MANUFACTURING CAPABILITY

RF hybrid PCB — 2 to 14 layers

Official sources reviewed2026-09-21 · Independently listed
PROCESS WINDOW

RF hybrid PCB — 2 to 14 layers

RF hybrid range only. General 30-layer, fine-line and drilling ceilings are not assumed to apply simultaneously to RF mixed-material boards.

CONFIRM BEFORE QUOTING

Which laminate grade, copper profile, stack-up and RF measurement criteria are included in the quotation?

Read the technical conditions →
01 / COMPANY

Manufacturing context

Shangjihong Circuit lists rF hybrid PCB — 2 to 14 layers in its official manufacturing documentation. RF mixed-material range: 2–14 layers. Material families listed: PTFE, FR-4 and high-Tg laminates. General manufacturing method: Film imaging and LDI; process assignment to be confirmed. RF hybrid range only. General 30-layer, fine-line and drilling ceilings are not assumed to apply simultaneously to RF mixed-material boards. Which laminate grade, copper profile, stack-up and RF measurement criteria are included in the quotation?

Official company source reviewed
Manufacturing focus
RF and microwave boards · Mixed-material multilayers · Quick-turn samples
Published footprint
Guangdong
Listing and account
Independently researched · factory account not claimed
Official catalogue image from Shangjihong Circuit. The pictured board does not establish a combined process limit.
Official catalogue image from Shangjihong Circuit. The pictured board does not establish a combined process limit. Official manufacturer image
02 / TECHNICAL PROFILE

RF hybrid PCB — 2 to 14 layers

Manufacturer reported

RF hybrid range only. General 30-layer, fine-line and drilling ceilings are not assumed to apply simultaneously to RF mixed-material boards.

Layer count
2–14 layers
Line / space
Not disclosed for this profile
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
RF mixed-material range2–14 layers
Material families listedPTFE, FR-4 and high-Tg laminates
General manufacturing methodFilm imaging and LDI; process assignment to be confirmed
Technical sourcesjhpcb.com · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. Shangjihong Circuit — product and technical documentationhttp://www.sjhpcb.com/manufacturing-capacitySource checked 2026-09-21
    Official website
  2. Shangjihong Circuit — company informationhttp://www.sjhpcb.com/Source checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which laminate grade, copper profile, stack-up and RF measurement criteria are included in the quotation?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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