MANUFACTURER DOSSIER
广德博亚新星电子科技有限公司 · Anhui
广德博亚新星电子科技有限公司 / Boystar PCB publishes bare-board examples for power, vehicle interfaces, industrial controls and appliances. The most useful distinctions are in its individual product notes: local 6 oz copper, a 10–14-layer / 3–4 oz construction, asymmetric A/B copper, resin-filled capped vias, plated edges and different surface finishes.
The company describes a business originating in Xianju, Zhejiang on 8 August 2008 and relocating to Guangde in 2015. The Guangde legal entity’s displayed licence instead gives incorporation on 6 November 2013. These describe different events; use the Guangde entity and producing address on the quotation.
Provide a copper-region drawing and transitions, not just “6 oz PCB”. Define whether the stated weight refers to starting or finished copper, acceptable height differences, local current/thermal paths and the exact high-Tg grade.
Release a layer-by-layer copper stack, insulation thickness, voltage conditions and winding/coupling requirements. Obtain DFM on etch compensation, press cycle and plated-hole geometry for that exact stack.
Specify A/B orientation, starting versus finished copper, stack symmetry, bow/twist acceptance and reference planes. Ask for the proposed impedance stack and coupon; the application title does not supply a voltage or current rating.
The individual catalogue pages state line/space control tolerance ±10%, hole tolerance ±2 mil and board-thickness tolerance ±10%. These are not minimum trace/space dimensions, an impedance tolerance or a nominal board thickness. Agree the actual drawing values, measurement locations and acceptance method.
The 6 oz statement belongs to local positions; the 3–4 oz statement belongs to the 10–14-layer example; the 1 oz / 2 oz statement identifies A and B sides. Do not combine them into one fabrication envelope. The website does not define starting versus finished copper for these examples.
Read the guide to combined limits →
Supply the via map, filling material, cap thickness, planarity and solder-pad requirements. Specify the insulation and safety acceptance required by the charger design; do not infer an IPC via type or operating voltage from the photograph.
Name the laminate grade and the required halogen-free declaration. Release the QR content, serialization rules, print location and read-back acceptance. Define what the code links to: a printed code alone is not a complete lot-traceability system.
Specify the solder alloy and any lead-free requirement, surface flatness at fine-pitch pads, routed outline and plated/non-plated holes. Agree panel retention and dimensional inspection for the shaped board.
Release the tin thickness and inspection method, storage/shelf-life conditions and solderability acceptance after transport. State the mask specification separately; colour does not define the finish or laminate.
“High-Tg” and “halogen-free” are source descriptions, not an identified laminate grade. Request the grade, thickness, supplier and required declaration for the actual order. Similarly, “impedance design” on power or communications examples does not give a target, tolerance, test coupon or reference plane.
For resin-filled, plated-over vias, release the hole structure and inspection requirements. For HASL or immersion tin, define alloy or finish thickness, planarity and solderability. A charging application does not establish the finished system’s operating voltage or safety approval.
Clarify the 0.15 mm hole definition and its applicable board thickness and plating. Provide interface routing, connector dimensions, impedance targets and ESD/environmental requirements. No hole dimension is entered as a finished-hole limit until its definition is confirmed.
Mark which edges must be plated and which must remain isolated. Include slot/edge drawings, bevels, creepage clearances, finish and connector mating tolerances. Obtain the panel route and inspection proposal before assuming all cut edges are plated.
Supply the castellated-hole geometry, pad wrap, plated wall and burr requirements together with the mating assembly drawing. Specify whether electrical testing is performed before or after separation from the panel.
Define nickel underplate, gold process, contact force, mating material and the required cycle/environment test. The thickness statement does not identify hard gold or prove a service-life cycle count.
Release the mask boundary/registration drawing, OSP specification, permitted thermal exposure and assembly/storage conditions. Define which surfaces require finish and which must remain masked; this is a fabrication example, not a populated appliance.
The switch-board page states gold thickness ≥0.05 µm and claims wear resistance. It does not name hard gold, the nickel underplate, contact loading or a validated cycle count. Put those requirements into the contact design and acceptance plan.
The two-colour appliance example instead concerns mask registration and OSP. Keep the mask boundary, solderable area, storage and assembly exposure in the drawing. Neither an attractive board photograph nor an automotive application name establishes qualification for your programme.
The USB example’s 0.15 mm minimum hole has no explicit drilled/finished definition. It remains a source note rather than a finished-hole filter value.
The original equipment galleries separately label exposure, drilling, copper deposition, electroplating, etching, character printing and OSP. The labelled automatic laser photoplotter produces imaging artwork; it is not evidence of a laser-drilling or HDI microvia process.
For thick or asymmetric copper, discuss image compensation, registration, copper build-up and press/drill controls. The newer gallery includes isolated equipment product illustrations; those do not independently demonstrate installation or utilisation. The photographs here come from the corresponding workshop-labelled entries.
Specify the released netlist, open/short acceptance, test coverage and report format. For impedance work, define coupon design, measurement method, reference stack and lot reporting. For plated edges, capped vias and heavy copper, agree cross-section locations and dimensional/finish inspection. A machine name does not establish that every board receives the same inspection.
The official contact and licence identify the Guangde Economic Development Zone, Planning Road No. 1. The city’s 11 August 2023 police inspection publication matches the legal name, credit code 91341822082222087P and address. Its 23 June 2023 “no issues found” result concerns that police inspection; it is not a PCB process or product-quality approval.
The 2024 first-quarter environmental permit table also identifies the entity as electronic-circuit manufacturing. The displayed permit period ends on 22 July 2025, so that historical table is not presented as a current permit.
A 6 July 2026 occupational-health notice lists the same entity/address and records that required occupational-health examinations were not conducted. Its result column reads “无”; the record does not establish current remediation, a PCB-quality verdict or a blanket safety clearance. For programme due diligence, request the relevant current records and corrective-action status.
The displayed NQA IATF copy names the Guangde entity and printed-circuit-board manufacturing, certificate T84055 / IATF 0573930, valid 25 May 2025–24 May 2028. Product design is excluded. This describes the copy’s stated scope and dates; it is not a live issuer-status verification or approval of an individual board.
The website’s UL screenshot names E475783 and the Guangde entity at No. 1 Guihua First Economic Development Zone. It is a manufacturer-hosted Product iQ copy last updated 15 May 2023, with separate single-layer and multilayer constructions. Do not apply its flame/thermal rows to every catalogue specimen or treat it as a current independent registry check.
The product-certification gallery has separate CQC documents for PCB constructions; these are not blanket approval of an assembled charger, vehicle controller or all laminates. The environment and occupational-health copies have their own management-system scopes. Request a readable current issuer record matching the producing site and construction required by your programme.
The high-tech-enterprise copy is dated 28 October 2025 and states a three-year period. This is a company recognition document, not proof of board geometry, automotive customer qualification or production yield.
Reviewed 9 October 2026 against individual official product and equipment pages, their corresponding original photographs, displayed document copies and original Guangde government records. Product notes remain tied to their own examples; catalogue geometry is not inferred from photographs.
Individual review dated 9 October 2026. Local copper, plating zones and stack descriptions stay with their individual catalogue examples. Equipment photographs are distinguished from studio illustrations; government inspection records are not universal product-quality certification.
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