MANUFACTURER DOSSIER

Huilihua / Suzhou Circuit

Official sources reviewed2026-09-21
MANUFACTURING FOCUS

Huilihua / Suzhou Circuit at a glance

  • HDI circuits
  • Multilayer PCBs
  • Suzhou manufacturing
SOURCING QUESTION

Which HDI build-up, microvia structure and reliability tests are proposed for the submitted stack-up?

01 / COMPANY

What this manufacturer makes

Huilihua, presented through the Suzhou Circuit website, manufactures multilayer and HDI printed circuit boards in Suzhou. Its official company information dates the operation to 1996. The website describes HDI and conventional multilayer work as part of its PCB business. This listing keeps the product family separate from designed production capacity and avoids interpreting a capacity plan as current output. Buyers considering HDI should provide the sequential-lamination structure and microvia arrangement alongside the electrical requirements.

Official company source reviewed
Manufacturing focus
HDI circuits · Multilayer PCBs · Suzhou manufacturing
Published footprint
Jiangsu
PCB construction illustration published by Suzhou Circuit; schematic presentation, not a measured product cross-section.
PCB construction illustration published by Suzhou Circuit; schematic presentation, not a measured product cross-section. Manufacturer image
02 / TECHNICAL PROFILE

HDI printed circuit board service

Manufacturer reported

Huilihua / Suzhou Circuit lists hDI printed circuit board service in its official manufacturing documentation. Technology: High-density interconnect PCB. Related construction: Conventional multilayer PCB. Engineering input: Build-up sequence and microvia structure. Company-level product-family disclosure. Layer, routing and finished-hole limits require a confirmed fabrication specification. Which HDI build-up, microvia structure and reliability tests are proposed for the submitted stack-up?

PCB construction illustration published by Suzhou Circuit; schematic presentation, not a measured product cross-section.
PCB construction illustration published by Suzhou Circuit; schematic presentation, not a measured product cross-section. Official manufacturer image

Company-level product-family disclosure. Layer, routing and finished-hole limits require a confirmed fabrication specification.

Conditions and published construction
TechnologyHigh-density interconnect PCB
Related constructionConventional multilayer PCB
Engineering inputBuild-up sequence and microvia structure
Technical sourcesuzhoucircuit.com · Manufacturer specification
03 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Huilihua / Suzhou Circuit — company informationhttps://www.suzhoucircuit.com/about/Source checked 2026-09-21
    Official website
  2. Huilihua / Suzhou Circuit — company informationhttps://www.suzhoucircuit.com/aboutus/Source checked 2026-09-21
    Official website
  3. Huilihua / Suzhou Circuit — company informationhttps://www.suzhoucircuit.com/Source checked 2026-09-21
    Official website
04 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which HDI build-up, microvia structure and reliability tests are proposed for the submitted stack-up?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

CONTINUE THE COMPARISON

Explore the process and prepare the brief.

Share with your sourcing team

Send the page to a colleague or save it in your project conversation.

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