The interface changes the drawing and the acceptance test.
The group’s Technology Strengths page illustrates three useful FPC constructions. Their parameters belong to those examples. They are not proof that the Hunan factory produced the photographed drawing; confirm its allocation before releasing an order.
Three-layer flying-lead FPC

- Construction
- 3 layers
- Line / space
- 2 / 2 mil
- Via
- Blind via
- Finish zones
- Soft gold on leads; soft ENIG at component and exposed areas
The drawing needs a plating map.
Identify each exposed lead, its length and support, the mating or bonding method, and the transition into the covered circuit. Release the intended finish zones and thicknesses separately. A nearby double-sided example uses hard gold at the ZIF interface and tin at the flying lead; that different finish must not be substituted into this three-layer example.
Define lead position, coplanarity and connection acceptance, along with the actual bend duty. The catalogue does not give a qualified bend radius, cycle life or plating thickness for this image.
Dimple-contact FPC

- Published family
- Single- or double-sided
- Contact finish
- Electrolytic nickel & hard gold
- Maximum dimple height
- 0.05 mm
The contact geometry belongs with the mating assembly.
Specify the dimple datum, height and tolerance, contact pattern, mating surface, compression/force requirement and finish thickness. Agree how resistance, wear and environmental exposure will be tested on the assembled interface.
The source’s corrosion-resistance description supplies no test duration or acceptance result. It is not a replacement for the contact’s actual reliability specification. The 0.05 mm figure is dimple height, not board thickness or minimum hole diameter.
Double-sided heater FPC

- Construction
- Double-sided
- Line / space
- 4 / 4 mil
- Finish
- ENIG
Release the electrical and thermal operating conditions.
Supply voltage, target resistance/power, heated area, temperature profile, mounting interface and sensor/control arrangement. Define hot spots, dielectric isolation, resistance tolerance and the measurement conditions for the completed assembly.
The published example does not supply watt density, copper thickness, maximum temperature or thermal cycling results. A 4 mil routing example alone cannot establish a safe heater operating point.
Choose where the flex joins the rest of the product.
MFS names anisotropic conductive paste and film bonding, and illustrates camera-module-on-flex, flex-on-glass, flex-on-board and flex-on-flex routes. That range gives you a useful starting point for an assembly discussion; it does not establish a universal bond pitch, pull strength or assembly yield.
Fabricated flex delivery
Release the circuit revision, material stack, exposed contact dimensions, stiffeners, finish map and bend installation. Define whether electrical inspection applies before or after the next assembly step.
Bonded or assembled delivery
Identify the mating glass, board or camera module, adhesive/bond material, positional alignment, assembly sequence and test access. Agree which MFS entity/site performs the work and who owns fixture development, incoming-component acceptance and final functional testing.
The technology page’s separate PCB section describes heavy copper up to 10 oz and up to 32 layers. Those rigid-board group statements are not added to this Hunan flexible-circuit profile’s selectable limits.
Use identity evidence to ask better process questions.
Hunan’s industry department listed 湖南维胜科技有限公司 in its 29 August 2024 public notice for an AI application involving product-defect analysis and process optimisation. This independently names the enterprise and the proposed application; it is not a board-quality certificate or a measured defect-rate result.
Victory Giant’s 2025 ESG report, published through HKEX in April 2026, discusses its MFS group and explicitly names MFS Technology (Hunan). The report is current group context, not a technical approval for a particular flex order. The older MFS website’s incorporation, certification and operating statements should retain their own scope and date.
The Hunan company tab lists ISO/TS and compliance claims but does not provide the current certificate number, expiry and scope needed for an order-specific approval. If medical, automotive, UL or restricted-substance documentation is required, obtain the current records for the contracting entity, manufacturing address, applicable construction and supplied material.
Match the equipment to the acceptance method.
The group facilities panels name ESI UV and Hitachi CO₂ laser drills, Orbotech LDI, ATG/Surpass flying-probe testers, a Condor Sigma bondtester, a dynamic hinge/flip tester and a hi-pot tester. These are a published group equipment list without a complete model, quantity or plant allocation. For a bonded flex, agree the bond-strength method and sample plan; for a repeated-bend flex, the radius, motion and electrical monitoring; for a heater, the insulation and resistance acceptance. Request the proposed site’s actual equipment and calibration records for those tests.
Make the first review specific.
Choose flying lead, dimple or heater; include the complete flex stack and mechanical drawing, interface/finish map, installation or repeated-bend duty, required assembly scope, acceptance tests and intended production entity. Ask for a marked-up drawing and sample-to-volume plan tied to those inputs.
Prepare the engineering inquiry →Sources behind this profile
Individually researched on 8 October 2026. The source tabs were opened and read. Group catalogue examples, Hunan-site statements and dated government/issuer records remain distinct; none is presented as PCBVerified factory certification.
- MANUFACTURER / HUNAN TABEntity, site photograph and Hunan-specific technology statements ↗
- MANUFACTURER / CHINA TABHunan and PCB entities at the same Changsha address ↗
- MANUFACTURER / TECHNOLOGYFlying-lead, dimple, heater and bonding examples ↗
- MANUFACTURER / FACILITIESOpened drilling, imaging, inspection and reliability-test panels ↗
- MANUFACTURER / VALUE ADDEDDFM iteration, assembly procurement and electrical stack simulation ↗
- GOVERNMENT / 2024 PUBLIC NOTICEHunan industry department: enterprise and product-defect-analysis application, item8 ↗
- ISSUER / 2025 ESG REPORTVictory Giant’s MFS group and named Hunan entity, p8 ↗


