MANUFACTURER DOSSIER
万安山美电子有限公司 · Jiangxi
万安山美电子有限公司 / Shanmei Electronics describes single-sided, double-sided and multilayer circuit-board production in Wanan, Jiangxi. Its catalogue contains separate double-sided and four-layer examples alongside display, vehicle-control and lighting applications. For a buyer, the useful starting point is the actual board construction and acceptance package—not a list of industries that might use a PCB.
Begin with the drilled and finished-hole definitions, connectivity, laminate and finish. Double-sided does not by itself establish plated-through-hole dimensions or a copper weight.
Compare the two examples →Release the stackup, reference planes and internal connections. Four layers are explicitly named for two examples; their dielectric, impedance and hole specifications are not interchangeable.
Prepare the stack →Display contacts, vehicle controls and a light source need different electrical, mechanical and qualification information. Use the catalogue title to start the enquiry, then supply the design.
Find the release questions →The company narrative says the business began in August 1999 and reports a 25,000 m² factory. These are manufacturer statements. The visible site history and company description disagree about the relocation year; the producing entity and current Wanan address belong on the actual quotation.
Specify the four-layer stack, copper distribution, dielectric thickness and reference planes. For controlled impedance, release targets, tolerances and coupon requirements rather than relying on the layer count.
Define the board outline, cut-outs, mounting tolerances, component-side requirements and internal-layer connections. Confirm a stackup and test netlist for this design rather than copying the other four-layer example.
Supply drill and finished-hole definitions, plated versus non-plated holes, annular rings and outline dimensions. Confirm the netlist and test method; the photograph is not a measured hole table.
Release the base material and coating/finish explicitly, together with soldering exposure and inspection class. The photograph’s colour cannot establish CEM-1, CEM-3, FR-4 or a laminate brand.
The individual titles explicitly supply four layers or a double-sided construction. Their descriptions otherwise explain what a PCB is; they do not provide a measured stackup, minimum line/space, copper thickness, finished hole or impedance tolerance. Only the explicit layer construction is available for numeric matching here.
For a four-layer board, specify the copper on each layer, dielectric and total thickness tolerances, via connectivity, registration and any impedance coupon. For a double-sided board, distinguish plated holes, non-plated holes and slots, and agree the electrical test file. Do not derive material grade from solder-mask colour or infer dimensions from a photograph.
Provide the connector drawing, board thickness at the contacts, finish and plating limits, route/outline and any impedance requirements. Ask whether delivery is the bare PCB or an assembled display controller.
Define the actual vehicle application, environmental conditions, stackup and qualification package. Specify current certificate scope and programme approval; the application title alone does not approve a safety-critical design.
State the light source, power, laminate/core and heat path in the drawing. Agree mounting, soldering and thermal/electrical qualification. Do not assume an aluminium base from the lighting application name.
The light-source page supplies a corresponding original board image, but no metal-base construction, dielectric thermal conductivity, LED power or operating temperature. State the laminate/core, copper, heat path, mounting and acceptance tests in the order package. If a metal base is required, obtain a material and construction proposal before assuming this example covers it.
The display text describes controller functions, while the company’s main business description concerns circuit-board fabrication. The power-control and “process board” pages also show populated assemblies. Those illustrations do not establish an in-house SMT service, component supply or a tested finished controller. Make the delivery boundary explicit in the RFQ.
Use this as a bare-board enquiry: supply the drawing revision, panel, material grade, copper, finish, netlist and test requirements. Do not use the generic PCB definition as a dimensional specification.
Send the fabrication files, outline drawing, stackup and material specification with a single revision. Include panel and tooling requirements, copper distribution, finish, drill and finished-hole tables, quantities and the intended acceptance criteria.
For vehicle or medical use, identify the actual programme, environmental conditions, traceability and required approvals. An industry label is not approval of a specific design or safety-related application.
Prepare the PCB engineering brief →The equipment gallery labels drilling/routing, film exposure, LDI automatic exposure, developing, pattern plating and solder-mask work. Ask which imaging route is assigned to your board, how registration is controlled and how plating and mask acceptance are checked.
The gallery names processes and shows their corresponding photographs. It does not supply validated registration accuracy, drill capability, machine quantity or your order’s process settings. The equipment list is useful for the DFM discussion; a photograph is not a combined fabrication limit.
Shanmei’s gallery distinguishes flying-probe, manual and automatic testers, and separately shows a laboratory. Agree the test method, released netlist, open/short thresholds, report format and sampling or unit coverage. A tester name does not establish that every supplied board receives the same test.
For multilayer work, specify cross-section or coupon deliverables, plated-hole requirements and traceability of the test results. For contact surfaces, define finish, visual defects and acceptance limits before production. The laboratory photograph alone does not establish accredited testing, calibration status or any particular reliability result.
Two official labels reuse the same original photograph: automatic film lamination and automatic board flipping. Treat this as a catalogue attribution conflict, not independent evidence of two different installed machines. Request a current route/inventory if the assigned process is a purchasing condition.
The original process-capability graphic could not be read during this review because its official image endpoint refused access. Its numbers are not reconstructed from old summaries, other factories or machine names. A drawing-specific DFM proposal must supply the applicable limits.
The company description places the move from Meizhou to Wanan in 2022, while its history page places the same move in 2020. The description reports 1.8 million m² annual capacity; the common footer instead says 150,000 m² annual capacity. These discrepancies are not converted into an assumed monthly rate or reserved production capacity.
Ask for the legal producing entity, full current factory address, process route, available capacity for your construction and delivery schedule. If a qualification relates to a previous site, confirm its current scope and address rather than transferring it to the Wanan order.
The national standards platform lists 万安山美电子有限公司 among the drafting organisations for 20253161-Z-339, “Appearance inspection method for plated surfaces on printed circuit boards,” registered 14 July 2025. At this review the project is shown in the approval stage.
This is an exact-entity record of participation in a guidance-document project. It does not certify Shanmei’s factory, approve the catalogue products, or establish that the draft is a published contractual acceptance standard. Specify the agreed standard and edition in your own quality agreement.
The company narrative claims ISO9001, ISO14001, UL, RoHS, CQC and IATF16949, and the document galleries list related copies. The corresponding original document images were not accessible during this review; current file holder, certificate number, validity and site scope are not independently established here. No current certification badge is inferred from the gallery titles.
For a regulated or customer-controlled programme, request readable current certificates and issuer records for the actual contracting/producing entity, plus any required programme approval. General “IPC” or “MIL” wording on the company page is not a named product acceptance class, edition or qualified military process.
Reviewed 9 October 2026 using individual catalogue pages, original process photographs and the national standards record. Some numerical process and certificate originals were inaccessible. Only explicit sample layer constructions are used in numerical matching. Application illustrations do not establish geometry, current certification or an in-house assembly service.
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