Jove PCB

Start with the electrical and mechanical job.

Jove is the brand of 深圳中富电路股份有限公司, the Shenzhen-listed PCB manufacturer identified as stock 300814 in its 2025 annual-report summary. Its portfolio includes multilayer, rigid-flex, HDI, metal-base and RF antenna boards. The useful distinction for a buyer is the manufacturing route: a moving flex connection, a power conversion stack and an antenna interface need different drawings, copper rules and acceptance tests.

The photographs below are original official product-family images. They show the families Jove presents; the technical tables describe process ranges rather than measured specifications of the pictured boards. The quoted figures remain attached to their source column, copper condition and hole definition.

One assembly, two mechanical environments.

The overview describes total constructions of 2–24 layers with a 1–6-layer flex region, symmetric or asymmetric flex-layer arrangements and possible dynamic-bend designs. The distinction matters: total board layers are not flex-region layers, and a rigid section’s copper schedule cannot simply continue through the bend.

First detailed table / sample column

Maximum 18 layers

First detailed table / volume column

Maximum 24 layers

Outer 3 oz routing / both columns

8 / 11 mil line / space

Inner 2 oz routing / both columns

6 / 5.5 mil line / space

The headline’s 40/40 µm statement is a separate fine-line claim. The detailed table conditions inner-layer routing on copper: at ⅓ oz it lists 2/2 mil sample and 1.5/1.5 mil volume, while outer ⅓ oz routing is 3/3 mil in both columns. These entries cannot be combined with 3 oz outer copper to quote an exceptionally fine, heavy-copper bend.

Release the rigid-to-flex boundary, adhesive/adhesiveless laminate choice, copper orientation, coverlay openings, stiffener drawing and connector mating thickness. For repeated movement, state bend radius, travel, duty cycles, temperature and how an assembled test coupon will represent the actual installation. The site mentions UL-qualified laminate combinations, but does not provide a file number on this page; an order still needs the applicable holder, construction and file scope.

The 34-layer headline includes a sample route.

Jove’s multilayer page describes energy products, planar transformers, embedded passives and copper-block thermal constructions. Its detailed table explicitly separates volume production from samples. That distinction is more useful for qualification than the single maximum-layer headline.

Volume column

Maximum layers

24

Inner / outer copper range

½–6 oz

Inner 6 oz line / space

14 / 14 mil

Outer 6 oz line / space

16 / 16 mil

Sample column

Maximum layers

34

Inner / outer copper range

½–12 oz

Inner 6 oz line / space

12 / 12 mil

Outer 6 oz line / space

14 / 14 mil

For a power converter or planar transformer, give winding topology, layer copper, dielectric insulation, terminal connections and the required isolation test. The table lists testing voltage maxima of 6,000 V DC / 5,000 V AC for volume and 10,000 V DC / AC for samples. Those are factory test-capability entries, not the working-voltage or safety rating of a delivered design; agree test duration, ramp, leakage criterion, coupon and applicable insulation requirements.

Back-drilling has its own conditions: volume diameter 0.4–1.0 mm with D+0.2 mm enlargement; sample diameter 0.4–6.35 mm with D+0.15 mm. Listed stub ranges are 0.05–0.25 mm volume and 0.05–0.20 mm sample. Release the reference plane, target layer, residual-stub measurement and protected layers together. The page’s general ±8% impedance headline differs from the detailed table’s ±10% volume / ±7% sample for differential impedance and single-ended targets ≥50 Ω. Use the negotiated order specification.

Specify how the microvia reaches its target.

The narrative supports 1+N+1 through any-layer HDI and mentions 14-layer any-layer functionality. The detailed chart has two identically labelled “specific capability” columns. It gives 4–24 versus 4–34 layers, up to five versus six lamination cycles, and first-column 1-N-1 / 2-N-2 / 3-N-3 versus second-column 4-N-4 and ELIC (12L) in addition. These columns are not labelled volume and sample. Ask Jove to identify the applicable process class rather than assigning the best values to all production.

Minimum inner line / space

50 / 50 µm · 40 / 40 µm

Minimum outer line / space

60 / 60 µm · 50 / 50 µm

Laser-hole entries

75 µm · 50 µm

Filled-laser-hole aspect ratio

≤0.8:1 · ≤1:1

Keep the left/right entries separate. The process-specific inner-line rows also pair “1.4 mil” with “40 µm” and “1.2 mil” with “35 µm”; the published unit pairs are not exact conversions. Ask engineering to issue one controlling dimensional unit. Minimum mechanical-drill entries of 0.20 and 0.15 mm are drill-bit dimensions, not finished plated holes.

Send the build-up drawing, stacked or staggered via arrangement, dielectric thickness by lamination, target lands and the required fill/cap construction. Request the microsection and reliability acceptance relevant to that construction. The overview mentions plated copper or copper-paste filling and thermal-management options; it does not establish that every fill route, embedded copper and finest routing can be made simultaneously.

Antenna manufacture needs its own release sheet.

Jove lists phase-shifter, sliding-contact, divider, calibration and other base-station antenna boards. The standard column covers single/double/three-layer boards and 0.2–2 mm thickness; the advanced column lists four, six and seven-or-more layers with 2–6 mm thickness. Its narrative separately describes delivered seven-layer 5G antenna boards. Treat that historical example and the general column as different scopes.

Plated line / space tolerance

Standard ±1.5 mil / advanced ±1.0 mil

Outline and slot tolerances

Standard ±0.10 mm / advanced ±0.075 mm

Specified PIM test bands

800 / 2100 / 2600 MHz

Named test instrument

Rosenberger

The table reports average PIM thresholds ≤−115 dBm (158 dBc) standard and ≤−117 dBm (160 dBc) advanced. These units are not interchangeable without the carrier conditions. Include carrier frequencies and powers, order of intermodulation, fixture, connectors, calibration, contact condition and acceptance statistic. They are process-chart claims, not an attached test report for the photographed board.

The material list includes Shengyi PTFE and PPE systems, Rogers RO4730G3 and other supplier grades. One multilayer row places RO4730G3+RO4450F and NYHP7300+NY6300 under a single supplier label; verify each laminate/bonding-sheet manufacturer and grade separately. Obtain the actual lot trace and stack-up. Standard/advanced thicknesses, maximum lengths and test bands do not establish a fully qualified combination for your antenna.

Name the plant on the engineering release.

The company introduction names Shajing and Songgang in Shenzhen and Hecheng in Heshan, Jiangmen, while still describing a planned Thai base. A newer original investor-relations record, dated 7 May 2026, discusses orders entering the Thailand factory and a stronger AI-power focus at Jiangmen. The older introduction therefore does not describe the full newer operating picture. Ask for the proposed fabrication entity, plant and route on the quotation; the global sales map mixes offices, agents and factories.

The official contact page separates business enquiries from investor relations and supplier procurement. A sales-office address is not automatically the manufacturing location. Keep the factory assignment and engineering contact in the PCBVerified RFQ conversation alongside the returned DFM and acceptance record.

Sources behind this profile

Reviewed 8 October 2026. Official product-family photographs and process tables are kept separate. Issuer filings establish the dated corporate record and reported plant direction; they do not independently certify the pictured boards or any combined manufacturing extreme.

1. Official companyJove company introduction ↗
2. Official processRigid-flex and flex tables ↗
3. Official processMultilayer and power process table ↗
4. Official processHDI structures and two-column chart ↗
5. Official processAntenna materials and PIM table ↗
6. Official contactBusiness, procurement and investor contacts ↗
7. Issuer filing2025 annual-report summary, 29 April 2026 ↗
8. Issuer filingFactory positioning and AI-power discussion, 7 May 2026 ↗
9. Official qualityManagement and named plant personnel ↗