What this manufacturer makes
Chengyi Electronics (Jiaxing), trading through the Chanyee website, was established in 2004 and manufactures high-density rigid printed circuit boards in Jiaxing, Zhejiang. Its catalogue includes multilayer boards, HDI, embedded-copper constructions, rigid-flex designs and high-frequency applications. The product pages distinguish embedded copper for thermal management from high-frequency radar boards, giving different layer ranges for those families. Buyers should choose a product-specific construction rather than assume the same material or layer capability across the catalogue. The site identifies small- and large-batch manufacturing; the required quantity, stack-up and laminate grade should be agreed for the individual order.
Official company source reviewed- Manufacturing focus
- High-density rigid PCB manufacturing · Embedded-copper thermal-management boards · HDI and millimeter-wave radar boards
- Published footprint
- No. 972 Gangshan Road, Xiuzhou District, Jiaxing, Zhejiang, China.
Products & manufacturing capabilities
Manufacturer reportedEmbedded-copper PCB
This construction places a copper block inside the PCB substrate to provide a thermal path for heat-producing components. Chengyi’s product page specifies a 2–8-layer offering in small and large batches. The embedded block geometry and its interface with the board stack-up need to be defined in the fabrication drawing. The source lists communications, computing, automotive and energy-storage applications, without publishing a measured thermal resistance or a universal copper-block thickness.
These are supplier-published capabilities for this product family; confirm the quoted construction and manufacturing site.
- Layer count
- 2–8 layers
- Line / space
- —
- Finished hole
- —
- Impedance
- —
| Layer range | 2–8 layers |
|---|---|
| Thermal construction | Copper blocks embedded inside the PCB substrate |
| Batch scope | Small and large batches |
| Listed applications | 5G communications, high-performance computing, automotive electronics, industrial control and energy storage |
| Technical source | chanyee.com · Manufacturer specification |
Published limits may refer to different constructions. Confirm the complete stack-up with the factory. A dash means no value was published.
Millimeter-wave radar PCB
Chengyi lists millimeter-wave radar boards in 6–8-layer constructions for small and large batches. The product description names PTFE high-frequency substrates and low-loss copper-clad laminates from Rogers and Panasonic. These brand names are material options in the supplier catalogue, not evidence of a particular purchased batch or a approved grade for every design. Specify the laminate grade, dielectric requirements, copper profile and RF acceptance tests when requesting a quotation.
These are supplier-published capabilities for this product family; confirm the quoted construction and manufacturing site.
- Layer count
- 6–8 layers
- Line / space
- —
- Finished hole
- —
- Impedance
- —
| Layer range | 6–8 layers |
|---|---|
| Substrate description | PTFE high-frequency substrate |
| CCL brands named | Rogers and Panasonic; exact grade is project-specific |
| Batch scope | Small and large batches |
| Listed applications | Automotive radar, security, industrial testing and road traffic |
| Technical source | chanyee.com · Manufacturer specification |
Published limits may refer to different constructions. Confirm the complete stack-up with the factory. A dash means no value was published.
HDI PCB
The HDI product family uses micro blind and buried vias to create denser interconnections in multilayer circuit boards. Chengyi describes lamination and drilling processes for this family and offers small and large batches. Its product page lists AI, automotive, communications and medical applications, but does not state a numeric layer ceiling, minimum trace width or microvia diameter. Those dimensions must come from the current fabrication specification and should not be inferred from the radar or embedded-copper product ranges.
These are supplier-published capabilities for this product family; confirm the quoted construction and manufacturing site.
- Layer count
- —
- Line / space
- —
- Finished hole
- —
- Impedance
- —
| Interconnect technology | Micro blind and buried vias |
|---|---|
| Process description | Multilayer lamination and drilling |
| Batch scope | Small and large batches |
| Listed applications | AI, automotive, communications, consumer electronics, medical equipment and high-performance computing |
| Technical source | chanyee.com · Manufacturer specification |
Published limits may refer to different constructions. Confirm the complete stack-up with the factory. A dash means no value was published.
Sources & review record.
Reviewed 2026-09-28. Manufacturer pages can change; confirm the current revision when requesting a quotation.
- Company introduction and contacthttps://www.chanyee.com/about-us/Source checked 2026-09-28Official website
- Published product cataloguehttps://www.chanyee.com/products/Source checked 2026-09-28Official website
- Embedded-copper PCB specificationshttps://www.chanyee.com/product/buried-copper-pcb/Source checked 2026-09-28Official website
- Millimeter-wave radar PCB specificationshttps://www.chanyee.com/product/millimeter-wave-radar-board/Source checked 2026-09-28Official website
- HDI PCB specificationshttps://www.chanyee.com/product/hdi/Source checked 2026-09-28Official website
Make the first technical conversation useful.
Which stack-up, laminate grade, copper weight and acceptance tests are included in the quotation?
Attach the manufacturing brief
Layer stack-up, finished dimensions, copper weights, laminate grade, quantity and delivery destination.
Define acceptance
Finished-hole tolerance, impedance targets, coupon requirements, surface finish and permitted process substitutions.
Confirm the recipient
Agree the manufacturing legal entity, confidentiality terms and approved site before sharing production files.