MANUFACTURER DOSSIER
梅州市格兰沃电子有限公司 · Guangdong
Grandwork Electronics · 梅州市格兰沃电子有限公司 describes PCB manufacturing established in 2005 in Meizhou's Dongsheng Industrial Park, Guangdong. Its catalogue is broader than an ordinary multilayer-board listing: large etched epoxy heaters sit alongside aluminium-base lighting circuits and FR-4 control boards.
Large-format epoxy sheets need a dimensioned heater design and an agreed thermal/electrical test.
02 / LIGHT AND HEATCompare LED constructions and the separate foldable aluminium route.
03 / CONTROL CIRCUITUse a specific FR-4 example rather than transferring a generic maximum into the quote.
This profile brings together 13 sourcing examples from 23 individually read product pages. Two heater side views and two bulb-board views are grouped with their companion, rather than displayed as duplicate products. The general process chart, equipment gallery and document dates have their own scope below.
The newer heating-board catalogue shows a green epoxy construction and large etched sheets. Its titles write 700–1450 mm and 665–1400 mm, but do not define whether those numbers describe a dimension pair, a range or a particular usable work area. Send the actual drawing before assuming a maximum finished outline.
Release a dimensioned drawing and insulation test voltage, duration and leakage threshold. Confirm usable etching size for this heater route rather than applying the general PCB process-size row.
Start with the heater drawing, cold/hot resistance and operating voltage, power density, temperature uniformity, lead attachment, mounting and isolation test. The photograph is not a heating-performance result.
Treat the two pages as side views of a catalogue construction, not two different performance ratings. Ask for copper/resistive pattern, terminals, mounting, permissible hot spots and the released outline.
The indoor and automotive LED examples provide distinct line/space pairs and finishes. Their thermal fields say “1.3W” and “2.0W”, while the tube and bulb pages explicitly use W/m·K. These are different levels of detail; the incomplete units are not silently normalised.
Specify the actual dielectric material and thermal conductivity with units and test basis, aluminium thickness, finished copper and finish requirements. The source’s 1.3W is not published here as W/m·K.
Define dielectric grade, isolation, current and thermal-rise requirements for the actual lamp. An automotive application label and a historical IATF copy do not by themselves approve the vehicle programme.
Supply the formed drawing and bend zones, forming responsibility and acceptance after forming. Do not assume dynamic-flex lifetime, standard FPC material or a bend radius from this photograph.
Distinguish aluminium-base thickness from total finished thickness. Specify laminate grade, dielectric thickness, thermal measurement and finished-board isolation acceptance at the required voltage.
The array and single-board pages publish the same family ranges. Agree panel outline, separation method, dielectric grade and acceptance conditions; a range is not the specification for every array position.
The tablet-board page explicitly identifies four layers and 0.10 / 0.08 mm line/space. Other pages give copper strings without an explicit layer count, or call out “0.2 mm BGA” without defining pitch, pad or hole. Those phrases are not converted into finished-hole minima.
Define BGA pitch, pad and escape geometry explicitly, together with the released stack and gold thickness. The 0.2 mm BGA wording is not a finished-hole diameter.
Resolve the title versus application wording and release castellated-edge details, plating, board edge datum and BGA geometry. The title is retained; no assembly or display performance is inferred.
The summary describes a single-sided, 1.6T, lead-free-HASL board with 0.25 / 0.30 mm line/space. Its detail table describes a four-layer, 1.0T, immersion-gold board with 0.15 / 0.15 mm line/space. Both remain visible below; contradictory layer and line/space fields are excluded from the capability filter.
Request the released radio-board revision, stack, thickness, finish and line/space. The summary and detail cannot both define the same order, so neither has been selected as the confirmed construction.
Release the actual layer count and stack rather than treating the copper string as an approved stack-up. Define BGA features, finished holes, outline and thickness for the selected design.
Clarify the finish designation, actual stack and internal-hole definition. Specify acceptance and traceability for the device; this application label does not establish ISO 13485 or medical-device certification.
The manufacturer also shows router, wearable, battery-control, LED-display, wireless-charging, remote-control and robot-vacuum boards, plus a thin foldable-board example. Those pages do not publish a usable construction specification. A populated-board photo does not establish an assembly-service scope; the thin-board title does not establish polyimide material or dynamic-flex performance.
These are individual manufacturer chart rows, not a released 20-layer, 6 oz, 0.06 mm board at the largest size. The heater titles, V-cut machine envelope and ambiguous process-size wording must be confirmed against the actual route. Minimum drilling diameter is not used as the directory's finished-hole filter.
The published process flow links engineering instructions and artwork to inner layers/AOI, lamination, drilling/plating, outer layers, mask, finish, profiling and electrical test. Its equipment list includes CNC drilling/routing, pressing, PTH and VCP lines, AOI, screen printing and finish lines. The undated equipment quantities are not quoted as today's available fleet.
For the selected construction, agree the material lot, stack revision, plating evidence, dimensional datum and which entity performs forming or any subcontracted step.
For a controlled-signal board, define coupon geometry, impedance target/tolerance and the lot-linked report. For plated contacts, agree finish thickness and measurement locations. The instruments shown establish published equipment descriptions, not your order's results.
The gallery names fixture electrical testing, flying probe and finished-hole inspection. Another testing sheet names ionic contamination, humidity/temperature, leakage and dimensional instruments. For heaters and metal-base boards, agree test voltage, duration, leakage and post-forming acceptance separately from bare-board continuity.
Request actual pass criteria, sampling and traceability to the supplied engineering revision. The introduction's yield and inspection claims are not converted into an audited rejection rate.
The contact page places the factory at Dongsheng Industrial Park AD8, No. 1 Development Road 5, Meizhou, Guangdong. It separately lists a Shenzhen operations contact at Villa C9H, TCL International E City, 1001 Zhongshanyuan Road, Xili, Nanshan. Do not treat the Shenzhen contact address as the Meizhou production plant.
Published contacts include +86-755-82712281 and newman@grandwork.net, with sales6@grandwork.net and sales1@grandwork.net also listed. These are transcribed official contacts; mailbox control has not been tested. PCBVerified's RFQ actions remain on this site.
The government-hosted Guangdong 2025 third-batch technology-based SME list names 梅州市格兰沃电子有限公司 at entry 304, page 13, number 2025441402A8014913. This is a dated entity/listing record, not PCB quality approval or a 2026 certification claim.
The company introduction gives over 30,000 m² of workshop and designed monthly capacity of 70,000 m²; the homepage gives over 50,000 m² and 100,000 m². Neither page supplies a reconciled current reporting date. These figures are not combined or used as available production capacity. The introduction's exterior illustration is a rendered building view, so it is not presented here as a factory photograph.
The manufacturer-hosted IATF 16949:2016 copy, NQA T89919 / IATF 0452979, covers circuit-board production, excludes product design and gives validity to 1 July 2025. The ISO 9001 and ISO 14001 copies 39122Q006009R1M / 39122E006002R1M give validity to 9 June 2025. All of those displayed validity dates have passed at this review.
The single-sided CQC copy CQC18134200586 names GLW-CEM1, 0.8–3.2 mm, and validity to 6 July 2025. The separate GLW-1 printed-board copy CQC12134071254, 0.38–3.2 mm, gives validity to 15 September 2026, also before this review. Product-scope limits from these copies are not applied to every catalogue board.
A hosted UL-directory snapshot names GRANDWORK ELECTRONICS CO LTD, E343783, with a last-updated date of 26 October 2018 and separate GLW board types. It is a historical copy; current UL registration and ownership are not established by this page. For a North American order, request a current issuer record for the relevant entity and board type.
The high-tech copy GR202144001632 is dated 20 December 2021 with a three-year validity. The SGS/Made-in-China plaque QIP-ASI1321527 records a 2013-10-18 audit for site existence and business operations, not universal PCB performance. Ask for renewed, applicable documents rather than using these historical copies as current badges.
Individually researched 9 October 2026: company/contact and process documentation, 23 original product pages and corresponding complete images, three equipment sheets, five production/test collages, eight dated qualification copies, and the complete government-hosted list with its matching page examined. Product contradictions and undefined units retain their original scope. No combined-limit approval, renewed certification or current available-capacity claim is inferred.
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