MANUFACTURER DOSSIER

Lier Printed Circuit Board

Official sources reviewed2026-09-21
MANUFACTURING FOCUS

Lier Printed Circuit Board at a glance

  • Multilayer PCBs
  • HDI and blind/buried vias
  • Communications and power boards
SOURCING QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

01 / COMPANY

What this manufacturer makes

Lier Printed Circuit Board manufactures multilayer PCBs in Hunan. Its official profile dates the business to 2008 and identifies production in the Changsha national biological-industry area. The product range includes HDI, small-pitch BGA, blind/buried-via and impedance-controlled boards. A sixteen-layer communications-board example appears in the official catalogue. Its layer count describes that example; RF performance, materials and acceptance criteria are not inferred from the communications application.

Official company source reviewed
Manufacturing focus
Multilayer PCBs · HDI and blind/buried vias · Communications and power boards
Published footprint
Hunan
Official catalogue image from Lier Printed Circuit Board. The pictured board does not establish a combined process limit.
Official catalogue image from Lier Printed Circuit Board. The pictured board does not establish a combined process limit. Manufacturer image
02 / TECHNICAL PROFILE

16-layer communications PCB example

Manufacturer reported

Lier Printed Circuit Board lists 16-layer communications PCB example in its official manufacturing documentation. Layer count: 16. Catalogue application: Communications. Construction: Multilayer printed circuit board. Specific 16-layer communications-board catalogue example. Laminate grade, stack-up and signal-integrity requirements need confirmation for the intended design. Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Official catalogue image from Lier Printed Circuit Board. The pictured board does not establish a combined process limit.
Official catalogue image from Lier Printed Circuit Board. The pictured board does not establish a combined process limit. Official manufacturer image

Specific 16-layer communications-board catalogue example. Laminate grade, stack-up and signal-integrity requirements need confirmation for the intended design.

Layer count
16 layers
Line / space
—
Finished hole
—
Impedance
—
Conditions and published construction
Layer count16
Catalogue applicationCommunications
ConstructionMultilayer printed circuit board
Technical sourcelierpcb.com · Manufacturer specification

Published limits may refer to different constructions. Confirm the complete stack-up with the factory. A dash means no value was published.

03 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Lier Printed Circuit Board — product and technical documentationhttp://www.lierpcb.com/product/13.htmlSource checked 2026-09-21
    Official website
  2. Lier Printed Circuit Board — company informationhttp://www.lierpcb.com/Source checked 2026-09-21
    Official website
  3. Lier Printed Circuit Board — company informationhttp://www.lierpcb.com/product/8/Source checked 2026-09-21
    Official website
04 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

CONTINUE THE COMPARISON

Explore the process and prepare the brief.

Share with your sourcing team

Send the page to a colleague or save it in your project conversation.

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