Release the flex stack
Define PI, copper type and thickness, coverlay, shielding or other added films. Identify the bend zone and which areas must remain free of components or reinforcement.


MANUFACTURER DOSSIER
苏州市华扬电子有限公司 · Jiangsu
Suzhou Smartron Technology — 苏州市华扬电子有限公司 — describes a business founded in 1998 that supplies flexible circuits and surface-mount products. Its company account says it became a wholly owned subsidiary of Hongxin Electronics in 2022. The contact page places the company at 50 Muxiang Industrial Area, Huangqiao, Xiangcheng District, Suzhou. Its catalogue is organised as single-sided, double-sided and multilayer FPCA + HOT-BAR, with notebook lighting, phone antennas, automotive and signal-interconnect examples.
For this supplier, the useful starting point is the delivered assembly: bare FPC, populated flex, or a flex already joined to another part. Send the mechanical drawing, stack, component list and joint drawing with the electrical requirements. A layer count alone leaves the stiffeners, coverlay openings, component orientation and joint inspection unresolved.
Define PI, copper type and thickness, coverlay, shielding or other added films. Identify the bend zone and which areas must remain free of components or reinforcement.
Identify supplied or procured components, fiducials, panel handling, component orientation and test points. Agree whether the quotation includes SMT, cleaning and inspection.
Identify the mating part, land pattern, fixture datums and joint acceptance. Agree the approved joining process and inspection record; the catalogue label does not provide a universal time, temperature or pressure recipe.

Release the LED binning, colour and brightness acceptance, drive current, polarity and completed-keyboard fixture. Agree how populated-panel handling prevents distortion or component damage. The component dimensions are not the PCB thickness or a stated pad pitch. The original panel also says a 0.2 mm minimum hole; it does not define this as the finished plated-hole diameter.

The manufacturer lists PI + RA copper + white coverlay + aluminium sheet, 0.16 mm board thickness, a 37 × 235 mm outline, 0.4 / 0.2 mm line/space and OSP. Keep the aluminium sheet in the assembly specification; this label does not establish a metal-core PCB construction or a measured thermal resistance.
Define attachment, thermal contact, connector access and installed bend geometry. Request the assembled-light inspection and environmental tests your lamp requires. The catalogue gives no aluminium thickness, LED operating temperature or finished-lamp approval.

PI, ED copper and coverlay; 45 µm copper, 0.18 mm board thickness, 69 × 56 mm, gold plating. The printed line/space is 0.6 / 0.10 mm. It is retained exactly, rather than changed to a more impressive-looking value.
Release the antenna/coil artwork, final housing and mating interface. Agree how the completed assembly will be checked for its intended charging or communication function. No charging power, RF tuning result, shielding arrangement or dynamic-flex rating is supplied for this example.

PI, ED copper and coverlay; 0.16 mm thick · 398 × 55 mm, 0.3 / 0.2 mm line/space and OSP. This is a manufacturer-labelled automotive application; its title does not supply a voltage, current, insulation rating or functional-safety qualification.
State the installed bend, soldering sequence, environmental exposure and insulation/electrical test. Ask which sample and production records must accompany the automotive release, and identify the contracting production site.

PI + RA copper + coverlay + shielding film; 0.3 mm thick, 19 × 49 mm, 0.06 / 0.07 mm line/space and chemical gold. The printed 0.1 mm hole minimum is not expressly a finished plated-hole value.
Release shield termination, connector geometry and the controlled electrical stack. Agree continuity, channel or EMI acceptance on the finished assembly when required. Shielding film is not a measured EMI result, and the catalogue supplies no impedance target or insertion-loss report. Identify whether the intended bend is a one-time installation or repeated motion.

PI + RA copper + coverlay; 0.10 mm thick, 35 × 36 mm, 0.08 / 0.06 mm line/space and chemical gold. The supplier names the application ACF test; this is not a disclosed adhesive grade or complete bonding process.
Provide the mating-pad map, adhesive requirement and controlled bonding trial. Specify contact-resistance acceptance, inspection and reliability checks. Agree which trial conditions and results are retained before a repeat production release.
The equipment gallery names roll-to-roll laser and automatic exposure equipment, automatic coverlay lamination, automatic steel-stiffener placement and chamber plasma cleaning. Define coverlay openings, stiffener material/thickness, adhesive and position on the released drawing. Ask for dimensional and alignment records on the actual part.
Listed equipment includes high-speed placement, precision dispensing and placement/die bonding, AOI, X-ray inspection and dimensional measurement. The second gallery also lists a Radiant dual-station grey-scale tester and a push-force tester. Specify the optical, placement, joint and mechanical checks appropriate to your assembly; machine names alone do not establish tested brightness or bond strength.
The galleries include RoHS testing, metal-ion analysis, ultrasonic cleaning and ESD monitoring. Request the material declarations and actual test method/report your order needs. The software diagram describes ERP-to-SAP and OA upgrades, but explicitly labels MES under construction. Confirm the system currently used to retain component, material and inspection lot history.
For a repeat order, request the approved stack, component and material substitutions, fixture revision, inspection plan and sample-to-production release. Define which engineering changes require approval and how the shipment identifies the relevant manufacturing lot. The website’s “high quality, quick delivery” slogan is not a lead-time commitment; put the quantity, approved materials and promised delivery date in the quotation.
A Guosen Securities verification opinion hosted by the Shenzhen Stock Exchange in May 2022 identifies the FPC production project in Muxiang, Huangqiao and discusses the company’s history and environmental procedures. Printed pages 32–33 describe customer qualification through initial review, site audit, sample approval and supplier acceptance. This is a dated transaction record, not proof that your product or current supplier onboarding has passed those stages.
The website displays a Quality Austria IATF 16949 copy for 苏州市华扬电子有限公司 at Muxiang 50, dated 11 February 2025–10 February 2028. Its scope is printed-circuit production and excludes product design. The displayed ICAS ISO 9001, ISO 14001 and ISO 45001 copies show expiry dates of 13 September 2027, 23 June 2027 and 11 March 2027 respectively. Confirm the current issuer record and coverage of the contracting site.
The displayed UL Product iQ printout names Suzhou Smartron Technology Co Ltd, Muxiang 50, E354493, flexible-material printed wiring constructions. It was last updated 23 October 2023 and distinguishes listed construction types and conditions; it does not approve every flex product pictured here. The QC 080000 copy shows registration expiry on 30 July 2026 and is historical at this review. Request an updated document when that requirement applies.
These are readable manufacturer-hosted copies, not current issuer verification by PCBVerified. For your selected construction, request the applicable site, scope and UL type when required, plus the stack, assembly drawing and shipment inspection records. Start with the relevant product above so the factory can respond to a concrete interface and test plan.
Individually researched 8 October 2026. Six original product panels were read separately; their numerical text is transcribed for each example. Unspecified plated-hole and impedance values remain unknown. Buyer assembly and release questions are editorial guidance. Historical reports, planned MES and certificate copies remain distinct from current independent verification.
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