A named laminate is useful only when its layer position is clear.
Kunshan Unistar Electronics — 昆山旭发电子有限公司 — describes its own establishment in 2003 and a business lineage linked to Circuit-Tech dating to 1991. Its contact address is 900 Hanpu Road, Kunshan. The catalogue supplies specific layer counts, HDI structures and material designations for automotive, industrial, data-centre and medical boards, so a buying enquiry can begin with a real construction rather than a generic “high-quality PCB”.
The manufacturer labels this example 1N1 HDI and mixed materials. Request the stack with each material assigned to a layer or bonding function, dielectric thickness, copper and the approved lamination sequence. Do not treat all eight layers as RO3003 or assume that the material list is a complete stack specification.
Release RF launches, reference planes, impedance coupons and measurement conditions. Ask which RF or electrical results accompany shipment; the catalogue does not give an operating frequency, insertion-loss result or routing minimum for this specific board.
Identify every back-drill group by side, tool diameter, target layer, depth datum and allowed remaining stub. Agree the breakout and keep-out conditions around adjacent copper. Ask for depth verification and channel acceptance on the released material stack; “multiple back-drill specifications” is not a numeric residual-stub limit.
AI server · 22 layers · EM-528 · HDI 2N2 / multiple back-drill specifications.
Twenty-two-layer server route
Release the 2N2 build-up and back-drill drawing together, including via fill/cap acceptance, stack symmetry, copper and test access. Confirm how the proposed process controls accumulated registration and depth tolerance. The product’s 22-layer label does not mean it uses the general table’s any-layer construction.
Ask for an engineering answer, not just a layer count.
Which laminate grade, resin/glass construction and thickness define each channel?
Which coupon, impedance target and measurement method will be used?
Which back-drill groups are checked, and how is the remaining stub recorded?
Which changes require a new stack or customer approval before a repeat lot?
The same data-centre catalogue includes an eight-layer 1N1 optical-module board labelled NP-175. It is a separate construction; its material and HDI notation should not be transferred to the GPU or server examples.
MEDICAL AND INDUSTRIAL / CONTACTS, TEST AND DOCUMENTATION
Different interfaces need different acceptance records.
Define the 4N4 stack, contact or connector finish, mechanical interface and board-level electrical acceptance. Agree handling, cleanliness and traceability requirements for the delivered bare board. This is a manufacturer-labelled application example; it does not establish sensing performance or regulatory clearance of a finished medical device.
Specify the carbon artwork, registration, thickness or resistance acceptance and the mating contact. Agree abrasion or actuation testing when required by the design. Keep the carbon print zone separate from solderable finishes. The catalogue supplies no resistance, life-cycle or device-safety result.
Release connector positions, mounting datums, copper and environmental acceptance for the actual enclosure and assembly. Confirm board identification, electrical-test coverage and the records accompanying a repeat lot. The application label does not supply a temperature rating or a board-specific hole minimum.
READ THE COLUMN HEADING / READ THE PROCESS FAMILY
Annual development figures and aluminium sample limits are separate.
The ordinary-board, HDI and miniLED images use 2024 / 2025 columns. The aluminium-base image uses volume / sample columns. Their heading and process family matter; do not turn all four tables into one “minimum rule” for every catalogue product.
HDI · 2024 / 2025
Layers
22L (Any-layer), both columns
Board thickness / maximum size
0.3–3.2 mm / 620 × 620 mm, both
Inner and outer line / space
2 / 2 mil → 1.4 / 1.4 mil
Copper range
⅓–1.5 oz → ⅓–2 oz
Mechanical drilling minimum
0.15 → 0.10 mm
Laser drilling minimum
3 → 2 mil
Blind-hole aspect ratio
1:1, both columns
Aluminium · volume / sample
Layers / maximum size
Single / multilayer; 620 × 722 mm, both
Inner and outer line / space
4 / 4 mil volume; 1.4 / 1.4 mil sample
Mechanical drilling minimum
0.30 mm volume; 0.10 mm sample
Aluminium thickness
0.58–3.0 mm, both
Insulation thickness
Minimum 2 mil, both
Thermal conductivity notation
1–3 W/(m·K), both
Outline tolerance
±0.10 mm volume; ±0.075 mm sample
The ordinary and miniLED charts also list 0.3–3.2 mm board thickness, a 620 × 722 mm maximum with 620 × 620 mm in the HDI note, and 2025 inner/outer line and space of 1.4 mil each. Their 2025 copper range stops at 1.5 oz, unlike the HDI chart’s 2 oz. Confirm the intended process family, copper definition and present production window.
Mechanical and laser drilling are not stated finished plated-hole sizes. The general chart’s 22L Any-layer entry is not the same claim as the catalogue’s 22-layer 2N2 server. The aluminium chart’s conductivity range needs an exact material grade and test basis; it is not a measured thermal result for the selected radar, server or instrument board.
The process page names immersion tin, immersion silver, immersion gold, OSP, gold plating, selective finishing, nickel/palladium/gold and HASL. Release the exact finish, zones, thickness and shelf-life requirements. These general finish routes do not establish the finish on every photographed board.
MATERIAL APPROVAL / TEST COVERAGE / DATED IDENTITY
Close the gap between a sample and a repeat production lot.
Material and process control
The quality page describes an approved vendor list, supplier assessment, manufacturing feasibility review and process monitoring from sample to volume production. Ask which exact laminate grades and substitutions are approved, who releases the stack and which changes require customer review. The company says OA holds process data and ERP enables batch traceability; request the records that will identify your actual shipment.
Inspection and electrical access
The equipment page labels online inner/outer AOI, blind-hole inspection, VCP and pulse plating, LDI, ATG A8 flying-probe testing, hole inspection and AVI. The corresponding machine photos are manufacturer listings, not calibration certificates or proof of inspection on your lot. Specify electrical limits, fixture or flying-probe coverage, coupons and microsections in the acceptance plan.
Response and shipment records
The quality page describes outgoing inspection to customer specifications, reliability testing and abnormality response. Agree the actual sampling, report contents and response timetable in the purchase terms. The website’s four-hour initial response and one-to-three-day failure-analysis language is a service statement, not a shipment or resolution guarantee for a particular order.
The Kunshan entity on the order
The contact page names 昆山旭发电子有限公司 at 900 Hanpu Road. A Kunshan ecological-environment notice dated 6 September 2019 names the same company and site in a proposed opinion on wastewater discharge standards. It supports the dated entity/address relationship; it is not a current operating permit or PCB quality certification. A May 2026 government consultation separately lists the company in the High-tech Zone among enterprises proposed to pass cleaner-production review. That consultation is not a finished product approval.
Request readable, current qualification documents.
The website recounts UL, ISO 9001/14001, IATF 16949, QC 080000, CQC, ISO 13485 and ISO 45001 milestones. The displayed images are principally certification symbols rather than readable holder, scope and expiry documents. Obtain the applicable certificate and current issuer status for the contracting site; for UL, obtain the file and applicable board construction. No active certificate or factory-owned UL badge is issued from those symbols.
For your first quotation, choose the construction above, identify the required stack and interface, and attach the back-drill or contact-zone drawing when relevant. Request the named material, engineering exceptions, sample-to-volume release plan and shipment test records. This gives the factory a measurable brief and gives your team an answer it can compare.
SOURCE TRAIL
Sources behind this profile
Individually researched 8 October 2026. Six original catalogue photographs are paired with their own adjacent layer, construction and material text. Annual chart figures are not relabelled prototype/volume or silently transferred into product filters. Buyer release questions are editorial guidance; manufacturer quality milestones and government consultations are kept within their actual evidence scope.
