MANUFACTURING CAPABILITY

Conventional printed circuit board service

Official sources reviewed2026-09-21 · Independently listed
PROCESS WINDOW

Conventional printed circuit board service

Only unambiguous material and thickness entries are used. Conflicting line-width units are excluded from numerical filters.

CONFIRM BEFORE QUOTING

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Read the technical conditions →
01 / COMPANY

Manufacturing context

GoFortune Technology lists conventional printed circuit board service in its official manufacturing documentation. Substrate thickness: 0.4–3.2 mm. Copper foil: 0.25–3 oz. Laminate families: FR-1, FR-2, FR-4, FR-5, CEM-1 and CEM-3. Surface processes: Nickel/gold plating, HASL, OSP and preflux. Only unambiguous material and thickness entries are used. Conflicting line-width units are excluded from numerical filters. Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Official company source reviewed
Manufacturing focus
Single-sided and multilayer boards · Huizhou production · Multiple laminate families
Published footprint
Guangdong
Listing and account
Independently researched · factory account not claimed
Official catalogue image from GoFortune Technology. The pictured board does not establish a combined process limit.
Official catalogue image from GoFortune Technology. The pictured board does not establish a combined process limit. Official manufacturer image
02 / TECHNICAL PROFILE

Conventional printed circuit board service

Manufacturer reported

Only unambiguous material and thickness entries are used. Conflicting line-width units are excluded from numerical filters.

Layer count
Layer range not disclosed
Line / space
Not disclosed for this profile
Finished hole
Not confirmed
Impedance
Not disclosed for this profile
Conditions and published construction
Substrate thickness0.4–3.2 mm
Copper foil0.25–3 oz
Laminate familiesFR-1, FR-2, FR-4, FR-5, CEM-1 and CEM-3
Surface processesNickel/gold plating, HASL, OSP and preflux
Technical sourcegofortunepcb.com · Manufacturer specification

These are separate published limits, not a promise that every combination is manufacturable. Unknown values are excluded from numerical filtering.

03 / EVIDENCE REGISTER

Know what has been checked.

The website review establishes the source of a statement. Independent UL ownership, equipment and material checks are tracked separately.

UL ownership

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Legal holder, manufacturing address and current UL recognition.

Equipment & in-house processing

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Machine inventory, location and evidence that the relevant process runs at the quoted site.

Material traceability

Not independently verified

No supporting record has been reviewed for this category.

Qualification request: Laminate grade, supplier documentation and traceable production-batch records.

04 / SOURCE NOTES

Sources & review record.

Reviewed 2026-09-21. Manufacturer pages can change; confirm the current revision when requesting a quotation.

  1. GoFortune Technology — product and technical documentationhttp://www.gofortunepcb.com/sor.htmlSource checked 2026-09-21
    Official website
  2. GoFortune Technology — company informationhttp://www.gofortunepcb.com/Source checked 2026-09-21
    Official website
  3. GoFortune Technology — company informationhttp://www.gofortunepcb.com/products.htmlSource checked 2026-09-21
    Official website

Company names and images identify the source manufacturer. Listing does not imply endorsement, partnership, account participation or completion of a factory audit.

05 / PROCUREMENT NOTES

Make the first technical conversation useful.

PROFILE-SPECIFIC QUESTION

Which stack-up, laminate grade, finished copper and acceptance criteria will be used for this board?

Attach the manufacturing brief

Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.

Define acceptance

Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.

Confirm the recipient

Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.

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