MANUFACTURER DOSSIER

Lier Printed Circuit Board

Official sources reviewed2026-09-21 · Independently listed
MANUFACTURING FOCUS

Lier Printed Circuit Board at a glance

  • Multilayer PCBs
  • HDI and blind/buried vias
  • Communications and power boards
SOURCING QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

01 / COMPANY

What this manufacturer makes

Lier Printed Circuit Board manufactures multilayer PCBs in Hunan. Its official profile dates the business to 2008 and identifies production in the Changsha national biological-industry area. The product range includes HDI, small-pitch BGA, blind/buried-via and impedance-controlled boards. A sixteen-layer communications-board example appears in the official catalogue. Its layer count describes that example; RF performance, materials and acceptance criteria are not inferred from the communications application.

Official company source reviewed
Manufacturing focus
Multilayer PCBs · HDI and blind/buried vias · Communications and power boards
Published footprint
Hunan
Listing and account
Independently researched · factory account not claimed
Official catalogue image from Lier Printed Circuit Board. The pictured board does not establish a combined process limit.
Official catalogue image from Lier Printed Circuit Board. The pictured board does not establish a combined process limit. Manufacturer image · Representative image, not a delivered order.
02 / TECHNICAL PROFILE

16-layer communications PCB example

Manufacturer reported

Specific 16-layer communications-board catalogue example. Laminate grade, stack-up and signal-integrity requirements need confirmation for the intended design.

Layer count
16 layers
Line / space
Not disclosed for this profile
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
Layer count16
Catalogue applicationCommunications
ConstructionMultilayer printed circuit board
Technical sourcelierpcb.com · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

Open capability sheet →
03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Lier Printed Circuit Board — product and technical documentationhttp://www.lierpcb.com/product/13.htmlSource checked 2026-09-21
    Official website
  2. Lier Printed Circuit Board — company informationhttp://www.lierpcb.com/Source checked 2026-09-21
    Official website
  3. Lier Printed Circuit Board — company informationhttp://www.lierpcb.com/product/8/Source checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

Share with your sourcing team

Send the page to a colleague or save it in your project conversation.

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