MANUFACTURER DOSSIER
东莞市科佳电路有限公司 · Guangdong
Dongguan Cojoin Circuits Co., Ltd. · 东莞市科佳电路有限公司 publishes rigid, flexible and rigid-flex PCB examples alongside packaging-substrate and sensor galleries. Its contact page places the business in Nanzha Fourth Industrial Area, Humen, Dongguan, Guangdong.
The company's history dates its establishment to June 2010 under the name Dongguan Kangzhuang Circuits, followed by a rename to Cojoin in April 2015. It records separate rigid and flexible business units from July 2021. These dates come from its own history; the Hong Kong company also mentioned there is a separate entity.
For a sourcing decision, three details matter more than a single “PCB capability” number: which plated surface meets the component, where the flex is allowed to move, and which operations and tests are included in the delivery. The examples below retain their own construction and finish parameters.
Cojoin's rigid-board catalogue differentiates immersion tin, electroplated nickel/gold and ENEPIG. The plated contacts and wire-bonding surfaces should be assessed against the mating component and assembly process, rather than grouped under “gold finish”.
Release connector holes, panel and mounting drawing, copper and the tin-finish acceptance. Automotive application wording alone is not programme qualification.
Specify the contact area, bevel geometry, mating-cycle requirement and impedance stack/target/tolerance. The source provides no numeric impedance tolerance.
Send the cavity dimensions, bond-pad geometry, bond process and pad acceptance. Clarify whether the delivery includes bonding or only a board intended for bonding.
The individual pages publish minimum hole diameters, but do not define whether they are drill diameters or finished plated holes. Their literal values are retained above; they are not entered as confirmed finished-hole limits in the directory filter. The optoelectronic example states impedance control without a numeric tolerance. Supply the actual stack, target, tolerance and coupon for engineering review.
The exhaust-sensor page writes “Cavity” in its special-material field and “金线banding” in its process field. Cavity is a structural feature, not a laminate brand. Confirm cavity geometry, bond-pad acceptance and whether wire bonding is a supplied operation or an intended downstream application.
Release flex laminate, copper, coverlay openings, installed bend and cycle-life criteria. The fine-line figure belongs to this two-layer example.
Define the antenna/circuit drawing, tuning and assembly interfaces, ink wear acceptance and salt-spray duration/criteria. No read range or RF performance is published.
The dense annular circuit is the finer-line example in this selection: 0.075/0.075 mm. That is a parameter of this two-layer product, not an across-the-board promise for an eight-layer rigid-flex construction. Both FPC pages omit the laminate grade, copper, thickness, minimum bend radius and cycle-life acceptance; send these explicitly.
The industrial conversion board, camera-module board and medical magnifier control board have different flex structures and surfaces. Treat each as a separate design route. A medical application name does not establish an ISO 13485 certification or a medical-device approval.
Define rigid/flex zones, cut-out dimensions, PI stiffener and adhesive, coverlay and the assembled bend. Ask for the actual section drawing.
Specify shielding-film grounding, conductive-adhesive contact, flex transitions and bond-pad acceptance. Confirm board-only versus bonding/assembly scope.
Release the full zone-by-zone stack, via map, coverlay, bend and test plan. The medical application name is not a device approval or ISO 13485 claim.
Provide a section drawing for each rigid and flex zone, copper distribution, coverlay openings, transition geometry, stiffener material and adhesive. For movement, state the assembled bend and whether it is static or repetitive. For the camera example, define shielding-film grounding and conductive-adhesive interfaces. For the eight-layer example, the published “2 FPCB + 6 PCB” description still needs an actual stack and via map.
The source gives no numeric impedance tolerance or bend-cycle qualification for these examples. Request a construction-specific assessment; do not combine the annular FPC's fine-line figure with the medical board's layer count.
These two pages supply original images but no layer count, pitch, substrate grade, copper, warpage limit or delivery format. Submit die/package drawings, pad and bond-area requirements, substrate construction, finish thickness, panel map and assembly-temperature profile. Ask for the proposed process window and its measurement plan before shortlisting a numeric capability.
Keep substrate fabrication, die attachment, bonding and encapsulation as separate responsibilities. The gallery alone does not establish that Cojoin supplies a complete packaged semiconductor.
The manufacturer's equipment gallery labels direct laser imaging, semi-automatic DI exposure, drilling, copper/tin plating, electroless copper, VCP plating, OSP, automatic electrical testing, AVI visual inspection and automatic measurement. These are source-labelled equipment photographs; they do not establish machine ownership, current utilisation or a site-audit result.
The quality page describes APQP, PPAP, SPC, MSA and FMEA, customer criteria alongside IPC Class 2, and 100% open/short and visual inspection. It also names Cu/Ni/Au thickness checks, solderability, dimensions and microsection inspection. These are manufacturer-reported practices, not independently observed batch results.
Agree netlist revision, electrical-test coverage and report format; plated thickness locations and sampling; microsection coupons and acceptance; and the final visual class. The site's Class 2 wording is not a Class 3 commitment. Reliability tests listed include thermal stress/shock, ionic contamination, salt spray and humidity; select conditions and reports for the actual construction.
The official contact page publishes sales@cojoin.com.cn. Andy Lan is named for the global market, and the support page uses andy.lan@cojoin.com.cn for technical support. Mailbox publication was checked; mailbox control was not tested. Continue the enquiry within PCBVerified through the relevant shortlist action.
Prepare the Cojoin engineering brief →The manufacturer-hosted copy identifies Dongguan Cojoin Circuits Co., Ltd., No. 14-1 First Street, Xinxing Road, Nanzha, Humen. It shows IECQ-H SGSCN 22.0056, issue 3, issued 9 September 2025 and expiring 8 September 2028, for manufacture of rigid, flexible and rigid-flexible PCBs.
The image specifies QC 080000:2017; the webpage title says “QC080000:2025”. The certificate's own wording is retained. Its printed “Current” status is a statement on that copy; live IECQ register status was not established in this review. This is hazardous-substance process management, not proof that a particular lot passed your material test.
The ISO 14001 copy CN12/30098 runs to 10 January 2024. The ISO 9001 copy CN13/30582 runs to 31 May 2024. The IATF copy identifies IATF 0402774 / SGS CN13/30581 and also runs to 31 May 2024, excluding product design clause 8.3.
Those published copies are historical at this review date. They have not been presented as current badges; request renewed documents with the supplying site's scope before an automotive or other controlled programme.
The original national standards record provides independent context for the legal name and drafting role. The product values, equipment photographs and qualification copies above remain attributed to the manufacturer. No UL holder or batch-level material-traceability record was established.
Individually reviewed 9 October 2026. Eleven original product pages and photographs, the equipment gallery, seven process diagrams, qualification copies and the national standards record were read. Eight numeric board examples remain distinct; packaging and sensor pages have no invented specifications. Minimum-hole entries are not confirmed finished-hole values. Printed certificate dates and the IECQ title/version discrepancy are preserved.
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