MANUFACTURER DOSSIER

MFS Technology (Hunan) Co., Ltd.

Official sources reviewed2026-10-29
COMPANY FACTS

Company facts at a glance

Chinese legal name
湖南维胜科技有限公司
English name
MFS Technology (Hunan) Co., Ltd.; the parent’s Hong Kong prospectus also uses “Hunan Weisheng Technology Co., Ltd.” for identification
Short names
维胜科技 · MFS Hunan
Ownership and listing
Not listed itself. Since 30 November 2023 the MFS group belongs to Victory Giant Technology (HuiZhou) Co., Ltd. (胜宏科技), Shenzhen ChiNext 300476 and HKEX Main Board 2476 (listed 21 April 2026).
Founded
12 September 2003 (the MFS group in Singapore dates from 1988)
Registered address
No. 10 Dong’er Road, Changsha Economic and Technological Development Zone (Xingsha), Changsha, Hunan
Related plants
Sister company Hunan MFS Circuit Board Co. (湖南维胜科技电路板有限公司) uses the same address for heavy-copper rigid boards; Victory Giant counts both as its Changsha centre. Yiyang FPC and Melaka, Malaysia, belong to other MFS subsidiaries.
Capacity
No figure for this company or for Changsha alone. Victory Giant’s group FPC line had 655,000 m² capacity and 521,000 m² output in 2025 (H-share prospectus).
Process capability
Group website: 25/25 µm minimum line and space, 50 µm laser and 100 µm mechanical holes, rigid-flex up to 12 layers. The 32-layer and 10 oz figures belong to the sister rigid-board company.
Certificates on the website
ISO 9001, ISO 13485, ISO 14001, IATF 16949, QC 080000 and ISO 14064, without numbers or dates
UL files
No file is listed under a Hunan entity name. MFS files: E176102 (flexible, ZPXK2) and E132084 (rigid) held by MFS Technology (S) Pte Ltd, Singapore; E94919 held by MFS Technology (PCB) Co Ltd, China. Ask which file covers boards built in Changsha.

Checked on 29 October 2026 against Victory Giant’s 2025 annual report and 2026 H-share prospectus, the 2023 acquisition filing on CNInfo, the MFS website and UL iQ for Printed Wiring Boards.

FLEXIBLE CIRCUITS / CHANGSHA, HUNAN

Specify the connection, then the manufacturing entity.

MFS Technology (Hunan) Co., Ltd is the Changsha operation identified in the MFS group’s company and contact pages. Its Hunan tab describes ultra-thin and HDI work, including 25 μm line/space, stacked and solid vias, 50 μm microvias and customised circuitry. These are manufacturer-published site statements; they do not define a complete laminate, copper, bend or reliability envelope.

The factory is listed at 10 Dong Er Road, Xingsha, Changsha. The group separately names MFS Technology (PCB) Co., Ltd at the same address with a different telephone number. Specify the legal manufacturer and process allocation in the quotation; a shared address does not merge the two businesses.

Compare the three flex interfaces →
Factory photograph displayed on the official MFS Hunan company tab
Official Hunan-tab factory photograph. It establishes the image’s source association, not a current equipment inventory or inspection result.
CATALOGUE / CONNECTION-SPECIFIC EXAMPLES

The interface changes the drawing and the acceptance test.

The group’s Technology Strengths page illustrates three useful FPC constructions. Their parameters belong to those examples. They are not proof that the Hunan factory produced the photographed drawing; confirm its allocation before releasing an order.

01 / EXPOSED LEADS

Three-layer flying-lead FPC

MFS three-layer flying-lead FPC catalogue photograph and its lead close-up
Original group catalogue image, including the flying-lead close-up.
Construction
3 layers
Line / space
2 / 2 mil
Via
Blind via
Finish zones
Soft gold on leads; soft ENIG at component and exposed areas

The drawing needs a plating map.

Identify each exposed lead, its length and support, the mating or bonding method, and the transition into the covered circuit. Release the intended finish zones and thicknesses separately. A nearby double-sided example uses hard gold at the ZIF interface and tin at the flying lead; that different finish must not be substituted into this three-layer example.

Define lead position, coplanarity and connection acceptance, along with the actual bend duty. The catalogue does not give a qualified bend radius, cycle life or plating thickness for this image.

02 / PRESSURE CONTACT

Dimple-contact FPC

Original MFS dimple-contact flexible circuit collage
The complete source collage is retained. It shows a contact family rather than one identified production drawing.
Published family
Single- or double-sided
Contact finish
Electrolytic nickel & hard gold
Maximum dimple height
0.05 mm

The contact geometry belongs with the mating assembly.

Specify the dimple datum, height and tolerance, contact pattern, mating surface, compression/force requirement and finish thickness. Agree how resistance, wear and environmental exposure will be tested on the assembled interface.

The source’s corrosion-resistance description supplies no test duration or acceptance result. It is not a replacement for the contact’s actual reliability specification. The 0.05 mm figure is dimple height, not board thickness or minimum hole diameter.

03 / HEATING CIRCUIT

Double-sided heater FPC

MFS double-sided heater flex catalogue photograph with connection wires
Manufacturer catalogue photograph. No wattage, temperature or duty cycle is inferred from the visible leads.
Construction
Double-sided
Line / space
4 / 4 mil
Finish
ENIG

Release the electrical and thermal operating conditions.

Supply voltage, target resistance/power, heated area, temperature profile, mounting interface and sensor/control arrangement. Define hot spots, dielectric isolation, resistance tolerance and the measurement conditions for the completed assembly.

The published example does not supply watt density, copper thickness, maximum temperature or thermal cycling results. A 4 mil routing example alone cannot establish a safe heater operating point.

INTERCONNECT / ASSEMBLY RESPONSIBILITY

Choose where the flex joins the rest of the product.

MFS names anisotropic conductive paste and film bonding, and illustrates camera-module-on-flex, flex-on-glass, flex-on-board and flex-on-flex routes. That range gives you a useful starting point for an assembly discussion; it does not establish a universal bond pitch, pull strength or assembly yield.

Fabricated flex delivery

Release the circuit revision, material stack, exposed contact dimensions, stiffeners, finish map and bend installation. Define whether electrical inspection applies before or after the next assembly step.

Bonded or assembled delivery

Identify the mating glass, board or camera module, adhesive/bond material, positional alignment, assembly sequence and test access. Agree which MFS entity/site performs the work and who owns fixture development, incoming-component acceptance and final functional testing.

The technology page’s separate PCB section describes heavy copper up to 10 oz and up to 32 layers. Those rigid-board group statements are not added to this Hunan flexible-circuit profile’s selectable limits.

DATED PRIMARY RECORDS / ORDER QUALIFICATION

Use identity evidence to ask better process questions.

Hunan’s industry department listed 湖南维胜科技有限公司 in its 29 August 2024 public notice for an AI application involving product-defect analysis and process optimisation. This independently names the enterprise and the proposed application; it is not a board-quality certificate or a measured defect-rate result.

Victory Giant’s 2025 ESG report, published through HKEX in April 2026, discusses its MFS group and explicitly names MFS Technology (Hunan). The report is current group context, not a technical approval for a particular flex order. The older MFS website’s incorporation, certification and operating statements should retain their own scope and date.

The Hunan company tab lists ISO/TS and compliance claims but does not provide the current certificate number, expiry and scope needed for an order-specific approval. If medical, automotive, UL or restricted-substance documentation is required, obtain the current records for the contracting entity, manufacturing address, applicable construction and supplied material.

Match the equipment to the acceptance method.

The group facilities panels name ESI UV and Hitachi CO₂ laser drills, Orbotech LDI, ATG/Surpass flying-probe testers, a Condor Sigma bondtester, a dynamic hinge/flip tester and a hi-pot tester. These are a published group equipment list without a complete model, quantity or plant allocation. For a bonded flex, agree the bond-strength method and sample plan; for a repeated-bend flex, the radius, motion and electrical monitoring; for a heater, the insulation and resistance acceptance. Request the proposed site’s actual equipment and calibration records for those tests.

Make the first review specific.

Choose flying lead, dimple or heater; include the complete flex stack and mechanical drawing, interface/finish map, installation or repeated-bend duty, required assembly scope, acceptance tests and intended production entity. Ask for a marked-up drawing and sample-to-volume plan tied to those inputs.

Prepare the engineering inquiry →
SOURCE TRAIL

Sources behind this profile

Individually researched on 8 October 2026. The source tabs were opened and read. Group catalogue examples, Hunan-site statements and dated government/issuer records remain distinct; none is presented as PCBVerified factory certification.

  1. MANUFACTURER / HUNAN TABEntity, site photograph and Hunan-specific technology statements ↗
  2. MANUFACTURER / CHINA TABHunan and PCB entities at the same Changsha address ↗
  3. MANUFACTURER / TECHNOLOGYFlying-lead, dimple, heater and bonding examples ↗
  4. MANUFACTURER / FACILITIESOpened drilling, imaging, inspection and reliability-test panels ↗
  5. MANUFACTURER / VALUE ADDEDDFM iteration, assembly procurement and electrical stack simulation ↗
  6. GOVERNMENT / 2024 PUBLIC NOTICEHunan industry department: enterprise and product-defect-analysis application, item8 ↗
  7. ISSUER / 2025 ESG REPORTVictory Giant’s MFS group and named Hunan entity, p8 ↗
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