MANUFACTURER DOSSIER
广德东风电子有限公司 · Anhui
广德东风电子有限公司 · Guangde Dongfeng Electronics describes an Anhui manufacturing operation established in 2014, with production beginning in 2016. Its official custom service covers double-sided and multilayer boards, alongside aluminium, ceramic and high-frequency board descriptions. The useful starting point is the captioned catalogue: it separates automotive plugged-hole work, industrial copper requirements, network impedance, connector contacts and RF materials.
The company lists small-batch and non-standard custom work. That service description is not a published minimum order, fixed quick-turn delivery or price. Use the matching example to open a technical enquiry, then agree the order quantity, engineering release and production slot.
The following images come from the official Chinese custom catalogue. “Automotive” identifies the manufacturer's application description; it is not evidence of approval by a vehicle brand, a PPAP release or a particular safety class.
Supply the blind-via stack and filling requirements. Confirm the via formation route, exact tin finish and lead-free requirement before approving a quote.
Specify mask reflectance, thickness and colour consistency, plus hole-plug acceptance. The white mask does not establish an aluminium substrate or thermal rating.
Confirm the copper distribution, current path and hole-plug plan. Supply the actual laminate and power/thermal acceptance rather than deriving a current rating from the photograph.
This is a different pictured case, not the Chinese EV board above. The English caption says “resistance to 4K V high voltage”. It does not provide waveform, duration, leakage threshold, insulation distances or a lot-linked test report. For that route, supply the required withstand-voltage test conditions and ask which construction and revision the claim concerns.
Ask for finished inner and outer copper and the copper-balanced stack. Do not transfer the separate English 2 oz example to this board.
Agree whether 2 oz is starting or finished copper, and define the plated finished-hole size. The aperture tolerance does not establish a minimum finished-hole diameter.
The numerical English image explicitly states 3.2 mm board thickness, inner and outer copper 2 oz and aperture tolerance ±0.05 mm. It does not supply an electrical layer count or say whether that aperture is drilled or finished after plating. The separate Chinese heavy-copper image gives no copper weight. Use the numerical case as a conversation starter, not as proof of every heavy-copper construction.
Send the controlled-impedance layer targets, reference planes, coupon drawing and report format. Specify a tolerance in the RFQ; the word impedance alone does not provide one.
Specify connector plating thickness, hardness, bevel and insertion duty, separately from solderable pad finish. Clarify the ambiguous resistance label rather than treating it as a test result.
Request the exact laminate grade, dielectric thickness, copper profile and RF coupon. A general Rogers listing does not identify the material used in this particular example.
Define Tg measurement/grade, finish chemistry, handling and cosmetic criteria. Confirm what no film means in the quotation, together with acceptance photographs and packing.
Specify the solderable surface finish, thickness and flatness for assembly. The chemical-gold caption does not by itself establish an ENIG process specification or test report.
The general custom menu lists Rogers and PTFE. The RF case itself says high-frequency material without identifying a grade. Request the exact laminate designation and dielectric/copper construction, plus the relevant test frequency and method. An impedance caption gives no numerical tolerance or proof of RF insertion loss.
The wording does not define whether 0.25 mm refers to a pad, opening, ball-related feature or another geometry. The page does not supply the package footprint or drawing. Send those definitions with your enquiry; this directory leaves trace/space and finished-hole values unknown for that sample.
For the Bluetooth example, the image explicitly pairs 0.5 mm and TG150 with a plugged-hole anti-oxidation board. Specify the laminate grade and Tg method, then clarify “no film” and acceptable scratches. A surface-finish term should not carry unstated storage life or assembly guarantees.
The website also describes shaped outlines, logo printing, vacuum packing, identification labels and cartons. Confirm rails, bevels, special packaging, shelf/storage requirements and traceability labels against your actual delivery specification.
The three equipment pages identify cutting, CCD inner-layer exposure, pressing, six-axis drilling, horizontal PTH and vertical continuous plating; then etching, dry-film application, Xinqi LDI, developing, Optima AOI and board brushing; finally CCD mask exposure, inkjet legend, nickel/gold plating, CNC profiling, automatic electrical testing and final optical inspection. The page headline says 15 processes, while its three screens display 18 equipment/process entries; do not use that headline as an audited route count.
LDI, AOI and electrical-test names are useful points for a quotation review. They do not provide machine availability, laser drilling capability or your order's yield. Request the inspection stage, actual netlist-linked electrical report, coupon data and any process subcontracting for the chosen construction.
The company page identifies 广德东风电子有限公司 as established in 2014, and its history names 吴江市东风电子有限公司 in 1989. Those are different named entities. The timeline's older UL and SMT milestones do not, by themselves, identify a current Guangde UL holder or prove that today's assembly order runs at this address.
The contact page names No. 749 Chang'an Road, Guangde Economic Development Zone, Anhui. It publishes gddfpcb@vip.163.com and +86 563 6070665. The main contact fax differs from the repeated footer fax; this profile does not select one as verified. The email is an official published 163 mailbox, not a domain mailbox; no control test or message was sent.
The company describes 40 mu of land, 50,000 m² building area and annual capacity of one million m² after two development phases. These undated manufacturer statements are not a current allocation of capacity to your order.
The original pictures below were read individually. Copies establish their printed wording and dates; current issuer status was not queried.
Individually researched 9 October 2026. Chinese and English corresponding original captions were read separately; sample parameters were not transferred across images. The English page currently exposes little visible text but embeds its captioned originals. Historic certificate copies and government context do not create an independent quality badge. No outgoing enquiry or mailbox-control test was made.
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