimed
Official catalogue image from Botai Electronics. The pictured board does not establish a combined process limit.
Official catalogue image from Botai Electronics. The pictured board does not establish a combined process limit. Official manufacturer image
02 / TECHNICAL PROFILE

High-frequency printed circuit board service

Manufacturer reported

Product-family disclosure. No RF loss, impedance tolerance or laminate grade is implied by the high-frequency category.

Layer count
Layer range not disclosed
Line / space
Not disclosed for this profile
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
Application familyHigh-frequency and microwave circuits
Constructions listedSingle-sided, double-sided and multilayer
Material specificationLaminate grade and dielectric stack-up to be agreed
Technical sourcebotaipcb.cn · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Botai Electronics — product and technical documentationhttp://www.botaipcb.cn/Source checked 2026-09-21
    Official website
  2. Botai Electronics — company informationhttp://www.botaipcb.cn/about/Source checked 2026-09-21
    Official website
  3. Botai Electronics — company informationhttp://www.botaipcb.cn/about/#jianjieSource checked 2026-09-21
    Official website
  4. Botai Electronics — company informationhttp://www.botaipcb.cn/product/product.php?class2=137Source checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which laminate grade, copper profile, stack-up and RF measurement criteria are included in the quotation?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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