Manufacturing context
This capability sheet belongs to Bomin Electronics. The conditions below apply to the named product or process; other product families require a separate review.
Official company source reviewed- Manufacturing focus
- HDI & high-multilayer · Heavy copper & metal core · Rigid-flex & ceramic substrates
- Published footprint
- Shenzhen · Meizhou · Jiangsu
- Listing and account
- Independently researched · factory account not claimed
MZ-HDI PCB — batch-production process
Manufacturer reportedMZ-HDI batch column in the official PCB division process sheet. Prototype limits are separate. The sheet specifies drilled-hole values, which are not entered as finished apertures.
- Layer count
- Up to 16 layers
- Line / space
- 0.045 / 0.045 mm
- Finished hole
- Not confirmed
- Impedance
- ±8%
| Site / process column | MZ-HDI, batch production |
|---|---|
| Maximum layers | 16; 28 for small-batch / prototype column |
| Outer line / space | 45 / 45 μm |
| Maximum finished thickness | 2.4 mm |
| Impedance tolerance | ±8% |
| Laser drilled blind via | 0.060 mm; not a finished through-hole claim |
| Technical source | bominelec.com · Manufacturer specification |
These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.
Know what has been checked.
The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.
UL ownership
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Legal holder, manufacturing address and current UL recognition.
Equipment & in-house processing
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.
Material traceability
Not independently verifiedNo supporting record has been reviewed for this category.
Qualification request: Laminate grade, supplier documentation and traceable production-batch records.
Sources & review record.
Reviewed 2026-09-20. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- 博敏电子股份有限公司bominelec.comOfficial website
- 联系方式_联系我们_博敏电子股份有限公司bominelec.comOfficial website
- PCB division process sheet — batch versus prototypebominelec.comOfficial website
Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.
Make the first technical conversation useful.
Can the Meizhou HDI line support the required build-up within the batch-production limits, and what microvia qualification evidence applies?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
Confirm the recipient
Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.