MANUFACTURER DOSSIER
欣强电子（清远）股份有限公司 · Guangdong
Brain Power is the English name used by 欣强电子（清远）股份有限公司, a Qingyuan PCB manufacturer whose website focuses on storage, high-density interconnect and rigid-flex circuits. The issuer’s June 2025 filing dates the legal company to 9 August 2005 and its conversion to a joint-stock company to 29 May 2024. Its official contact address is Area D, Jiafu Industrial Zone, Yinzhan Industrial Park, Qingyuan, Guangdong.
The useful distinction here is between an application-specific fabrication route and a general process limit. The catalogue photos below come from their corresponding manufacturer pages. Technical disclosures come from the dated issuer filing; they are not measurements of those photographed panels or a promise that every limit can be delivered together.
The filing describes DDR4 and DDR5 memory-board production and storage as a major business application. It identifies board-thickness control of ±5% and dedicated X-ray target drilling, VCP plating and automated AOI in its memory-board process discussion. These are issuer-reported process disclosures, not an independent inspection of the pictured board.
Name the module format and connector drawing. Define finished thickness at the contact region, bevel and edge position, pad geometry, nickel and hard-gold requirements, and the inspection datum. A relative thickness tolerance is not a substitute for the connector’s permitted absolute range. Specify where the measurement is taken and whether surface finish is included.
Provide the actual copper and dielectric stack, impedance groups, reference planes and test coupons. Approve laminate grades and allowed substitutions against the required electrical result. A DDR family name alone does not establish channel speed, signal integrity or a completed module’s compatibility with a processor platform.
The filing also discusses eight-layer-and-above SSD boards with cross-layer blind vias and LDI registration. That is a different interconnect and connector release. Do not transfer memory-contact tolerances to an SSD layout without a drawing. Request the blind-via targets and reliability coupon for that construction; the website’s SSD category currently provides no individual board specification.
For repeat supply, keep the approved stack, contact plating schedule and finished-outline drawing under one revision. Ask for first-article thickness and contact measurements, electrical-test records and a change-notification rule. Establish whether the purchase is bare PCB fabrication or includes component assembly; the catalogue does not establish supply of populated memory modules.
The issuer reports batch supply of 800G and 1.6T optical-module PCBs during 2024. For the 1.6T route it states 1.8/1.8 mil line/space, ±3% impedance and 3 mil blind holes. Its separate process table describes ±5% impedance, with ±3% for some products. Keep the more demanding figure attached to the named route and approved design.
Send the material stack and copper profile, reference planes, impedance definitions, back-drill or blind-via structure, connector/contact geometry and allowed substitutions. The filing uses M7/M8/M9 material classes; these are not an exact supplier product grade or lot traceability record. Ask for the actual laminate and bonding-sheet names in the quote, with frequency-specific properties relevant to the design.
The process disclosure names VCP plating, vacuum etching, optical routing and flying-probe impedance measurement. Request the agreed coupon and measurement method, reference planes, sampling plan and records delivered with the lot. A measurement machine’s stated accuracy is different from the board’s allowed impedance tolerance. Likewise, a laminate Df value cannot alone establish the completed channel’s insertion loss.
Agree which features are inspected before and after contact plating and mechanical routing. For a design transfer, compare the first article with the released drawing and electrical coupon before increasing the order. A PCB fabricated for a high-rate optical application is not a complete transceiver performance certificate.
The filing’s explicit production ceiling.
The separate sample ceiling in the same disclosure.
The filing separately states a 0.050 mm minimum laser-drill diameter and 0.1 mm mechanical-drill diameter for HDI. Its technical discussion gives 45/45 µm line/space, while mSAP substrate-like PCB development is described separately at 20/20 µm. The finer developmental figure must not replace the HDI production rule, and drill diameter must not be relabelled as a finished plated hole.
Provide the layer sequence, dielectric and copper schedule, microvia target lands, stacked or staggered connections, fill and cap requirements, and any cross-layer connections. Ask which lamination sequence applies to the proposed construction and which qualification coupon represents it. Make the accepted manufacturing drawing show the exact via structures; a marketing label cannot define the reliability requirement.
For prototype-to-volume transfer, identify any change in laminate, copper, drilling or lamination route before ordering. Ask which dimensions the sample demonstrates and which are approved for recurring production. Separate dimensional microsections, electrical continuity and the agreed interconnect stress test. A small sample’s appearance does not establish repeatable process capability for a large production panel.
The current website gives the Qingyuan Jiafu/Yinzhan address. Its introduction mentions a new Thailand base; the June 2025 filing describes the Thailand subsidiary as a future PCB production business. This profile does not treat that dated plan as proof of a commissioned plant today. Obtain the proposed fabrication and shipment address on the order, together with the site’s applicable qualification records.
The same filing identifies Hong Kong, Taiwan and Shenzhen sales functions and Suzhou after-sales service. These functions do not make each address an additional PCB manufacturing plant. Confirm which legal entity invoices the buyer and which site executes the released fabrication route.
The website’s SGS copies name the Qingyuan joint-stock company: ISO 9001 CN15/30229 and IATF 16949 CN13/31554, with expiry 2 January 2027. The IATF scope is PCB manufacture excluding product design. The Intertek ISO 13485 copy 0109794 covers PCB manufacture for medical-device use and shows expiry 24 January 2027. CTI ISO 14001 and ISO 45001 copies show expiry 23 July 2029.
A manufacturer-hosted UL Product iQ copy names Brain Power (Qingyuan) and file E186014 at the Jiafu/Yinzhan address. Its construction table is not a blanket approval of all layer stacks, materials or finishes. Confirm the current issuer record and the exact construction proposed for the order. The copies were read; current issuer status has not been independently confirmed.
Attach one fabrication revision and a list of critical characteristics: contact thickness and finish for memory, channel coupon and loss acceptance for optical boards, or via microsection and stress acceptance for HDI. Specify material-lot traceability and the record retained if a substitution is proposed. Request the current equipment/process assignment where a particular laser, plating or metrology route is essential.
Before volume release, resolve the engineering questions against the same drawing, manufacturing site and sample records. Record the agreed response rather than relying on a global maximum-layer figure. This is how a shortlist becomes an executable procurement decision.
Reviewed 8 October 2026. Catalogue originals, certificate copies and dated issuer disclosures are identified separately. The filing is an IPO draft, not evidence of a completed listing or an independent factory audit.
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